Termination trench structures for high-voltage split-gate MOS devices

Patent metadata

Field	Value
Publication number	US-9818828-B2
Application number	US-201615065303-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 9, 2016
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Apparatus and associated methods relate to an edge-termination structure surrounding a high-voltage MOSFET for reducing a peak lateral electric field. The edge-termination structure includes a sequence of annular trenches and semiconductor pillars circumscribing the high-voltage MOSFET. Each of the annular trenches is laterally separated from the other annular trenches by one of the semiconductor pillars. Each of the annular trenches has dielectric sidewalls and a dielectric bottom electrically isolating a conductive core within each of the annular trenches from a drain-biased region of the semiconductor pillar outside of and adjacent to the annular trench. The conductive core of the innermost trench is biased, while the conductive cores of one or more outer trenches are floating. In some embodiments, a surface of an inner semiconductor pillar is biased as well. The peak lateral electric field can advantageously be reduced by physical arrangement of trenches and electrical biasing sequence.

First claim

The invention claimed is:

1. An edge-termination structure surrounding a high-voltage MOSFET for reducing a peak lateral electric field, the edge-termination structure comprising:
a sequence of alternating annular trenches and semiconductor pillars circumscribing the high-voltage MOSFET, wherein each of the annular trenches has dielectric sidewalls and a dielectric bottom, the dielectric sidewalls and dielectric bottom electrically isolating a conductive core within each of the annular trenches from a drain-biased region outside of and adjacent to the annular trench,
wherein the sequence of annular trenches and semiconductor pillars comprises:
a first semiconductor pillar having a top surface contact providing electrical connection between a first conductor and the top surface of the first semiconductor pillar;
a first annular trench adjacent to and circumscribing the first semiconductor pillar, the conductive core of the first annular trench electrically connected with the first conductor;
a second semiconductor pillar adjacent to and circumscribing the first annular trench, the second semiconductor pillar having a top surface that is not electrically connected to the first conductor;
a second annular trench adjacent to and circumscribing the second semiconductor pillar, the conductive core of the second annular trench electrically connected with the first conductor; and
a third annular trench circumscribing the second annular trench, the conductive core of the third annular trench not electrically connected with the first conductor.

2. The edge-termination structure of claim 1 , wherein the first conductor is electrically connected to a body of the high-voltage MOSFET.

3. The edge-termination structure of claim 1 , wherein the first conductor is electrically connected to a source of the high-voltage MOSFET.

4. The edge-termination structure of claim 1 , further comprising:
a metal layer overlaying the first annular trench and the second semiconductor pillar.

5. The edge-termination structure of claim 4 , wherein the metal layer is electrically connected to the first conductor.

6. The edge-termination structure of claim 1 , wherein each of the annular trenches of the sequence of annular trenches circumscribes the high-voltage MOSFET in a convex shape having exterior angles of all vertices less than 60 degrees.

7. The edge-termination structure of claim 1 , wherein at least one of the conductive cores has a field-plate extension that laterally extends from the conductive core of the annular trench to above an adjacent semiconductor pillar in a direction toward an edge of a die on which the high-voltage MOSFET is formed.

8. The edge-termination structure of claim 1 , wherein the dielectric sidewalls and dielectric bottom comprise silicon dioxide.

9. The edge-termination structure of claim 1 , wherein the conductive core comprises polysilicon.

10. The edge-termination structure of claim 1 , wherein one of the semiconductor pillars separating adjacent annular trenches includes a buried layer inverting a polarity of the one of the semiconductor pillars from an overlying uninverted region and an underlying uninverted region, wherein a peak net dopant concentration of the buried layer is at a depth location that is above a depth location of the dielectric bottom of the adjacent annular trenches.

11. An edge-termination structure surrounding a high-voltage MOSFET for reducing a peak lateral electric field, the edge-termination structure comprising:
a sequence of annular trenches circumscribing the high-voltage MOSFET, each of the annular trenches laterally separated from the other annular trenches by a semiconductor pillar, wherein each of the annular trenches has dielectric sidewalls and a dielectric bottom, the dielectric sidewalls and dielectric bottom electrically isolating a conductive core within each of the annular trenches from a drain-biased region of the semiconductor pillar outside of and adjacent to the annular trench,
wherein the sequence of annular trenches and semiconductor pillars comprises:
an innermost annular trench, wherein the conductive core of the innermost annular trench is electrically coupled to a body of the high-voltage MOSFET;
an intermediate annular trench, wherein the conductive core of the intermediate annular trench has a top-surface field-plate extension and is electrically coupled to the body of the high-voltage MOSFET; and
an outermost annular trench, wherein the conductive core of the outermost annular trench has a top-surface field-plate extension and is electrically unconnected to each of a source, a drain, a gate, and the body of the high-voltage MOSFET.

12. The edge-termination structure of claim 11 , further comprising:
a metal layer overlaying the innermost annular trench and the intermediate annular trench with top-surface plate extension.

13. The edge-termination structure of claim 12 , wherein the metal layer is electrically connected to the body of the high-voltage MOSFET.

14. The edge-termination structure of claim 11 , wherein each of the annular trenches of the sequence of annular trenches circumscribes the high-voltage MOSFET in a convex shape having exterior angles of all vertices less than 60 degrees.

15. The edge-termination structure of claim 11 , wherein the top-surface field-plate extension laterally extends from the conductive core of the annular trench to above an adjacent semiconductor pillar in a direction toward an edge of a die on which the high-voltage MOSFET is formed.

16. The edge-termination structure of claim 11 , wherein the dielectric sidewalls and dielectric bottom comprise silicon dioxide.

17. The edge-termination structure of claim 11 , wherein the conductive core comprises polysilicon.

18. The edge-termination structure of claim 11 , wherein one of the semiconductor pillars separating adjacent annular trenches includes a buried layer inverting a polarity of the one of the semiconductor pillars from an overlying uninverted region and an underlying uninverted region, wherein a peak net dopant concentration of the buried layer is at a depth location that is above a depth location of the dielectric bottom of the adjacent annular trenches.

19. A method of manufacturing an edge-termination structure surrounding a high-voltage MOSFET, the method comprising:
etching a sequence of annular trenches circumscribing the high-voltage MOSFET, the sequence comprising an innermost, an intermediate and an outermost annular trench;
forming a dielectric layer on sidewalls and a bottom of each of the trenches;
depositing a conductive core into each of the trenches, the conductive core within each of the annular trenches electrically isolated from a drain-biased region of semiconductor outside of and adjacent to the annular trench;
electrically connecting the conductive cores of the innermost and intermediate trenches to a body of the high-voltage MOSFET;
isolating the conductive core of the outermost trench from a source, a gate, a drain, and the body of the high-voltage MOSFET; and
forming a top-surface field-plate extension of the core of each of the intermediate and outermost trenches, each of the top-surface field-plate extensions extended from a top of the conductive core and laterally over a top surface of the semiconductor exterior and adjacent to the trench.

20. The method of claim 19 , further comprising:
overlaying the innermost and intermediate trenches with a metal layer.

21. The method of claim 20 , wherein the metal

Assignees

• Polar Semiconductor Llc
• Sanken Electric Co Ltd

Inventors

• West Peter
• Kosier Steven
• Kamimura Tatsuya
• Rankila Don

Classifications

• H10P50/642

  Chemical etching · CPC title

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/416

  of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title

• H10D64/2527

  for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies · CPC title

• H01L21/32055

  Electricity · mapped topic