System and method for thermal management guidance

US9817452B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9817452-B2
Application numberUS-201313739249-A
CountryUS
Kind codeB2
Filing dateJan 11, 2013
Priority dateJan 11, 2013
Publication dateNov 14, 2017
Grant dateNov 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for thermal management executed by a data processing system having at least one processor, the method comprising: receiving structural information describing a structural composition of a repair field of a structure, wherein the repair field includes a repair area that includes an area that was damaged; generating a map of the repair field using the structural information, wherein the map comprises an image of the repair area; analyzing, by the at least one processor, the structural information to determine at least one thermal property of the repair field and identify at least one suggested placement for a temperature sensor to be installed near the repair area based on the at least one thermal property of the repair field; and indicating the suggested placement for the temperature sensor, wherein the temperature sensor is to be monitored to control a hot bonder and associated heat blanket. 2. The method of claim 1 , wherein the structural information is received from a scanner that is adapted to scan the repair field. 3. The method of claim 2 , wherein the scanner is a geometry scanner. 4. The method of claim 1 , wherein indicating the suggested placement for the temperature sensor further comprises displaying, on a screen of the data processing system, the suggested placement of the temperature sensor within the map of the repair field. 5. The method of claim 4 , wherein indicating the suggested placement for the temperature sensor further comprises displaying, on the screen of the data processing system, the map of the repair field. 6. The method of claim 5 , wherein the map of the repair field includes information about the structural composition of a repair field, and wherein displaying the map of the repair field includes displaying structural information, variations in density, thickness, or thermal mass of the repair field. 7. The method of claim 1 , further comprising causing a projector that is coupled to the data processing system to project the suggested placement of the temperature sensor onto the repair field. 8. The method of claim 2 , further comprising: receiving, from the scanner, temperature sensor placement information that indicates an actual placement of an installed temperature sensor near the repair area, wherein the scanner is adapted to detect the actual placement of the installed temperature sensor near the repair area; generating a temperature sensor indicator for the installed temperature sensor based on the temperature sensor placement information, wherein the temperature sensor indicator relates to the temperature sensor and is associated with a location on the map of the repair field; and displaying, on the screen of the data processing system, the temperature sensor indicator within the map of the repair field. 9. The method of claim 8 , further comprising receiving a unique number for the temperature sensor indicator coinciding with a number associated with the temperature sensor by a hot bonder. 10. The method of claim 8 , further comprising: analyzing the map of the repair field and the temperature sensor indicator to determine a repair size that encompasses the temperature sensor placed near the repair area; determining an appropriate heat blanket size that covers the repair size; and displaying, on a screen of the data processing system, the appropriate heat blanket size. 11. The method of claim 8 , further comprising: analyzing the structural information to determine an appropriate heat blanket power supply capable of supplying power to a heat blanket to heat the repair field according to a desired heating profile; and displaying, on a screen of the data processing system, the appropriate heat blanket power supply. 12. The method of claim 8 , further comprising: receiving, as input from a user, heat blanket information that indicates a size and power of a heat blanket selected to be used to perform a hot bonder repair; analyzing, by the at least one processor, the heat blanket information based on the map of the repair field and location of the temperature sensor indicator to determine whether the heat blanket is of acceptable size and power to fit and sufficiently cure the repair area; and displaying, on a screen of the data processing system, one or more warnings or suggestions regarding the heat blanket selected to be used. 13. The method of claim 12 , wherein one of the warnings or suggestions regarding the heat blanket includes a suggestion that one or more additional temperature sensors be placed near the repair area. 14. A method for thermal management executed by a data processing system having at least one processor, the method comprising: generating a map of a repair field of a structure, wherein the repair field includes a repair area that includes an area that was damaged, the map comprising an image depicting the repair field; receiving temperature readings from multiple temperature sensors that are placed near the repair area; and analyzing, by the at least one processor, the map of the repair field and the temperature readings to determine one or more insulation suggestions in response to a determination that one or more of the temperature readings is not within an acceptable temperature range based on a location of a corresponding one or more of the multiple temperature sensors within the repair field, wherein each insulation suggestion comprises instructions to add or remove insulation within the repair field. 15. The method of claim 14 , further comprising displaying, on a screen of the data processing system, the one or more insulation suggestions within the map of the repair field. 16. The method of claim 14 , further comprising causing a projector that is coupled to the data processing system to project the one or more insulation suggestions onto the repair field. 17. The method of claim 14 , wherein the one or more of the insulation suggestions comprises an identification of a corresponding temperature sensor to which insulation is to be added or removed. 18. The method of claim 14 , wherein the one or more of the insulation suggestions comprises an identification of an insulation area, within the repair field, to which insulation is to be added or removed. 19. The method of claim 14 , further comprising: receiving, as input from a user, a confirmation that the one or more insulation suggestions were implemented by the user; receiving, as input from a user, for one or more areas of the repair field, an indication of types of insulation placed and number of layers of insulation placed; receiving updated temperature readings from multiple temperature sensors that are placed near the repair area; and analyzing the map of the repair field and the temperature readings to determine whether to provide an additional insulation suggestion. 20. The method of claim 19 , further comprising: saving, as insulation configuration information, the indications of the types of insulation placed and the number of layers of insulation placed; and displaying, on a screen of the data processing system, the insulation configuration information.

Assignees

Inventors

Classifications

  • for local pressing or local heating · CPC title

  • for local heating · CPC title

  • Maintaining or repairing aircraft · CPC title

  • B29C73/12Primary

    Apparatus therefor, e.g. for applying (B29C73/30 takes precedence) · CPC title

  • using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9817452B2 cover?
The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidan…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C73/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).