Integrated circuit and manufacturing method

Patent metadata

Field	Value
Publication number	US-9818905-B2
Application number	US-201514883503-A
Country	US
Kind code	B2
Filing date	Oct 14, 2015
Priority date	Jan 7, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Disclosed is an integrated circuit comprising a substrate ( 10 ); and an optical CO 2 sensor comprising: first and second light sensors ( 12, 12 ′) on said substrate, said second light sensor being spatially separated from the first light sensor; and a layer portion ( 14 ) including an organic compound comprising at least one amine or amidine functional group over the first light sensor; wherein said integrated circuit further comprises a signal processor ( 16 ) coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor. An electronic device comprising such a sensor and a method of manufacturing such an IC are also disclosed.

First claim

The invention claimed is:

1. A method of manufacturing an integrated circuit comprising an optical CO 2 sensor, comprising:
providing
a substrate including a first light sensor and a second light sensor spatially separated from each other and
a signal processor coupled to the first and second light sensors for determining a difference in the respective outputs of the first and second light sensors; and

forming
a layer portion including an organic compound comprising at least one amine or amidine functional group for reacting with CO 2 over the first light sensor.

2. The method of claim 1 , further comprising:
forming an interconnect structure over the substrate;
forming a passivation layer over the interconnect structure, said passivation layer including a first area over the first light sensor;
wherein the step of forming the layer portion includes forming the layer portion in the first area.

3. The method of claim 2 , further comprising:
forming a further sensor at least partially on the passivation layer by:
forming a pair of electrodes on a further area of the passivation layer;
depositing a gas or moisture sensitive layer over the passivation layer including the pair of electrodes; and
patterning the gas or moisture sensitive layer such that the gas or moisture sensitive layer remains in the first and further areas; and
wherein the step of forming the layer portion comprises forming the layer portion at least partially over the gas or moisture sensitive layer remaining in the first area.

4. The method of claim 3 , further comprising including a dye in the gas or moisture sensitive layer prior to said patterning step.

Assignees

• Nxp Bv

Inventors

• Humbert Aurelie
• Daamen Roel
• Ponomarev Youri Victorovitch

Classifications

• G01N21/77

  by observing the effect on a chemical indicator · CPC title

• G01N2291/0256

  Adsorption, desorption, surface mass change, e.g. on biosensors · CPC title

• H01L31/18 Primary

  Electricity · mapped topic

• G01N29/022 Primary

  Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices (microdevices per se B81B) · CPC title

• G01N21/766

  of gases · CPC title