Polyamide moulding composition and use thereof

US9815968B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9815968-B2
Application numberUS-201615169448-A
CountryUS
Kind codeB2
Filing dateMay 31, 2016
Priority dateAug 28, 2012
Publication dateNov 14, 2017
Grant dateNov 14, 2017

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Abstract

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A thermoplastic moulding composition, in particular a polyamide moulding composition, consisting of, by weight: (A) 20-88%—thermoplastic material; (B) 10-60%—fibrous fillers, formed from (B1) 10-60%—glass fibers, selected from: glass fibres (B1_1) with a non-circular cross section, wherein the axis ratio of the main cross-sectional axis to the secondary cross-sectional axis is at least 2; high-strength glass fibres (B1_2) with a glass composition (substantially SiO2, AlO, and MgO; or mixtures thereof; (B2) 0-20%—glass fibres, different from glass fibres of component (B1) and have a circular cross section; and (B3) 0-20%—further fibrous tillers, different from fibres of (B1) and (B2), not based on glass, and selected from the group: carbon fibres, graphite fibres, aramid fibres, nanotubes; (C) 2-10%—LDS additive or a mixture of LDS additives; (D) 0-30%—particulate filler; (E) 0-2%—further, different additives; the sum of (A)-(E) is 100% by weight.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermoplastic moulding composition consisting of: (A) 20-63% by weight of a thermoplastic material consisting of polyamide (A1) or a mixture of polyamides, wherein said polyamide (A1) or mixture of polyamides is selected to be at least one semicrystalline aliphatic polyamide (A1_1) or a mixture of at least one semicrystalline aliphatic polyamide (A1_1) with at least one amorphous polyamide (A1_3), wherein the at least one semicrystalline aliphatic polyamide (A1_1) is selected from the group consisting of at least one of PA12 and PA1010 and wherein the at least one amorphous polyamide (A1_3) is selected to be PA6I/6T with a proportion ratio 6T:6I in the range of 20:80 to 45:55; (B) 35-60% by weight of high-strength glass fibres (B1_2) based on the ternary system silicon dioxide/aluminium oxide/magnesium oxide or on the quaternary system silicon dioxide/aluminium oxide/magnesium oxide/calcium oxide, and having the following composition: 58-70% by weight of silicon dioxide (SiO 2 ), 15-30% by weight of aluminium oxide (Al 2 O 3 ), 5-15% by weight of magnesium oxide (MgO), 0-10% by weight of calcium oxide (CaO) and 0-2% by weight of further different oxides; (C) 3-6% by weight of laser direct structuring additive or a mixture of laser direct structuring additives, wherein the component (C) is copper(I) oxide, copper(II) oxide, or mixtures of such systems; (D) 0% by weight of particulate filler; (E) 0-2% by weight of further, different additives; wherein the sum of (A)-(E) makes up 100% by weight. 2. The moulding composition according to claim 1 , wherein the proportion of component (A) lies in the range of 25-63% by weight. 3. The moulding composition according to claim 1 , wherein the high-strength glass fibre (B1_2) has a circular cross section. 4. The moulding composition according to claim 1 , wherein the component (C) is an laser direct structuring additive with an absorption coefficient, different from zero, for ultraviolet, visible or infrared radiation, which forms metal nuclei under the action of electromagnetic radiation, and facilitates and/or enables and/or improves the chemical metallising deposition of conductor tracks at the irradiated points. 5. The moulding composition according to claim 4 , wherein the component (C) is an laser direct structuring additive with an average particle size (D50) in the range of 50-10,000 nanometres, and/or has an aspect ratio of at most 10. 6. The moulding composition according to claim 1 , wherein the glass fibres of component (B) are present in the form of short fibres, or in the form of endless fibres. 7. A component based on a moulding composition according to claim 1 . 8. The moulding composition as claimed in claim 1 , wherein the high-strength glass fibres of component (B1_2) have the following composition: 60-67% by weight of silicon dioxide (SiO 2 ), 20-28% by weight of aluminium oxide (Al 2 O 3 ), 7-12% by weight of magnesium oxide (MgO), 0-9% by weight of calcium oxide (CaO) and 0-1.5% by weight of further oxides. 9. The moulding composition according to claim 1 , wherein the glass fibres of component (B) are present in the form of short fibres, in the form of cut glass with a length in the range of 0.2-20 mm. 10. A component having electrical conductor tracks, based on a moulding composition according to claim 1 . 11. A component having electrical conductor tracks, based on a moulding composition according to claim 1 , as a casing or casing part for portable electronic devices, as PDAs, mobile telephones, telecommunications devices, casings or casing parts for personal computers, notebooks, medical devices, i hearing aids, sensor technology, or RFID transponders or parts for the automotive field, as air bag modules and multi-function steering wheels. 12. The molding composition according to claim 1 , wherein the component (C) is a chelate compound of, copper(I) oxide, copper (II) oxide or mixtures of such systems.

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What does patent US9815968B2 cover?
A thermoplastic moulding composition, in particular a polyamide moulding composition, consisting of, by weight: (A) 20-88%—thermoplastic material; (B) 10-60%—fibrous fillers, formed from (B1) 10-60%—glass fibers, selected from: glass fibres (B1_1) with a non-circular cross section, wherein the axis ratio of the main cross-sectional axis to the secondary cros…
Who is the assignee on this patent?
Ems Patent Ag
What technology area does this patent fall under?
Primary CPC classification C08K7/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).