Micromechanical moisture sensor device, corresponding manufacturing method, and micromechanical sensor system

Patent metadata

Field	Value
Publication number	US-9816953-B2
Application number	US-201414304394-A
Country	US
Kind code	B2
Filing date	Jun 13, 2014
Priority date	Jun 18, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A micromechanical moisture sensor device includes: a substrate having a front side and a rear side; an interdigital printed conductor track arrangement provided above and/or below the front side of the substrate; and a moisture-sensitive polymer layer situated above and in the gaps of the interdigital printed conductor track arrangement. The moisture-sensitive polymer layer extends below the front side into the substrate.

First claim

What is claimed is:

1. A micromechanical moisture sensor device, comprising:
a substrate having a front side and a rear side;
an interdigital printed conductor track arrangement provided at least one of above and below the front side of the substrate; and
a moisture-sensitive polymer layer situated (i) above the interdigital printed conductor track arrangement and (ii) in gaps of the interdigital printed conductor track arrangement;
wherein the moisture-sensitive polymer layer extends into the substrate below the front side.

2. The micromechanical moisture sensor device as recited in claim 1 , wherein the moisture-sensitive polymer layer extends into trenches in the substrate situated in the gaps of the interdigital printed conductor track arrangement.

3. The micromechanical moisture sensor device as recited in claim 1 , wherein the moisture-sensitive polymer layer extends into a well in the substrate which is (i) filled with the moisture-sensitive polymer layer and (ii) situated below the interdigital printed conductor track arrangement.

4. The micromechanical moisture sensor device as recited in claim 1 , wherein the interdigital printed conductor track arrangement has a first interdigital printed conductor track arrangement provided above the front side of the substrate and a second interdigital printed conductor track arrangement parallel to the first interdigital printed conductor track arrangement and provided below the front side of the substrate, and wherein the first and second interdigital printed conductor track arrangements are arranged one above the other and electrically connected to each other.

5. The micromechanical moisture sensor device as recited in claim 1 , wherein a potential well is formed in the substrate, the interdigital printed conductor track arrangement is arranged over the potential well, and the moisture-sensitive polymer layer extends into the potential well.

6. The micromechanical moisture sensor device as recited in claim 5 , wherein the potential well is a p-well.

7. The micromechanical sensor system as recited in claim 1 , further comprising:
a pressure sensor device integrated into the substrate.

8. The micromechanical sensor system as recited in claim 7 , wherein the pressure sensor device has a diaphragm area including at least one piezoresistor provided one of (i) in the diaphragm area or (ii) on the diaphragm area.

9. The micromechanical sensor system as recited in claim 7 , wherein the pressure sensor device is a capacitive pressure sensor device.

10. The micromechanical moisture sensor device as recited in claim 1 , further comprising an insulating layer on the front side of the substrate, wherein the moisture-sensitive polymer layer extends into and through the insulating layer.

11. The micromechanical moisture sensor device as recited in claim 10 , wherein the interdigital printed conductor track arrangement is provided on the insulating layer.

12. The micromechanical moisture sensor device as recited in claim 11 , wherein the insulating layer is formed of silicon nitride.

13. A method for manufacturing a micromechanical moisture sensor device, comprising:
providing a substrate having a front side and a rear side;
forming an interdigital printed conductor track arrangement provided at least one of above and below the front side of the substrate; and
forming a moisture-sensitive polymer layer situated (i) above the interdigital printed conductor track arrangement and (ii) in gaps of the interdigital printed conductor track arrangement, wherein the moisture-sensitive polymer layer extends into the substrate below the front side.

14. The method as recited in claim 13 , wherein trenches are formed in the substrate in the gaps of the interdigital printed conductor track arrangement and are filled with the moisture-sensitive polymer layer such that the moisture-sensitive polymer layer extends into the trenches in the substrate.

15. The method as recited in claim 13 , wherein a well is formed in the substrate below the interdigital printed conductor track arrangement and is filled with the moisture-sensitive polymer layer such that the moisture-sensitive polymer layer extends into the well in the substrate.

16. The method as recited in claim 13 , wherein the interdigital printed conductor track arrangement is configured to include a first interdigital printed conductor track arrangement provided above the front side of the substrate and a second interdigital printed conductor track arrangement parallel to the first interdigital printed conductor track arrangement and provided below the front side of the substrate, and wherein the first and second interdigital printed conductor track arrangements are arranged one above the other and electrically connected to each other.

17. The method as recited in claim 13 , further comprising:
providing a pressure sensor device integrated into the substrate.

18. The method as recited in claim 13 , further comprising forming trenches in a plane below the interdigital printed conductor track arrangement, wherein lateral positions of the trenches are between lateral positions of conductor tracks of the interdigital printed conductor track arrangement, the forming of the trenches includes etching using the interdigital printed conductor track arrangement as a mask, and the forming of the moisture-sensitive polymer layer includes depositing moisture-sensitive polymer material in the trenches.

19. A micromechanical moisture sensor device comprising:
a substrate having a front side and a rear side;
an interdigital printed conductor track arrangement provided at least one of above and below the front side of the substrate; and
a moisture-sensitive polymer layer situated (i) above the interdigital printed conductor track arrangement and (ii) in gaps of the interdigital printed conductor track arrangement
wherein the moisture-sensitive polymer layer extends from above the interdigital printed conductor track arrangement into the substrate below the front side and below a lowest edge of the interdigital printed conductor track arrangement.

Assignees

• Bosch Gmbh Robert

Inventors

• Franz Jochen
• Schiller Uwe

Classifications

• G01N27/223 Primary

  for determining moisture content, e.g. humidity (rain detectors on vehicle windows B60S1/0825) · CPC title

• G01N27/048

  for determining moisture content of the material · CPC title