Encapsulant film

Patent metadata

Field	Value
Publication number	US-9815924-B2
Application number	US-201314655020-A
Country	US
Kind code	B2
Filing date	Dec 24, 2013
Priority date	Dec 24, 2012
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.

First claim

The invention claimed is:

1. An encapsulant film, comprising:
a copolymer comprising
a main chain, said main chain comprising a polymerization unit derived from an olefin-based monomer; and
branched chains bound to the main chain,

wherein a silanol group and an amine group are present in one or more of the branched chains, and
wherein the encapsulant film has a peel strength of 160 N/15 mm or more when the encapsulant film is disposed on a glass substrate, as measured at a peel angle of 90° and a peel rate of 50 mm/min according to ASTM D1897.

2. The encapsulant film of claim 1 , wherein the encapsulant film has a peel strength of 180 N/15 mm or more with respect to the glass substrate, as measured at a peel angle of 90° and a peel rate of 50 mm/min according to ASTM D1897.

3. The encapsulant film of claim 1 , wherein a yellowness index (YI) value is in a range of 0.5 to 2.5, as calculated by measuring a reflectance in a wavelength region of 400 nm to 700 nm using a UV/Vis spectrometer according to the ASTM D1925 standard and applying the reflectance to the following Equation 2:
YI =[100(1.28 X CIE −1.06 Z CIE )]/ Y CIE   [Equation 2]

wherein YI is a value calculated by a UV/Vis spectrometer using a color difference analysis program, and X CIE , Y CIE and Z CIE are relative values represented by red, green, and blue color coordinates, respectively.

4. The encapsulant film of claim 1 , wherein a ratio (S a /S m ) of a peak area (S a ) of silanol groups and amine groups in the film in a wavenumber range of 3,100cm −1 to 3,600 cm −1 to a peak area (S m ) of methylene groups in a wavenumber range of 705 cm −1 to 735 cm −1 is 0.6 or more, as measured by FT-IR using an attenuated total reflection (ATR) method.

5. The encapsulant film of claim 4 , wherein the ratio (S a /S m ) of the peak area (S a ) of the silanol groups and the amine groups to the peak area (S m ) of the methylene groups is 0.9 or more.

6. The encapsulant film of claim 1 , wherein the branched chains comprise the following Formula 1:
—SiR 1 1 R 2 (2−l) R 3   [Formula 1]

wherein R 1 and R 2 each independently represent a halogen, an amine group, —R 4 R 5 , or —R 5 being bound to a silicon atom;
R 4 represents oxygen, or a sulfur atom;
R 5 represents hydrogen, an alkyl group, an aryl group, an aralkyl group, or an acyl group;
lis an integer of 1 or 2;
R 3 represents —OSiR 6 m R 7 (2−m) R 8 bound to a silicon atom;
R 6 and R 7 each independently represent a halogen, an amine group, —R 9 R 10 , or —R 10 bound to a silicon atom;
R 9 represents oxygen, or a sulfur atom;
R 10 represents hydrogen, an alkyl group, an aryl group, an aralkyl group, or an acyl group;
R 8 represents —(CH 2 ) n NR 11 R 12 bound to a silicon atom;
R 11 and R 12 each independently represent hydrogen, or R 13 NH 2 bound to a nitrogen atom;
R 13 represents alkylene group;
m is an integer of 1 or 2; and
n is an integer greater than or equal to 0.

7. The encapsulant film of claim 6 , wherein R 1 and R 2 each independently represent a hydroxyl group;
R 3 represents —OSiR 6 m R 7 ( 2−m )R 8 bound to the silicon atom;
R 6 and R 7 each independently represent a hydroxyl group;
R 8 represents —(CH 2 ) n NR 11 R 12 bound to the silicon atom;
R 11 represents hydrogen;
R 12 represents R 13 NH 2 , and
R 13 represents an alkylene group.

8. The encapsulant film of claim 6 , wherein the copolymer further comprises a branched chain bound to the main chain and represented by the following Formula 2:
—SiR 14 o R 15 ( 3−o )   [Formula 2]

wherein R 14 and R 15 each independently represent a halogen, an amine group, —R 16 R 17 , or —R 17 bound to a silicon atom;
R 16 represents oxygen, or a sulfur atom;
R 17 represents hydrogen, an alkyl group, an aryl group, an aralkyl group, or an acyl group; and
o is an integer ranging from 1 to 3.

9. The encapsulant film of claim 8 , wherein R 14 and R 15 each independently represent a hydroxyl group or —R 16 R 17 bound to a silicon atom;
R 16 represents oxygen; and
R 17 represents an alkyl group.

Assignees

• Lg Chemical Ltd

Inventors

• Choi Sung Ho
• Lee Choong Hoon
• Woo Ji Yoon
• Kim Hyo Ju
• Gong Jin Sam

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C08F255/02

  on to polymers of olefins having two or three carbon atoms · CPC title

• C08L51/003

  grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds (C08L51/04, C08L51/06 take precedence) · CPC title

• C08L23/08

  Copolymers of ethene (C08L23/16 takes precedence) · CPC title