Method for processing silicon-based wire optical waveguide
US-2016047979-A1 · Feb 18, 2016 · US
US9823498B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9823498-B2 |
| Application number | US-201414908228-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 16, 2014 |
| Priority date | Jul 30, 2013 |
| Publication date | Nov 21, 2017 |
| Grant date | Nov 21, 2017 |
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A device comprising a metal layer on a crystalline silicon substrate, and a waveguide that has a refractive index greater than that of the crystalline silicon, wherein the waveguide is arranged to couple light to a surface plasmon mode at an interface between the silicon substrate and the metal layer when a waveguide mode is phase matched to the surface plasmon mode.
Opening claim text (preview).
The invention claimed is: 1. An electro-optic device, comprising: a metal layer on a crystalline silicon substrate; a waveguide that has a refractive index greater than that of the crystalline silicon substrate, wherein the waveguide is arranged to couple light to a surface plasmon mode at an interface between the crystalline silicon substrate and the metal layer when a waveguide mode is phase matched to the surface plasmon mode; and a modulator for modulating the refractive index of the crystalline silicon substrate to change a phase matching condition between the surface plasmon mode and the waveguide mode to modulate light carried by the waveguide. 2. The electro-optic device as claimed in claim 1 , further comprising a dielectric layer between the metal layer and the waveguide. 3. The electro-optic device as claimed in claim 2 , wherein the modulator is operable to accumulate or deplete the carrier density in the crystalline silicon substrate. 4. The electro-optic device as claimed in claim 2 , wherein the modulator comprises an electrical device formed in or on the crystalline silicon substrate. 5. The electro-optic device as claimed in claim 4 , wherein the electrical device comprises a pin junction. 6. The electro-optic device as claimed in claim 4 , wherein the electrical device comprises a Schottky junction at the metal-silicon substrate interface. 7. The electro-optic device as claimed in claim 1 , wherein a thin oxide layer is provided between the crystalline silicon substrate and the metal. 8. The electro-optic device as claimed in claim 1 , wherein the waveguide comprises amorphous silicon or Silicon Germanium or Germanium. 9. The electro-optic device as claimed in claim 1 , wherein the waveguide is created by ion-implantation. 10. The electro-optic device as claimed in claim 1 , wherein the waveguide is an amorphous silicon waveguide created by ion-implantation. 11. An electrical circuit comprising at least one optical interconnect that includes at least one electro-optic device as claimed in claim 1 .
Physics · mapped topic
single crystal Si · CPC title
plasmon · CPC title
in an optical waveguide structure (G02F1/017, {G02F1/2257} take precedence) · CPC title
using free carrier absorption · CPC title
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