Method for producing a pin for a feedthrough of an electromedical implant and a feedthrough

Patent metadata

Field	Value
Publication number	US-9821395-B2
Application number	US-201514741597-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jul 7, 2014
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A method for producing a pin for a feedthrough for an electromedical implant. A pin is produced using the following method steps: creating a foil-, sheet- or strip-shaped semi-finished product by joining at least one first layer element including an electrically conducting, preferably biocompatible, material in foil, sheet or strip form and at least one second layer element including a solder and/or an easily soft-solderable material, preferably in wire, sheet or strip form, or by applying the at least one second layer element onto the at least one first layer element; and at least partially detaching a pin, or a set of multiple pins connected to a connecting web 46 , from the semi-finished product. A method is also provided for producing a feedthrough and an electromedical implant and to a pin, a feedthrough or an implant produced in the corresponding manner.

First claim

We claim:

1. A method for producing a pin, or a set of multiple pins for a feedthrough for an electromedical implant, the method comprising the following steps:
creating a sheet- or strip-shaped semi-finished product by joining at least one first layer element comprising an electrically conducting and biocompatible material in sheet or strip form and at least one second layer element comprising an easily soft-solderable material in sheet or strip form;
applying at least one solder inhibitor layer element in sheet or strip form to the semi-finished product and optionally joining the at least one solder inhibitor layer element thereto; and
at least partially detaching a pin, or a set of multiple pins connected to a connecting web, from the semi-finished product.

2. The method according to claim 1 , wherein the at least one solder inhibitor layer element in sheet or strip form is joined to the semi-finished product.

3. The method according to claim 1 , wherein the semi-finished product additionally comprises at least one third layer element including an insulator or a ductile metal, which is joined with the at least one first layer element.

4. The method according to claim 1 , wherein a top coat is applied to the semi-finished product by way of an electroplating bath, prior to the at least partial detachment of the pin, or of the set of multiple pins, from the semi-finished product.

5. The method according to claim 4 , wherein the top coat is applied to at least a portion of the at least one second layer element.

6. The method according to claim 1 , wherein the pin, or at least one pin of the set of multiple pins, is formed prior to or after being at least partially detached from the semi-finished product in such a way that the at least one second layer at least partially surrounds the pin.

7. The method according to claim 6 , wherein the pin, or each pin of the set of multiple pins, is formed after the at least partial detachment in such a way that at least one circumferential protrusion is created, the protrusion being located in each case on the side surface of the particular pin.

8. The method according to claim 3 , wherein the at least partial detachment takes place in a direction that is substantially perpendicular to the direction of joining of the at least one first layer element with the at least one second element.

9. The method according to claim 1 , wherein a section of the pin is turned into a round shape by way of forming after the at least partial detachment.

10. The method according to claim 1 , wherein the pin is formed on at least one end section into a gull wing, J-lead or SOP-like shape after the at least partial detachment.

11. The method according to claim 1 , wherein a predetermined breaking point is introduced into an end section of a pin of the set of multiple pins connected to a connecting web.

12. A method for producing a feedthrough for an electromedical implant, wherein a body of a feedthrough having at least one continuous cut-out is provided, comprising producing a pin in according to claim 1 , and carrying out an additional step, according to which the pin, or each pin of the set of multiple pins, is subsequently connected to the inner surface of a continuous cut-out of the insulator by way of brazing.

13. The method according to claim 12 , wherein the multiple pins are subsequently detached from each other.

14. A method for producing an electromedical implant comprising a printed circuit board, comprising producing a feedthrough according to claim 12 , and wherein subsequently each pin of the feedthrough is connected to a terminal of the printed circuit board by way of brazing or welding.

15. A pin for an electromedical implant, produced using the method according to claim 1 .

16. A feedthrough for an electromedical implant, produced using the method according to claim 12 .

17. An electromedical implant, produced using the method according to claim 14 .

18. The method according to claim 1 , wherein the semi-finished product additionally comprises at least one third layer element including an insulator or a ductile metal, which is joined with the at least one second layer element.

19. The method according to claim 1 , wherein a top coat is applied to the semi-finished product by way of an electroplating bath, after the at least partial detachment of the pin, or of the set of multiple pins, from the semi-finished product.

20. The method according to claim 6 , wherein the pin, or each pin of the set of multiple pins, is formed after the at least partial detachment in such a way that at least one circumferential recess is created, the recess being located in each case on the side surface of the particular pin.

21. The method according to claim 3 , wherein the at least partial detachment takes place in a direction that is substantially perpendicular to the direction of joining of the at least one third layer element.

22. A method for producing a pin, or a set of multiple pins for a feedthrough for an electromedical implant, the method comprising the following steps:
creating a sheet or strip shaped semi-finished product by applying at least one second layer element comprising an easily soft solderable material in sheet or strip form, onto at least one first layer element comprising an electrically conducting and biocompatible material in sheet or strip form;
applying at least one solder inhibitor layer element in sheet or strip form to the semi-finished product and optionally joining the at least one solder inhibitor layer element thereto; and
at least partially detaching a pin, or a set of multiple pins connected to a connecting web, from the semi-finished product.

23. A method for producing a pin, or a set of multiple pins for a feedthrough for an electromedical implant, the method comprising the following steps:
creating a sheet or strip shaped semi-finished product by joining at least one first layer element comprising an electrically conducting and biocompatible material in sheet or strip form and at least one second layer element comprising a solder material in sheet or strip form;
applying at least one solder inhibitor layer element in sheet or strip form to the semi-finished product and optionally joining the at least one solder inhibitor layer element thereto; and
at least partially detaching a pin, or a set of multiple pins connected to a connecting web, from the semi-finished product.

24. A method for producing a pin, or a set of multiple pins for a feedthrough for an electromedical implant, the method comprising the following steps:
creating a sheet or strip shaped semi-finished product by applying at least one second layer element comprising a solder material in sheet or strip form, onto at least one first layer element comprising an electrically conducting and biocompatible material in sheet or strip form; at least one solder inhibitor layer element in sheet or strip form is applied to the semi-finished product and optionally joined thereto; and
at least partially detaching a pin, or a set of multiple pins connected to a connecting web, from the semi-finished product.

Assignees

• Biotronik Se & Co Kg

Inventors

• Kronmueller Daniel
• Arnold Michael
• Teske Josef
• Meidlein Peter

Classifications

• B23K31/02

  relating to soldering or welding · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• C25D7/0614

  Strips or foils · CPC title

• B23K1/0008 Primary

  specially adapted for particular articles or work · CPC title