Lead-free glass and sealing material

Patent metadata

Field	Value
Publication number	US-9815735-B2
Application number	US-201414906800-A
Country	US
Kind code	B2
Filing date	Aug 14, 2014
Priority date	Aug 29, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Disclosed is a lead-free glass, which is characterized by comprising 5-55 weight % of V 2 O 5 , 5-75 weight % of TeO 2 , 6-20 weight % of a total of RO (at least one selected from the group consisting of MgO, CaO, SrO and BaO) and 0.1-6 weight % of ZnO in a glass component, V 2 O 5 +TeO 2 +RO+ZnO being 70 weight % or greater. From this lead-free glass, a sealing material having fluidity which is capable of sealing at 400° C. or lower can be obtained.

First claim

The invention claimed is:

1. A lead-free glass, comprising 5-55 weight % of V 2 O 5 ; 38-46.8 weight % of TeO 2 ; 6-20 weight % of a total of RO, wherein RO is at least one selected from the group consisting of MgO, CaO, SrO and BaO; and 0.1-6 weight % of ZnO in a glass component; wherein V 2 O 5 +TeO 2 +RO+ZnO is 70 weight % or greater.

2. The lead-free glass according to claim 1 , further comprising 0.1-10 weight % of a total of at least one selected from the group consisting of Fe 2 O 3 , NiO, Al 2 O 3 and CoO in the glass component.

3. The lead-free glass according to claim 1 , wherein a softening point of the lead-free glass is 380° C. or lower.

4. The lead-free glass according to claim 1 , comprising at least BaO as RO.

5. A sealing material comprising the lead-free glass according to claim 1 and an inorganic filler, the sealing material comprising the inorganic filler in a range of 1-35 volume % relative to a total volume of the lead-free glass and the inorganic filler.

6. The sealing material according to claim 5 , that wherein the inorganic filler is zirconium phosphate or zirconium tungsten phosphate.

7. A glass paste, comprising a glass powder composed of the lead-free glass according to claim 1 and an organic vehicle.

8. A method of manufacturing an electronic component, comprising the step of conducting baking and sealing at a temperature exceeding a softening point after applying the glass paste according to claim 7 .

9. The method of manufacturing the electronic component according to claim 8 , wherein the baking temperature is 400° C. or lower in the baking step.

10. The lead-free glass according to claim 1 , wherein V 2 O 5 +TeO 2 +RO+ZnO+R 2 O+Fe 2 O 3 +NiO+Al 2 O 3 +CoO+ZrO 2 are 100 weight %.

Assignees

• Central Glass Co Ltd

Inventors

• Miyazawa Masamichi
• Hamada Jun

Classifications

• C03C3/122

  containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers · CPC title

• C03C8/04

  containing zinc · CPC title

• C03C8/24 Primary

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title