System and method for supplying and dispensing bubble-free photolithography chemical solutions

US9817315B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9817315-B2
Application numberUS-201414208529-A
CountryUS
Kind codeB2
Filing dateMar 13, 2014
Priority dateMar 13, 2014
Publication dateNov 14, 2017
Grant dateNov 14, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A photolithography system includes a variable-volume buffer tank, a dispensing system connected to the buffer tank, and a valve configured to release gas from a head space of the buffer tank while blocking the release of liquid from the head space. A storage container has an opening at the bottom and drains to the buffer tank through that opening. The buffer tank has a storage capacity sufficient to receive the full contents of the storage container. The system supplies chemical solutions to the dispensing system while keeping the chemical solutions from contact with air and other gases.

First claim

Opening claim text (preview).

What is claimed is: 1. A photolithography system, comprising: a variable-volume buffer tank; a dispensing system connected to the variable-volume buffer tank and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers; and a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space; wherein the variable-volume buffer tank includes a photolithography chemical solution inlet and a photolithography chemical solution outlet through which the photolithography chemical solution concurrently flow when being provided to the dispensing system. 2. The photolithography system of claim 1 , further comprising: a storage container having a storage capacity volume; and a connector forming a connection for transferring fluid from the storage container to the photolithography chemical solution inlet of the variable-volume buffer tank; wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container. 3. The photolithography system of claim 2 , wherein the connection for transferring fluid from the storage container to the buffer tank is configured to drain the contents of the storage container from out of the bottom of the storage container. 4. The photolithography system of claim 1 , wherein the buffer tank comprises a collapsible liner within a rigid shell. 5. The photolithography system of claim 1 , wherein the buffer tank comprises a piston and cylinder arrangement. 6. The photolithography system of claim 1 , wherein the buffer tank comprises a flexible container with accordion pleats. 7. The photolithography system of claim 1 , wherein the valve is an electronically controlled valve. 8. The photolithography system of claim 7 , further comprising: a bubble detector configured to detect bubbles in the head space; wherein the valve is configured to open automatically in response to detection of bubbles in the head space by the bubble detector. 9. The photolithography system of claim 1 , wherein the variable-volume buffer tank connects to the photolithography chemical solution dispensing system through an opening that exits the buffer tank at a height below the head space. 10. The photolithography system of claim 1 , wherein the dispensing system comprises a positive displacement pump operative to diminish the volume of the buffer tank with each displacement cycle. 11. The photolithography system of claim 1 , wherein the buffer tank comprises a pressure-regulating system. 12. The photolithography system of claim 1 , wherein the photoresist chemical solution inlet opening and photoresist chemical solution outlet opening are each arranged in a sidewall of the variable-volume buffer tank, and wherein the valve is arranged above both the photoresist chemical solution inlet opening and the photoresist chemical solution output opening and configured to release the gas through a gas-vent opening arranged in an upper region of the variable-volume buffer tank. 13. A photolithography system, comprising: a variable-volume buffer tank; a dispensing system coupled to the variable-volume buffer tank and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers; a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space; and a bubble detector configured to detect bubbles in the head space, and configured to selectively trigger opening of the valve based on whether bubbles are detected in the head space; wherein the variable-volume buffer tank includes a photolithography chemical solution inlet and a photolithography chemical solution outlet through which the photolithography chemical solution concurrently flow when being provided to the dispensing system. 14. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a collapsible liner within a rigid shell. 15. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a piston and cylinder arrangement. 16. The photolithography system of claim 13 , wherein the variable-volume buffer tank comprises a flexible container with accordion pleats. 17. The photolithography system of claim 13 , further comprising: a storage container having a storage capacity volume; and a connector forming a coupling for transferring fluid from the storage container to the variable-volume buffer tank; wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container. 18. The photolithography system of claim 17 , wherein the coupling for transferring fluid from the storage container to the variable-volume buffer tank is configured to drain the contents of the storage container from out of the bottom of the storage container. 19. The photolithography system of claim 13 , wherein the variable-volume buffer tank couples to the photolithography chemical solution dispensing system through an opening that exits the variable-volume buffer tank at a height below the head space. 20. A photolithography system, comprising: a storage container having a storage capacity volume and configured to store a photolithography chemical solution; a variable-volume buffer tank having a photolithography chemical solution inlet and a photolithography chemical solution outlet, wherein the a photolithography chemical solution inlet is configured to receive the photolithography chemical solution from the storage container through a connector, wherein the variable-volume buffer tank has a maximum volume that is greater than the storage capacity volume of the storage container; a dispensing system coupled to the photolithography chemical solution outlet and configured to dispense a photolithography chemical solution from the variable-volume buffer tank onto wafers, wherein the photolithography chemical solution concurrently flows through the photolithography chemical inlet and the photolithography chemical solution outlet when being provided to the dispensing system; and a valve configured to release gas from a head space of the variable-volume buffer tank while blocking the release of liquid from the head space.

Assignees

Inventors

Classifications

  • Photolithographic processes · CPC title

  • Combined with valves · CPC title

  • Processes · CPC title

  • Arrangements of flow- or pressure-control valves (associated with nozzles B67D7/42) · CPC title

  • G03F7/16Primary

    Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9817315B2 cover?
A photolithography system includes a variable-volume buffer tank, a dispensing system connected to the buffer tank, and a valve configured to release gas from a head space of the buffer tank while blocking the release of liquid from the head space. A storage container has an opening at the bottom and drains to the buffer tank through that opening. The buffer tank has a storage capacity sufficie…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P76/2041. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).