Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9817315B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9817315-B2 |
| Application number | US-201414208529-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 13, 2014 |
| Priority date | Mar 13, 2014 |
| Publication date | Nov 14, 2017 |
| Grant date | Nov 14, 2017 |
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A photolithography system includes a variable-volume buffer tank, a dispensing system connected to the buffer tank, and a valve configured to release gas from a head space of the buffer tank while blocking the release of liquid from the head space. A storage container has an opening at the bottom and drains to the buffer tank through that opening. The buffer tank has a storage capacity sufficient to receive the full contents of the storage container. The system supplies chemical solutions to the dispensing system while keeping the chemical solutions from contact with air and other gases.
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What is claimed is: 1. A photolithography system, comprising: a variable-volume buffer tank; a dispensing system connected to the variable-volume buffer tank and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers; and a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space; wherein the variable-volume buffer tank includes a photolithography chemical solution inlet and a photolithography chemical solution outlet through which the photolithography chemical solution concurrently flow when being provided to the dispensing system. 2. The photolithography system of claim 1 , further comprising: a storage container having a storage capacity volume; and a connector forming a connection for transferring fluid from the storage container to the photolithography chemical solution inlet of the variable-volume buffer tank; wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container. 3. The photolithography system of claim 2 , wherein the connection for transferring fluid from the storage container to the buffer tank is configured to drain the contents of the storage container from out of the bottom of the storage container. 4. The photolithography system of claim 1 , wherein the buffer tank comprises a collapsible liner within a rigid shell. 5. The photolithography system of claim 1 , wherein the buffer tank comprises a piston and cylinder arrangement. 6. The photolithography system of claim 1 , wherein the buffer tank comprises a flexible container with accordion pleats. 7. The photolithography system of claim 1 , wherein the valve is an electronically controlled valve. 8. The photolithography system of claim 7 , further comprising: a bubble detector configured to detect bubbles in the head space; wherein the valve is configured to open automatically in response to detection of bubbles in the head space by the bubble detector. 9. The photolithography system of claim 1 , wherein the variable-volume buffer tank connects to the photolithography chemical solution dispensing system through an opening that exits the buffer tank at a height below the head space. 10. The photolithography system of claim 1 , wherein the dispensing system comprises a positive displacement pump operative to diminish the volume of the buffer tank with each displacement cycle. 11. The photolithography system of claim 1 , wherein the buffer tank comprises a pressure-regulating system. 12. The photolithography system of claim 1 , wherein the photoresist chemical solution inlet opening and photoresist chemical solution outlet opening are each arranged in a sidewall of the variable-volume buffer tank, and wherein the valve is arranged above both the photoresist chemical solution inlet opening and the photoresist chemical solution output opening and configured to release the gas through a gas-vent opening arranged in an upper region of the variable-volume buffer tank. 13. A photolithography system, comprising: a variable-volume buffer tank; a dispensing system coupled to the variable-volume buffer tank and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers; a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space; and a bubble detector configured to detect bubbles in the head space, and configured to selectively trigger opening of the valve based on whether bubbles are detected in the head space; wherein the variable-volume buffer tank includes a photolithography chemical solution inlet and a photolithography chemical solution outlet through which the photolithography chemical solution concurrently flow when being provided to the dispensing system. 14. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a collapsible liner within a rigid shell. 15. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a piston and cylinder arrangement. 16. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a flexible container with accordion pleats. 17. The photolithography system of claim 13 , further comprising: a storage container having a storage capacity volume; and a connector forming a coupling for transferring fluid from the storage container to the variable-volume buffer tank; wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container. 18. The photolithography system of claim 17 , wherein the coupling for transferring fluid from the storage container to the variable-volume buffer tank is configured to drain the contents of the storage container from out of the bottom of the storage container. 19. The photolithography system of claim 13 , wherein the variable-volume buffer tank couples to the photolithography chemical solution dispensing system through an opening that exits the variable-volume buffer tank at a height below the head space. 20. A photolithography system, comprising: a storage container having a storage capacity volume and configured to store a photolithography chemical solution; a variable-volume buffer tank having a photolithography chemical solution inlet and a photolithography chemical solution outlet, wherein the a photolithography chemical solution inlet is configured to receive the photolithography chemical solution from the storage container through a connector, wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container; a dispensing system coupled to the photolithography chemical solution outlet and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers, wherein the photolithography chemical solution concurrently flows through the photolithography chemical inlet and the photolithography chemical solution outlet when being provided to the dispensing system; and a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space.
Photolithographic processes · CPC title
Combined with valves · CPC title
Processes · CPC title
Arrangements of flow- or pressure-control valves (associated with nozzles B67D7/42) · CPC title
Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title
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