Thermally sprayed thin film resistor and method of making

Patent metadata

Field	Value
Publication number	US-9818512-B2
Application number	US-201414563560-A
Country	US
Kind code	B2
Filing date	Dec 8, 2014
Priority date	Dec 8, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.

First claim

What is claimed is:

1. A thin film resistor comprising:
a substrate;
an alloy bond layer deposited on the substrate; and
a thermally sprayed resistive element thermally sprayed directly on at least a portion of the alloy bond layer.

2. A method of forming a thin film resistor, comprising the steps of:
providing a substrate having a first surface, side surfaces, and a second surface opposite the first surface;
depositing an alloy bond layer directly over at least a portion of the first surface;
thermally spraying a thermally sprayed resistive layer directly over at least a portion of the alloy bond layer, wherein the thermally sprayed resistive layer is applied at a rate of at least 10 micrometers per minute;
forming conductor pads adjacent sides of the thermally sprayed resistive layer and in contact with at least a portion of the alloy bond layer; and
electrically connecting the first surface and the second surface of the resistor.

3. The thin film resistor of claim 1 , wherein the thermally sprayed resistive element comprises an alloy of copper, nickel, tantalum or titanium.

4. The thin film resistor of claim 1 , wherein the alloy bond layer comprises an alloy of copper, nickel, tantalum or titanium.

5. The thin film resistor of claim 4 , wherein the thermally sprayed resistive element is chemically bonded to the alloy bond layer.

6. The thin film resistor of claim 1 , wherein the thermally sprayed resistive element is formed from particles of a thermally sprayed material demonstrating mechanical bonding, mechanical interlocking, diffusion bonding, or metallurgical bonding.

7. The thin film resistor of claim 1 , wherein the thin film resistor has a resistance value of 10.0 Ohms or less.

8. The thin film resistor of claim 1 , wherein the thin film resistor has a resistance value of 1.0 Ohms or less.

9. A method of making a thin film resistor, the method comprising depositing an alloy bond layer on a substrate and thermally spraying a thermally sprayed material using a thermal spraying process directly on at least a portion of the alloy bond layer to form a thermally sprayed resistive element.

10. The method of claim 2 , wherein the step of forming conductor pads comprises the steps of:
depositing adhesion layers adjacent sides of the thermally sprayed resistive layer and over portions of the alloy bond layer;
depositing first conductor layers over the adhesion layers; and
plating second conductor layers over the first conductor layers.

11. The method of claim 9 , wherein the thermally sprayed material is applied at a deposition rate of at least 10 micrometers per minute.

12. The method of claim 9 , wherein the thermally sprayed resistive element has a thickness of at least 1.0 micrometers.

13. The method of claim 9 , wherein the thermally sprayed resistive element comprises an alloy of copper, nickel, tantalum or titanium.

14. The method of claim 13 , wherein the alloy bond layer comprises an alloy of copper, nickel, tantalum or titanium.

15. The method of claim 14 , wherein the thermally sprayed resistive element is chemically bonded to the alloy bond layer.

16. The method of claim 9 , wherein the thermally sprayed material is thermally sprayed at a rate of at least 10 micrometers per minute.

17. The method of claim 9 , wherein the thin film resistor has a resistance value of 10.0 Ohms or less.

18. The method of claim 9 , wherein the thin film resistor has a resistance value of 1.0 Ohms or less.

19. A thin film resistor, comprising:
a substrate having a first surface and an opposite second surface;
an alloy bond layer deposited on at least a portion of the first surface of the substrate;
a thermally sprayed resistive layer thermally sprayed directly on at least a portion of the alloy bond layer;
conductor pads provided adjacent sides of the thermally sprayed resistive layer and in contact with at least a portion of the alloy bond layer;
an electrical connection connecting the first surface to the second surface.

20. The thin film resistor of claim 19 , wherein the conductor pads comprise first conductor layers and second conductor layers.

21. The thin film resistor of claim 20 , further comprising adhesion layers beneath the first conductor layers.

22. The thin film resistor of claim 19 , wherein the electrical connection comprises alloy adhesion layers extending from adjacent the conductor pads, along the sides of the substrate, and at least partially along portions of the second surface of the substrate.

23. The thin film resistor of claim 20 , wherein the electrical connection further comprises third conductor layers applied over the adhesion layers.

24. The thin film resistor of claim 23 , wherein the electrical connection further comprises fourth conductor layers applied over the third conductor layers.

25. The thin film resistor of claim 24 , further comprising barrier layers applied over the fourth conductor layers.

26. The thin film resistor of claim 25 , further comprising a solder finish provided over the barrier layers.

27. The method of claim 10 , wherein the step of electrically connecting the first surface and the second surface comprises the steps of:
depositing adhesion layers adjacent the conductor pads, along portions of the first surface and sides of the substrate, and at least partially along portions of the second surface of the substrate;
depositing third conductor layers over the adhesion layers; and
plating fourth conductor layers over the third conductor layers.

28. The method of claim 27 , further comprising applying barrier layers over the fourth conductor layers; and, applying solder over the barrier layers.

29. The method of claim 2 , further comprising providing an overcoat over exposed parts of the thermally sprayed resistive layer.

30. The method of claim 29 , wherein the step of providing an overcoat comprises the steps of:
providing a moisture passivation layer over at least a portion of the thermally sprayed resistive layer; and
providing a mechanical protection layer over at least a portion of the moisture passivation layer.

Assignees

• Vishay Dale Electronics Llc

Inventors

• Martin Tom J
• Smith Clark
• Traikoff Jeff

Classifications

• H01C17/283

  Precursor compositions therefor, e.g. pastes, inks, glass frits · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C7/006

  Thin film resistors · CPC title

• H01C1/142

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C17/075 Primary

  by thin-film techniques · CPC title