Apparatus and method for dynamic thermal management of integrated circuit

Patent metadata

Field	Value
Publication number	US-9817454-B2
Application number	US-201514883911-A
Country	US
Kind code	B2
Filing date	Oct 15, 2015
Priority date	Oct 15, 2015
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A thermal control system for an integrated circuit in an electronic device includes a sensing unit, a calculating unit, and a control unit. The sensing unit is for providing a first temperature signal by sensing the temperature of the integrated circuit and providing a second temperature signal by sensing the temperature of a component of the electronic device. The calculating unit computes a target temperature value of the integrated circuit according to the second temperature signal. The control unit adjusts target setting for the integrated circuit according to the target temperature value and the first temperature signal.

First claim

What is claimed is:

1. A thermal control system for an integrated circuit in an electronic device, the thermal control system comprising:
a sensing circuit configured to provide a first temperature signal by sensing a temperature of the integrated circuit and a second temperature signal by sensing a temperature of a component within the electronic device;
a calculating circuit configured to compute a target temperature value of the integrated circuit according to the second temperature signal; and
a control circuit configured to adjust target setting for the integrated circuit according to the target temperature value and the first temperature signal.

2. The thermal control system of claim 1 , wherein the calculating circuit computes the target temperature value by:
calculating a base temperature value according to a current value of the second temperature signal and a mathematical function;
calculating an adjustment temperature value according to past values of the second temperature signal; and
adding the base temperature value and the adjustment temperature value to obtain the target temperature value.

3. The thermal control system of claim 2 , wherein when the current value of the second temperature is within a device-specific range, the mathematical function is a linear function that corresponds the current value of the second temperature to the base temperature value.

4. The thermal control system of claim 3 , wherein the device-specific range has a lower limit and the calculating circuit bypasses computing the target temperature value when the current value of the second temperature signal is smaller than the lower limit.

5. The thermal control system of claim 3 , wherein the device-specific range has an upper limit and the calculating circuit calculates the adjustment temperature value further according to a current value of the second temperature signal and the upper limit.

6. The thermal control system of claim 5 , wherein when the current value of the second temperature signal exceeds the upper limit, the calculating circuit sets the base temperature value to a lower bound value and calculates the adjustment temperature value for obtaining the target temperature value.

7. The thermal control system of claim 1 , wherein the control circuit adjusts the target setting for the integrated circuit by:
generating a new power budget of the integrated circuit based on a current power budget, the target temperature value of the integrated circuit and a current value of the first temperature signal; and
generating the target setting for the integrated circuit according to the new power budget.

8. The thermal control system of claim 7 , wherein the control circuit generates the new power budget further according to a difference between the current value of the first temperature signal and a maximum allowable temperature of the integrated circuit.

9. The thermal control system of claim 7 , wherein the control circuit applies the target setting for the integrated circuit by iteration to perform an adjustment on settings of the integrated circuit, wherein during each iteration a portion of the adjustment is performed.

10. The thermal control system of claim 7 , wherein the sensing circuit provides the first temperature signal by sensing a temperature of a first specific region of the integrated circuit and the sensing circuit is further configured to provide a third temperature signal by sensing a temperature of a second specific region of the integrated circuit, wherein the control circuit generates the new power budget of the integrated circuit further based on a current value of the third temperature signal.

11. The thermal control system of claim 1 , wherein the component of the electronic device is a printed circuit board (PCB) and the integrated circuit is mounted on the printed circuit board.

12. A thermal control method for an integrated circuit in an electronic device, the thermal control method comprising:
sensing a temperature of the integrated circuit to provide a first temperature signal;
sensing a temperature of a component within the electronic device to provide a second temperature signal;
computing a target temperature value of the integrated circuit according to the second temperature signal; and
adjusting target setting of the integrated circuit according to the target temperature value and the first temperature signal.

13. The thermal control method of claim 12 , wherein the target temperature value is computed by:
calculating a base temperature value according to a current value of the second temperature signal and a mathematical function;
calculating an adjustment temperature value according to past values of the second temperature signal; and
adding the base temperature value and the adjustment temperature value to obtain the target temperature value.

14. The thermal control method of claim 13 , wherein when the current value of the second temperature is within a device-specific range, the mathematical function is a linear function that corresponds the current value of the second temperature to the base temperature value.

15. The thermal control method of claim 14 , wherein the device-specific range has a lower limit, the method further comprising:
bypassing computing the target temperature value when the current value of the second temperature signal is smaller than the lower limit.

16. The thermal control method of claim 14 , wherein the device-specific range has an upper limit and the adjustment temperature value is calculated further according to a current value of the second temperature signal and the upper limit.

17. The thermal control method of claim 16 , wherein when the current value of the second temperature signal exceeds the upper limit, the base temperature value is set to a lower bound value and the adjustment temperature value is calculated for obtaining the target temperature value.

18. The thermal control method of claim 12 , wherein the target setting of the integrated circuit is adjusted by:
generating a new power budget of the integrated circuit based on a current power budget, the target temperature value of the integrated circuit and a current value of the first temperature signal; and
generating the target setting for the integrated circuit according to the new power budget.

19. The thermal control method of claim 18 , wherein the new power budget is generated further according to a difference between the current value of the first temperature signal and a maximum allowable temperature of the integrated circuit.

20. The thermal control method of claim 18 , wherein the target setting is applied on the integrated circuit by iteration to perform an adjustment on settings of the integrated circuit, wherein during each iteration a portion of the adjustment is performed.

21. The thermal control method of claim 18 , wherein the first temperature signal is provided by sensing a temperature of a first specific region of the integrated circuit and the method further comprising:
providing a third temperature signal by sensing a temperature of a second specific region of the integrated circuit, wherein the new power budget of the integrated circuit is generated further based on a current value of the third temperature signal.

22. The thermal control method of claim 12 , wherein the component of the electronic device is a printed circuit board (PCB) and the integrated circuit is mounted on the printed circuit board.

Assignees

• Mediatek Inc

Inventors

• Wang Wei-Ting
• Pan Yingshiuan
• Lin Kang-Chih

Classifications

• G06F1/3243

  Power saving in microcontroller unit · CPC title

• G06F9/46

  Multiprogramming arrangements · CPC title

• G06F1/3287

  by switching off individual functional units in the computer system · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/324

  by lowering clock frequency · CPC title