Configuration and method of operation of an electrodeposition system for improved process stability and performance

Patent metadata

Field	Value
Publication number	US-9816193-B2
Application number	US-201113324890-A
Country	US
Kind code	B2
Filing date	Dec 13, 2011
Priority date	Jan 7, 2011
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.

First claim

What is claimed is:

1. A method of electroplating a substrate using a controller, the controller having a processor and a memory, the memory containing machine-readable instructions executable by the processor for controlling the level of active oxygenation of a plating solution, the method comprising:
(a) reducing an oxygen concentration of a plating solution, wherein the plating solution includes about 100 parts per million or less of an accelerator;
(b) after operation (a), contacting, in a plating cell, a wafer substrate with the plating solution, wherein the oxygen concentration of the plating solution in the plating cell is about 1 part per million or less;
(c) electroplating a metal with the plating solution onto the wafer substrate in the plating cell, wherein the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; and
(d) after operation (c), using the controller to increase an oxidizing strength of the plating solution outside the plating cell by controlling the level of active oxygenation of the plating solution, wherein the increased oxidizing strength causes a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.

2. The method of claim 1 , wherein the accelerator is bis (3-sulfopropyl) disulfide (SPS), and the less-oxidized accelerator species is mercaptopropanesulfonic acid (MPS).

3. The method of claim 1 , further comprising:
supplying the plating solution to the plating cell from a plating reservoir, wherein the oxygen concentration of the plating solution in the plating reservoir is 2-5 parts per million, and wherein reducing the oxygen concentration of the plating solution is performed as the plating solution is supplied from the plating reservoir.

4. The method of claim 1 , wherein operation (d) includes exposing the plating solution to a gas containing an oxidizing agent, and wherein the gas is selected from the group consisting of air, oxygen, ozone, and nitrous oxide.

5. The method of claim 1 , wherein operation (d) includes exposing the plating solution to a gas containing an oxidizing agent by bubbling the gas through the plating solution, and wherein the gas is selected from the group consisting of air, oxygen, ozone, and nitrous oxide.

6. The method of claim 1 , wherein operation (d) includes exposing the plating solution to a gas containing an oxidizing agent while increasing the gas contact area of the plating solution, and wherein the gas is selected from the group consisting of air, oxygen, ozone, and nitrous oxide.

7. The method of claim 1 , wherein operation (d) includes mixing a liquid containing an oxidizing agent into the plating solution.

8. The method of claim 7 , wherein the liquid includes hydrogen peroxide.

9. The method of claim 1 , wherein operation (a) is performed by sparging the plating solution using helium or nitrogen.

10. The method of claim 1 , wherein operation (a) improves the stability of the plating solution.

11. The method of claim 1 , wherein operation (d) improves the fill characteristics of the plating solution for filling a feature on the wafer substrate.

12. The method of claim 1 , further comprising:
applying photoresist to the wafer substrate;
exposing the photoresist to light;
patterning the photoresist and transferring the pattern to the wafer substrate; and
selectively removing the photoresist from the wafer substrate.

13. The method of claim 1 , further comprising:
monitoring an oxygen concentration of the plating solution;

wherein, in operation (d), the controller adjusts the level of active oxygenation of the plating solution in response to said monitored oxygen concentration.

14. The method of claim 1 , wherein, in operation (d), the controller controls the level of active oxygenation to increase an oxygen concentration of the plating solution outside the plating cell to 2-5 parts per million.

15. The method of claim 1 , wherein, in operation (d), the controller controls the level of active oxygenation of the plating solution by introducing an oxidizing agent into the plating solution.

16. The method of claim 1 , further comprising: repeating operations (a) and (d), wherein the plating solution flows through the plating cell while operation (c) is performed.

Assignees

• Ganesan Kousik
• Spurlin Tighe
• Reid Jonathan D
• Ghongadi Shantinath
• Mckerrow Andrew
• Duncan James E
• Novellus Systems Inc

Inventors

• Ganesan Kousik
• Spurlin Tighe
• Reid Jonathan D
• Ghongadi Shantinath
• Mckerrow Andrew
• Duncan James E

Classifications

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D5/003

  Electroplating using gases, e.g. pressure influence · CPC title

• C25D3/38 Primary

  of copper · CPC title

• C25D21/14 Primary

  Controlled addition of electrolyte components · CPC title