Jointed body, method for manufacturing same and jointed member

Patent metadata

Field	Value
Publication number	US-9821406-B2
Application number	US-201314370931-A
Country	US
Kind code	B2
Filing date	Mar 1, 2013
Priority date	Mar 23, 2012
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A jointed body that has been solid-phase jointed at normal temperature and that has a non-conventional structure is presented. The jointed body is formed by solid-phase joining a first jointed member to a second jointed member, and has a junction interface between the first member and the second member. This jointed body includes an average crystal grain size in a near interface structure that constitutes a near interface area having a total width of 20 micrometers and extending at both sides of the junction interface as a center is 75-100% of an average crystal grain size in an around interface structure that constitutes around interface areas located at both outer sides of the near interface area. In the jointed body, the near interface structure after the joining is almost the same as the structure before the joining, allowing the jointed body to exert similar characteristics to the jointed members.

First claim

The invention claimed is:

1. A jointed body formed by solid-phase joining a first member to a second member, the jointed body having a junction interface between the first member and the second member, wherein
an average crystal grain size in a near interface structure that constitutes a near interface area having a total width of 20 micrometers and extending at both sides of the junction interface as a center is 75-100% of an average crystal grain size in an around interface structure that constitutes around interface areas located at both outer sides of the near interface area,
the around interface area is located approximate to the near interface area, and
the junction interface is excluded from the width of the near interface area.

2. The jointed body as recited in claim 1 , wherein an interface structure that constitutes the junction interface includes at least an amorphous oxide phase.

3. The jointed body as recited in claim 1 , wherein each of the near interface structure and the around interface structure comprises a metal structure.

4. The jointed body as recited in claim 3 , wherein the metal structure comprises pure aluminum (Al) or aluminum alloy.

5. The jointed body as recited in claim 1 , wherein the first or second member has a joining surface that has
a microasperity shape such that a surface roughness is 0.2 micrometers or less as a maximum height (Rmax) and an actual surface area (S 0 ) is larger by 15% or more than a reference surface area (St) calculated from external dimensions.

6. The jointed body as recited in claim 5 , wherein the joining surface is such that the surface roughness is 0.02 micrometers or less as a center line average roughness (Ra).

7. A method for manufacturing the jointed body as recited in claim 1 , the method comprising a joining step that obtains the jointed body by solid-phase joining the first member to the second member, wherein
at least one of the first member and the second member comprises a joining surface that has a microasperity shape such that a surface roughness is 0.2 micrometers or less as a maximum height (Rmax) and an actual surface area (S 0 ) is larger by 15% or more than a reference surface area (St) calculated from external dimensions, and
the joining step is a normal temperature joining step that joints the first member to the second member via the joining surface in normal temperature air.

8. The method for manufacturing the jointed body as recited in claim 7 , the normal temperature joining step is a step that applies a vibration to the first member and the second member which are pressurized via the joining surface.

9. The jointed body as recited in claim 1 , wherein the thickness of a joining layer is smaller than the crystal grain size of the near interface area and the around interface areas.

Assignees

• Toyota Chuo Kenkyusho Kk

Inventors

• Oshima Tadashi
• Takao Hisaaki
• Ito Hirofumi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W80/335

  Ultrasonic bonding · CPC title

• H10W72/07333

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07233

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/931

  Shapes of bond pads · CPC title