Circuit board and electronic device including same

Patent metadata

Field	Value
Publication number	US-9820379-B2
Application number	US-201214124227-A
Country	US
Kind code	B2
Filing date	May 30, 2012
Priority date	Jun 8, 2011
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.

First claim

The invention claimed is:

1. A circuit board comprising:
a ceramic sintered body having a plate shape with first and second main surfaces, and comprising a through hole penetrating from the first main surface to the second main surface;
a through conductor in the through hole, comprising a metal and having a first end at the first main surface and a second end at the second main surface; and
a metal wiring layer covering the first end and electrically connected to the through conductor,
wherein the through conductor comprises:
a first portion that has a hollow cylinder shape is in contact with an inner wall of the through hole, and extends from the first end to the second end; and
a second portion that has a columnar shape, is located inside the first portion, and is in contact with an inner wall of the hollow cylinder;
wherein the second portion has a second average crystal grain size of the metal that exceeds a first average crystal grain size of the metal of the first portion; and
wherein the through conductor contains glass, and the second portion has a glass content higher than a glass content in the first portion.

2. The circuit board according to claim 1 , wherein metal grains of the metal that has crystal grain sizes 4% or more and 10% or less of the smallest diameter of the through hole occupy 50% by area or more of the second portion.

3. The circuit board according to claim 1 , wherein the first average crystal grain size is in a range of 1.5% to 4% of the smallest diameter of the through hole.

4. The circuit board according to claim 1 , wherein the second average crystal grain size is larger than an average crystal grain size of metal grains in the metal wiring layer.

5. The circuit board according to claim 1 , wherein the glass contains Bi.

6. The circuit board according to claim 1 , wherein the through hole comprises a first opening at the first main surface with a first area and a second opening at the second main surface with a second area, the first area being larger than the second area.

7. An electronic device, comprising:
the circuit board according to claim 1 ; and
an electronic component on the metal wiring layer of the circuit board.

8. A circuit board comprising:
a ceramic sintered body having a plate shape with first and second main surfaces, and comprising a through hole penetrating from the first main surface to the second main surface;
a through conductor in the through hole, comprising a metal and having a first end at the first main surface and a second end at the second main surface; and
a metal wiring layer covering the first end and electrically connected to the through conductor,
wherein the through conductor comprises:
a first portion that has a hollow cylinder shape is in contact with an inner wall of the through hole, and extends from the first end to the second end; and
a second portion that has a columnar shape, is located inside the first portion, and extends from the first end to the second end,

wherein the second portion has a second average crystal grain size of the metal that exceeds a first average crystal grain size of the metal of the first portion; and
wherein the through conductor contains glass, and the second portion has a glass content higher than a glass content in the first portion.

9. The circuit board according to claim 8 , wherein metal grains of the metal that has crystal grain sizes 4% or more and 10% or less of the smallest diameter of the through hole occupy 50% by area or more of the second portion.

10. The circuit board according to claim 8 , wherein the first average crystal grain size is in a range of 1.5% to 4% of the smallest diameter of the through hole.

11. The circuit board according to claim 8 , wherein the second average crystal grain size is larger than an average crystal grain size of metal grains in the metal wiring layer.

12. The circuit board according to claim 8 , wherein the glass contains Bi.

13. The circuit board according to claim 8 , wherein the through hole comprises a first opening at the first main surface with a first area and a second opening at the second main surface with a second area, the first area being larger than the second area.

14. An electronic device, comprising:
the circuit board according to claim 8 ; and
an electronic component on the metal wiring layer of the circuit board.

15. The circuit board according to claim 1 ,
wherein the first portion extends from the first end and terminates at the second end; and
wherein the second portion extends from the first end and terminates at the second end.

16. The circuit board according to claim 8 ,
wherein the first portion extends from the first end and terminates at the second end; and
wherein the second portion extends from the first end and terminates at the second end.

17. The circuit board according to claim 1 , wherein the through conductor contains more than 50% by mass of copper, silver, or aluminum.

18. The circuit board according to claim 8 , wherein the through conductor contains more than 50% by mass of copper, silver, or aluminum.

Assignees

• Nakamura Kiyotaka
• Ohashi Yoshio
• Abe Yuuichi
• Hirano Eisuke
• Shikata Kunihide
• Sekiguchi Keiichi
• Kyocera Corp

Inventors

• Nakamura Kiyotaka
• Ohashi Yoshio
• Abe Yuuichi
• Hirano Eisuke
• Shikata Kunihide
• Sekiguchi Keiichi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• H10W70/635

  Through-vias · CPC title