Light-emitting device
US-12155019-B2 · Nov 26, 2024 · US
Optoelectronic semiconductor component
US9818921B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9818921-B2 |
| Application number | US-201113703127-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2011 |
| Priority date | Jun 24, 2010 |
| Publication date | Nov 14, 2017 |
| Grant date | Nov 14, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.
First claim
Opening claim text (preview).
The invention claimed is: 1. An optoelectronic semiconductor component comprising: a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and comprising a main radiation side remote from the carrier top, at least one bonding wire, via which the semiconductor chip is electrically contacted, at least one covering body on the main radiation side which projects beyond the bonding wire in a direction away from the carrier top and p…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9818921B2 cover?
- An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting…
- Who is the assignee on this patent?
- Ramchen Johann, Racz David, Gallmeier Hans-Christoph, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H01L33/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).