Heat exchanger having a passage pipe

Patent metadata

Field	Value
Publication number	US-9816762-B2
Application number	US-201113068429-A
Country	US
Kind code	B2
Filing date	May 11, 2011
Priority date	May 21, 2010
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

An inner fin is a wave fin having board portions extending in a pipe longitudinal direction and a top portion connecting the board portions located adjacent with each other. The wave fin has a wave-shaped cross-section perpendicularly intersecting a pipe longitudinal direction, and the board portion is bent into a waveform extending in the pipe longitudinal direction when seen from a pipe layering direction. A wave pitch WP [mm], a wave depth WD [mm], and a passage width H [mm] are set to satisfy relationships of 2.2≦WP/WD≦4.28 and 0.5≦WD/H≦1.8.

First claim

What is claimed is:

1. A heat exchanger comprising:
a passage pipe having a thermal medium passage through which thermal medium passes; and
a plurality of inner fins layered in the passage pipe, the plurality of fins dividing the passage into a plurality of small passages and increasing a heat transmitting area between the thermal medium and the passage pipe, wherein
the thermal medium flows through the small passages in a laminar flow range with Reynolds number of 1000 or less,
each of the plurality of inner fins has board portions extending in a longitudinal direction of the passage pipe, and a top portion which connects the board portions located adjacent with each other, the inner fin being a wave fin having a wave-shaped cross-section perpendicularly intersecting the longitudinal direction, the board portion having a waveform extending in the longitudinal direction when seen from a layering direction of the plurality of inner fins,
a direction perpendicular to both of the longitudinal direction of the passage pipe and the layering direction of the inner fins is defined as a pipe width direction,
the inner fin has a wave pitch WP defined by a pitch of the waveform of the board portion, a wave depth WD defined by a dimension of the waveform of the board portion in an amplitude direction, and a passage width H defined by a distance between the board portions located adjacent to each other in the pipe width direction, in a cross-section perpendicularly intersecting the layering direction in the longitudinal direction and passing a center part of the small passage in the layering direction, and
the wave pitch WP and the wave depth WD are set to meet a relationship represented by the following Expression 1 and Expression 2
wherein Expression 1 is
2.2≦WP/WD≦3

wherein Expression 2 is
0.5≦WD/ H≦ 1.8;

wherein a cross-sectional shape of the inner fin perpendicularly intersecting the longitudinal direction has a trapezoid wave shape;
wherein the wave pitch WP and the wave depth WD are set to meet the relationship represented by Expression 1 and Expression 2 in the cross-section perpendicularly intersecting the layering direction and passing the center part of the small passage in the layering direction in a state where the cross-sectional shape of the inner fin perpendicularly intersecting the longitudinal direction has the trapezoid wave shape;
wherein the inner fin has a triangle wave shape extending in the longitudinal direction and has the trapezoid wave shape extending in the pipe width direction; and
wherein each of the inner fins stacked in the layering direction is offset and staggered in a direction perpendicular to the layering direction.

2. The heat exchanger according to claim 1 , wherein
the thermal medium passing through the small passage has Reynolds number equal to or less than 500.

3. The heat exchanger according to claim 1 , further comprising:
a communication portion; and an object to exchange heat with thermal medium, wherein
the passage pipe is one of a plurality of passage pipes,
the plurality of passage pipes communicate with each other by the communication portion, and
the object is arranged outside of the plurality of passage pipes.

4. The heat exchanger according to claim 1 , wherein the plurality of layered fins are disposed in a single thermal medium passage.

5. The heat exchanger according to claim 1 , wherein mixing of the thermal medium is promoted by the inner fin.

6. The heat exchanger according to claim 1 , wherein each of the plurality of fins is in direct contact with an adjacent fin.

7. The heat exchanger according to claim 1 , wherein the plurality of fins include three fins stacked in the layering direction.

8. The heat exchanger according to claim 7 , wherein each of the plurality of fins is in direct contact with an adjacent fin.

9. The heat exchanger according to claim 7 , wherein a first fin of the three fins is in direct contact with the passage pipe, a second fin of the three fins is in direct contact with the passage pipe and a third fin of the three fins is disposed between the first and second fins.

10. The heat exchanger according to claim 9 , wherein each of the small passages defined by the third fin being in direct fluid communication with an adjacent small passage defined by one of the first and second fins.

11. The heat exchanger according to claim 9 , wherein a first top portion of the third fin is in direct contact with a top portion of the first fin and a second top portion of the third fin is in direct contact with a top section of the second fin.

12. The heat exchanger according to claim 9 , wherein each of the three fins defines a triangular waveform extending in the longitudinal direction, the triangular waveform of the third fin being opposite to the triangular waveform of the first and second fin.

13. The heat exchanger according to claim 12 , wherein each of the small passages defined by the third fin being in direct fluid communication with an adjacent small passage defined by one of the first and second fins.

14. The heat exchanger according to claim 1 , wherein each of the small passages defined by one of the plurality of fins stacked in the layering direction is asymmetrical to each of the small passages defined by an adjacent fin.

15. The heat exchanger according to claim 1 , wherein each of the small passages defined by one of the plurality of fins stacked in the layering direction is offset and staggered from each of the small passages defined by an immediately adjacent fin.

16. The heat exchanger according to claim 1 , wherein a center point of each top portion defined by one of the plurality of fins stacked in the layering direction is not aligned with a center point of each top portion defined by an adjacent fin.

17. The heat exchanger according to claim 1 , wherein adjacent top portions defined by each of the plurality of fins include alternating adjacent top portions in the longitudinal direction when seen from the layering direction.

18. The heat exchanger according to claim 1 , wherein adjacent top portions defined by each of the plurality of fins share board portions.

19. The heat exchanger according to claim 1 , wherein a first fin of the plurality of inner fins opposes to a first object to exchange heat with thermal medium outside of the passage pipe, and a second fin of the plurality of inner fins opposes to a second object to exchange heat with thermal medium outside of the passage pipe.

20. The heat exchanger according to claim 1 , wherein the plurality of fins include three fins stacked in the layering direction, the second fin of the three fins Is disposed between the first fin of the three fins and the third fin of the three fins, and wherein a center point of each top portion defined by the first fin is aligned with a center point of each top portion defined by the third fin.

Assignees

• Sugimoto Naoki
• Denso Corp

Inventors

• Sugimoto Naoki

Classifications

• H10W40/613

  for stacked arrangements of a plurality of semiconductor devices · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L23/473

  Electricity · mapped topic

• F28D1/0316

  Assemblies of conduits in parallel (F28D1/0325, F28D1/035 take precedence) · CPC title

• H01L2924/0002

  Electricity · mapped topic