Diamond nitrogen vacancy sensor with circuitry on diamond

Patent metadata

Field	Value
Publication number	US-9823313-B2
Application number	US-201615003634-A
Country	US
Kind code	B2
Filing date	Jan 21, 2016
Priority date	Jan 21, 2016
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A magnetic sensor assembly includes a base substrate and a material assembly. The material assembly is formed on the base substrate. The material assembly includes an assembly substrate. A magneto-optical defect center material having a plurality of magneto-optical defect centers is formed on the assembly substrate. A radio frequency (RF) excitation source is formed on the magneto-optical defect center material.

First claim

What is claimed is:

1. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and
a radio frequency (RF) excitation source formed on the NV diamond material, wherein the RF excitation source has a spiral shape.

2. The magnetic sensor assembly of claim 1 , wherein the RF excitation source comprises a first RF excitation source on a first side of the NV diamond material, and a second RF excitation source on a second side of the NV diamond material opposite to the first side.

3. The magnetic sensor assembly of claim 1 , wherein RF excitation source is formed on a first side of the NV diamond material, and a size of the RF excitation source in a plane of the first side is greater than a size of the first side of the NV diamond material.

4. The magnetic sensor assembly of claim 1 , further comprising:
one or more optical detectors formed in a detector region in a plane on the assembly substrate, wherein a size of the RF excitation source in the plane is greater than a size of the detector region.

5. The magnetic sensor assembly of claim 4 , wherein the RF excitation source is formed on a first side the NV diamond material, and a size of the RF excitation source in a plane of the first side is greater than a size of the first side of the NV diamond material.

6. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and
a radio frequency (RF) excitation source formed on the NV diamond material.

7. The magnetic sensor assembly of claim 6 , wherein the RF excitation source is in the form of a coil.

8. The magnetic sensor assembly of claim 6 , wherein the RF excitation source comprises:
a seed layer formed on a surface of the NV diamond material; and
a film metallization layer formed on the seed layer.

9. The magnetic assembly of claim 6 , wherein the film metallization layer is formed of copper.

10. The magnetic sensor assembly of claim 6 , where the diamond assembly further comprises an RF connector connected to the excitation source, the RF connector configured to connect to a power source and a controller.

11. The magnetic sensor assembly of claim 6 , wherein the base substrate comprises a printed circuit board (PCB).

12. A magnetic sensor assembly, comprising:
a base substrate; and
a material assembly, formed on the base substrate, and comprising:
an assembly substrate;
magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate; and
a radio frequency (RF) excitation source formed on the magneto-optical defect center material.

13. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and
an electromagnetic excitation source formed on the NV diamond material or on the assembly substrate; and
power/logic circuits formed on the base substrate and electrically connected to the electromagnetic excitation source to provide control of the electromagnetic excitation source.

14. The magnetic sensor assembly of claim 13 , wherein the electromagnetic excitation source is an optical excitation source.

15. The magnetic sensor assembly of claim 13 , wherein the base substrate comprises a printed circuit board (PCB).

16. The magnetic sensor assembly of claim 13 , further comprising a power/logic connector electrically connected to the power/logic circuits and comprising a plurality of connectors configured to connect to an external power source and controller.

17. The magnetic sensor assembly of claim 13 , wherein at least some of the power/logic circuits are mounted on a same top surface of the base substrate that the diamond assembly is mounted on.

18. The magnetic sensor assembly of claim 13 , wherein at least some of the power/logic circuits are mounted on a bottom surface of the base substrate opposite to a surface of the base substrate that the diamond assembly is mounted on.

19. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and
an optical excitation source formed on the NV diamond material.

20. The magnetic sensor assembly of claim 19 , wherein the optical excitation source is one of a laser diode or a light emitting diode.

21. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and
an optical detector formed on the assembly substrate.

22. The magnetic sensor assembly of claim 21 , wherein the optical detector is a photodiode.

23. The magnetic sensor assembly of claim 21 , wherein the base substrate comprises a printed circuit board (PCB).

24. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate;
an optical excitation source formed on the assembly substrate; and
an optical detector formed on the assembly substrate.

25. The magnetic sensor assembly of claim 24 , wherein the optical detector is a photodiode.

26. The magnetic sensor assembly of claim 24 , wherein the optical excitation source is one of a laser diode or a light emitting diode.

27. A magnetic sensor assembly, comprising:
a base substrate; and
a material assembly, formed on the base substrate, and comprising:
an assembly substrate;
magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate;
an optical excitation source formed on the assembly substrate; and
an optical detector formed on the assembly substrate.

28. A magnetic sensor assembly, comprising:
a base substrate; and
a diamond assembly, formed on the base substrate, and comprising:
an assembly substrate;
nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate;
a plurality of optical excitation sources formed on the assembly substrate; and
a plurality of optical detectors formed on the assembly substrate.

29. The magnetic sensor assembly of claim 28 , wherein the optical excitation sources and the optical detectors are arranged in an alternating fashion on the assembly substrate.

30. The magnetic sensor assembly of claim 29 , wherein the optical excitation sources and the optical detectors are arranged in a checkerboard fashion.

31. The magne

Assignees

• Lockheed Corp

Inventors

• Hahn Joseph W
• Huynh Duc
• Lew Wilbur

Classifications

• G01R33/032 Primary

  using magneto-optic devices, e.g. Faraday {or Cotton-Mouton effect} · CPC title

• G01R33/60

  using electron paramagnetic resonance (G01R33/24, G01R33/62 take precedence) · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title