Hot stamping wiring, electric device having the same, and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9819133-B2
Application number	US-201615258240-A
Country	US
Kind code	B2
Filing date	Sep 7, 2016
Priority date	Nov 4, 2015
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A hot stamping wiring includes a hot stamping film that has insulation properties and can be attached to an insulating part by a hot stamping method, an electronic device having a hot stamping and a hot stamping method are provided. The hot stamping wiring includes a plurality of band-shaped conductors that are formed in a band shape of a material having electrical conductivity, attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and are spaced apart at intervals, and a connector wafer, which includes a plurality of connecting pins corresponding to the plurality of band-shaped conductors, is disposed at the hot stamping film, and is attached to the insulating part by ultrasonic welding, wherein the connector wafer comprises a plurality of junction projections for ultrasonic welding.

First claim

What is claimed is:

1. A hot stamping wiring comprising:
a hot stamping film that has insulation properties and attachable to an insulating part by a hot stamping;
a plurality of band-shaped conductors attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and spaced apart at intervals; and
a connector wafer, which includes a plurality of connecting pins corresponding to the plurality of band-shaped conductors, disposed at the hot stamping film, and attachable to the insulating part by ultrasonic welding,
wherein the connector wafer comprises a plurality of junction projections weldable by ultrasonic welding.

2. The hot stamping wiring of claim 1 , wherein
an end portion of each of the plurality of connecting pins is formed in a contacting surface that is exposed on a surface of the connector wafer.

3. The hot stamping wiring of claim 2 , wherein
the plurality of junction projections are formed between contacting surfaces of the plurality of connecting pins.

4. The hot stamping wiring of claim 3 , wherein
the plurality of junction projections project further than the contacting surfaces of the plurality of connecting pins.

5. The hot stamping wiring of claim 2 , wherein
the plurality of band-shaped conductors and the contacting surfaces of the plurality of connecting pins are in surface-to-surface contact with each other.

6. The hot stamping wiring of claim 1 , wherein
an insulation sheet to cover the plurality of band-shaped conductors is attached to at least one portion of the hot stamping film.

7. The hot stamping wiring of claim 6 , further comprising:
a connector wafer including a plurality of connecting pins corresponding to the plurality of band-shaped conductors and attachable to the portion of the hot stamping wiring, to which the insulation sheet is attached, by heat fusion,
wherein the connector wafer comprises a plurality of junction projections attachable by heat fusion.

8. The hot stamping wiring of claim 7 , wherein
the plurality of connecting pins and the plurality of band-shaped conductors are in surface-to-surface contact with each other.

9. The hot stamping wiring of claim 1 , wherein
the hot stamping film is formed of a flexible material.

10. The hot stamping wiring of claim 1 , wherein
the insulating part and the connector wafer are formed of a same material.

11. The hot stamping wiring of claim 1 , wherein
the insulating part comprises an inner component that is disposed in an inside of an electronic device.

12. The hot stamping wiring of claim 1 , wherein
the insulating part comprises an inner surface of a clothes.

13. An electronic device having a hot stamping wiring, the electronic device comprising:
a case comprising an inner component with insulation properties;
at least one load disposed inside the case;
at least one printed circuit board disposed inside the case and configured to control the at least one load; and
a hot stamping wiring configured to connect the at least one load and the at least one printed circuit board,
wherein the hot stamping wiring comprises,
a hot stamping film that has insulation properties and attachable to the inner component having insulation properties by a hot stamping,
a plurality of band-shaped conductors attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and spaced apart at intervals, and
first and second connector wafers including a plurality of connecting pins corresponding to the plurality of band-shaped conductors, disposed at two portions of the hot stamping film, and attachable to the inner component by ultrasonic welding,

wherein the first and second connector wafers include a plurality of junction projections weldable by ultrasonic welding, the at least one load couplable to the first connector wafer, and the at least one printed circuit board couplable to the second connector wafer.

14. The electronic device having a hot stamping wiring of claim 13 , wherein
the inner component with the insulation properties includes a first inner component and a second inner component that are formed separately,
the first connector wafer is disposed in the first inner component,
the second connector wafer is disposed in the second inner component,
the hot stamping wiring connects the first inner component and the second inner component, and
an insulation sheet to cover the plurality of band-shaped conductors is attachable to a portion of the hot stamping wiring that is not attached to the first inner component and the second inner component.

15. The electronic device having a hot stamping wiring of claim 13 , wherein
an end portion of each of the plurality of connecting pins is formed in a contacting surface that is exposed on a surface of each of the first and second connector wafers, and
the plurality of junction projections are formed between contacting surfaces of the plurality of connecting pins.

16. The electronic device having a hot stamping wiring of claim 15 , wherein
the plurality of band-shaped conductors and the contacting surfaces of the plurality of connecting pins are in surface-to-surface contact with each other.

17. The electronic device having a hot stamping wiring of claim 15 , wherein
the plurality of junction projections project further than the contacting surfaces of the plurality of connecting pins.

18. A method for manufacturing a hot stamping wiring, the method comprising:
preparing a hot stamping wiring;
positioning the hot stamping wiring on a surface of an insulating part;
attaching the hot stamping wiring to the insulating part by a hot stamping; and
attaching at least one connector wafer to the hot stamping wiring by ultrasonic welding.

19. The method of claim 18 , wherein
the hot stamping wiring comprises,
a hot stamping film that has insulation properties and attachable to the insulating part by the hot stamping, and
a plurality of band-shaped conductors attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and spaced apart at intervals,

wherein the connector wafer comprises a plurality of junction projections weldable by ultrasonic welding.

20. The method of claim 19 , further comprising:
removing a portion of the hot stamping film to attach the at least one connector wafer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Sung-Il
• Jang Si-Ho

Classifications

• H05K5/0017

  with operator interface units · CPC title

• H01R12/7041

  Gluing or taping · CPC title

• H01B1/00

  Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors · CPC title

• H01R12/592

  connections to contact elements · CPC title

• H01R43/0207 Primary

  Ultrasonic-, H.F.-, cold- or impact welding · CPC title