Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion

US9825387B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9825387-B2
Application numberUS-201615084726-A
CountryUS
Kind codeB2
Filing dateMar 30, 2016
Priority dateMar 30, 2016
Publication dateNov 21, 2017
Grant dateNov 21, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

First claim

Opening claim text (preview).

What is claimed is: 1. A cable retention assembly comprising: an electrical interface configured to receive a substrate diving board and electrically couple the substrate diving board with a conductor of a cable bundle, and a retention mechanism body coupled to the electrical interface, the retention mechanism body comprising: a bolster plate receiving groove to receive a protrusion on a bolster plate, and a bolster plate receiving indentation to receive the bolster plate protrusion. 2. The cable retention assembly of claim 1 , wherein the bolster plate receiving indentation comprises a circular indentation to receive a circular protrusion on the bolster plate. 3. The cable retention assembly of claim 1 , wherein the retention mechanism body comprises a magnetic element to magnetically couple the bolster plate protrusion to the retention mechanism body. 4. The cable retention assembly of claim 3 , wherein the retention mechanism body comprises a backwall that comprises a slot configured to receive a ferromagnetic rod, the slot defining a cavity between the magnetic element and the bolster plate receiving indentation. 5. The cable retention assembly of claim 1 , wherein the bolster plate protrusion comprises a spring loaded ball bearing. 6. A computing system comprising: a central processing unit (CPU) residing on a substrate, the substrate comprising a diving board comprising contacts coupled to the CPU; a bolster plate mechanically connected the substrate, the bolster plate comprising a connector receiving element comprising a protrusion; and a cable retention assembly comprising: an electrical interface configured to receive the edge connector and electrically couple the edge connector to a wiring connector assembly, and a retention mechanism body coupled to the electrical interface, the retention mechanism body comprising: a bolster plate receiving groove to receive a protrusion on a bolster plate, and a bolster plate receiving indentation to receive the bolster plate protrusion. 7. The computing system of claim 6 , wherein the bolster plate receiving indentation comprises a circular indentation to receive a circular protrusion on the bolster plate. 8. The computing system of claim 6 , wherein the retention mechanism body comprises a magnetic element to magnetically couple the bolster plate protrusion to the retention mechanism body. 9. The computing system of claim 8 , wherein the retention mechanism body comprises a backwall that comprises a slot configured to receive a ferromagnetic rod, the slot defining a cavity between the magnetic element and the bolster plate receiving indentation. 10. The computing system of claim 6 , wherein the bolster plate protrusion comprises a spring loaded ball bearing. 11. A linear edge connector comprising: a printed circuit board comprising an electrical connection diving board; a bolster plate mechanically connected to the printed circuit board, the bolster plate comprising a connector receiving element comprising a protrusion; and a cable retention assembly comprising: an electrical interface configured to receive the edge connector and electrically couple the edge connector to a wiring connector assembly, and a retention mechanism body coupled to the electrical interface, the retention mechanism body comprising: a bolster plate receiving groove to receive a protrusion on a bolster plate, and a bolster plate receiving indentation to receive the bolster plate protrusion. 12. The linear edge connector of claim 11 , wherein the bolster plate receiving indentation comprises a circular indentation to receive a circular protrusion on the bolster plate. 13. The linear edge connector of claim 11 , wherein the retention mechanism body comprises a magnetic element to magnetically couple the bolster plate protrusion to the retention mechanism body. 14. The linear edge connector of claim 13 , wherein the retention mechanism body comprises a backwall that comprises a slot configured to receive a ferromagnetic rod, the slot defining a cavity between the magnetic element and the bolster plate receiving indentation. 15. The linear edge connector of claim 11 , wherein the bolster plate protrusion comprises a spring loaded ball bearing. 16. The linear edge connector of claim 11 , further comprising a package heatsink loading mechanism coupled to the bolster plate. 17. The linear edge connector of claim 16 , further comprising a heatsink coupled to the package heatsink loading mechanism.

Assignees

Inventors

Classifications

  • Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title

  • integral with the coupling device · CPC title

  • H01R12/75Primary

    connecting to cables except for flat or ribbon cables · CPC title

  • Additional means for holding or locking coupling parts together, after engagement, {e.g. separate keylock, retainer strap} · CPC title

  • Apparatus or processes for manufacturing printed circuits · CPC title

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Frequently asked questions

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What does patent US9825387B2 cover?
Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the lin…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H01R12/75. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).