Methods for manufacturing a Z-directed printed circuit board component having a removable end portion

Patent metadata

Field	Value
Publication number	US-9814145-B2
Application number	US-201514631192-A
Country	US
Kind code	B2
Filing date	Feb 25, 2015
Priority date	Aug 31, 2011
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

First claim

The invention claimed is:

1. A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
filling a first cavity having a tapered surface with a body material to form a tapered end portion of the Z-directed component;
providing a first layer of a constraining material on top of the first cavity, the first layer of the constraining material having a second cavity having a width that is smaller than a width of the first cavity;
filling the second cavity with the body material;
providing successive layers of the constraining material on top of the first layer of the constraining material, each of the successive layers of the constraining material having an additional cavity defining an outer shape of a corresponding layer of a main body portion of the Z-directed component;
selectively filling the additional cavities of the successive layers of the constraining material with at least the body material to form the corresponding layers of the main body portion of the Z-directed component;
dissipating the constraining material to release the Z-directed component from the constraining material; and
firing the Z-directed component.

2. The method of claim 1 , wherein the first cavity includes a protrusion on a bottom surface thereof that forms a corresponding indentation in an end surface of the tapered end portion of the Z-directed component for engaging a tool for removing the tapered end portion of the Z-directed component.

3. The method of claim 1 , further comprising forming the first cavity in a substrate that supports the layers of the constraining material.

4. The method of claim 1 , further comprising forming the first cavity in a release layer coated on a substrate that supports the layers of the constraining material.

5. The method of claim 4 , further comprising forming the first cavity in the release layer by gray scale lithography.

Assignees

• Lexmark Int Inc

Inventors

• Hardin Keith Bryan
• Hall Paul Kevin
• Zhang Qing
• Fessler John Thomas

Classifications

• H05K1/0222 Primary

  for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence · CPC title

• H05K2201/10893

  Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator · CPC title

• H05K2201/09809

  Coaxial layout · CPC title

• H05K2201/09645

  Patterning on via walls; Plural lands around one hole · CPC title

• H05K1/0251

  related to vias or transitions between vias and transmission lines · CPC title