Polyamide acid and resin composition containing same

Patent metadata

Field	Value
Publication number	US-9822281-B2
Application number	US-201615225569-A
Country	US
Kind code	B2
Filing date	Aug 1, 2016
Priority date	Mar 29, 2012
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1):

wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

First claim

The invention claimed is:

1. A production method for polyimide film comprising:
I) a step of producing resin film containing polyamic acid from a resin composition comprising:
(a) polyamic acid comprising a structure as represented by chemical formula (1) given below:

wherein δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms; and
(b) a solvent; and

II) a step of imidizing the polyamic acid,
wherein during imidization of the polyamic acid chemical formula (1) is converted in part into an isocyanate by heating.

2. The production method of claim 1 , further comprising a step of drying under a reduced pressure the produced resin film before imidizing the polyamic acid.

3. The production method of claim 1 , wherein the structure of the polyamic acid is represented by chemical formula (2) or (3) given below:

wherein U and X represent a tetravalent tetracarboxylic acid residue containing 2 or more carbon atoms, V represents a tri- or higher-valent multivalent amine residue containing 2 or more carbon atoms, Y represents a divalent diamine residue containing 2 or more carbon atoms, Z represents a structure represented by chemical formula (1) given above, k, m, and n each represent a positive integer, and R 1 to R 4 represent independently a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkyl silyl group containing 1 to 10 carbon atoms, and
wherein W in chemical formula (1) is represented by any one of chemical formulae (4) to (11);

wherein R 21 to R 28 are independently a hydrocarbon group containing 1 to 10 carbon atoms; or an organic group containing 1 to 10 carbon atoms, wherein said organic group comprises hydrogen and carbon atoms, as well as 1 to 10 other atoms of elements selected from the group consisting of boron, oxygen, sulfur, nitrogen, phosphorus, silicon, and halogens.

4. The production method as described in claim 1 , wherein the structure represented by chemical formula (1) is represented by any one of chemical formulae (12) to (14):

Assignees

• Toray Industries

Inventors

• Miyazaki Daichi
• Tomikawa Masao

Classifications

• C08G2150/00

  Compositions for coatings · CPC title

• C08G73/1067

  Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

• C09D179/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G69/44

  Polyester-amides · CPC title

• C08G73/1082

  wholly aromatic in the tetracarboxylic moiety · CPC title