Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film

Patent metadata

Field	Value
Publication number	US-9820376-B2
Application number	US-201414894485-A
Country	US
Kind code	B2
Filing date	Apr 30, 2014
Priority date	May 28, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.

First claim

The invention claimed is:

1. A shape-retaining film which is to be joined with a flexible wiring board, comprising:
a plastic-deformable metal layer; and
an adhesive layer which is formed on one surface side of the metal layer and by which the plastic-deformable metal layer is to be joined with the flexible wiring board,
wherein when the metal layer is joined with the flexible wiring board, the metal layer substantially maintains the shape of the flexible wiring board by virtue of plastic deformation of the metal layer in accordance with deformation of the flexible wiring board.

2. The shape-retaining film according to claim 1 , wherein the metal layer is mainly made of at least one of copper, silver, nickel, and aluminum.

3. The shape-retaining film according to claim 1 , wherein the thickness of the metal layer is 0.1 μm to 12 μm.

4. The shape-retaining film according to claim 1 , wherein the adhesive layer is conductive.

5. The shape-retaining film according to claim 1 , wherein in the metal layer, a protective layer is formed on a side opposite to a side where the adhesive layer is provided.

6. The shape-retaining film according to claim 1 , wherein in the metal layer, another adhesive layer is further formed on a side opposite to a side where the adhesive layer is provided.

7. The shape-retaining film according to claim 6 , wherein the another adhesive layer formed on the side opposite to the side where the adhesive layer is provided in the metal layer is conductive.

8. The shape-retaining film according to claim 1 , wherein the metal layer is subjected to a corrosion resistance surface treatment.

9. A shape-retaining flexible wiring board, wherein the shape-retaining film according to claim 1 is joined with the flexible wiring board by the adhesive layer.

10. The shape-retaining film according to claim 1 , wherein the metal layer has been formed by rolling.

Assignees

• Tatsuta Electric Wire & Cable Co Ltd

Inventors

• Tajima Hiroshi

Classifications

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K2201/057

  Shape retainable · CPC title

• H05K1/0281 Primary

  Reinforcement details thereof · CPC title

• H05K3/281

  by means of a preformed insulating foil (H05K3/284 takes precedence) · CPC title