Elastic flexible substrate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9814134-B2
Application number	US-201514626935-A
Country	US
Kind code	B2
Filing date	Feb 20, 2015
Priority date	Mar 31, 2014
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

An elastic flexible substrate includes an insulating base material having a first insulating film and a second insulating film, and a plurality of wires, each of which is disposed on one of the first insulating film and the second insulating film. The insulating base material has a plurality of bonding portions that are surface-bonded, openings are formed between the bonding portions, and two of the plurality of wires are electrically connected in the bonding portions.

First claim

What is claimed is:

1. An elastic flexible substrate comprising:
a base made of insulating material, the insulating base having a first insulating film and a second insulating film, and
a plurality of wires, each of which is disposed on one of the first insulating film or the second insulating film,
wherein:
the first insulating film and the second insulating film have a plurality of bonding portions where the first insulating film and the second insulating film are surface-bonded to one another,
each of the plurality of wires being disposed in at least one of the plurality of bonding portions;
a plurality of openings are formed by the first insulating film, the second insulating film and the bonding portions, each of the plurality of openings being wholly enclosed by the first insulating film, the second insulating film and the bonding portions when viewed in plan, and
two of the plurality of wires are electrically connected in the bonding portions.

2. The elastic flexible substrate according to claim 1 , wherein:
in the plurality of bonding portions, the first insulating film and the second insulating film are bonded at a plurality of places at intervals.

3. The elastic flexible substrate according to claim 1 , wherein the bonding portions are surface-bonded through an adhesive.

4. The elastic flexible substrate according to claim 1 , wherein:
the first insulating film has two principal surfaces;
one of the plurality of wires are disposed on each of the two principal surfaces; and
the wire disposed on one principal surface of the two principal surfaces and the wire disposed on the other principal surface are interconnected through a connection via provided in the first insulating film.

5. The elastic flexible substrate according to claim 1 , wherein:
the first insulating film has a first principal surface and a second principal surface;
the first insulating film has one of the plurality of wires disposed on the first principal surface; and
the first insulating film is bent with the second principal surface facing inward, thereby bonding opposed portions of the second principal surface through an adhesive layer.

6. The elastic flexible substrate according to claim 1 , wherein the bonding portions serve as partitions that divide the adjacent openings.

7. The elastic flexible substrate according to claim 1 , wherein a first wire of the plurality of wires which is disposed of the first insulating film is arranged in a first direction and a second wire of the plurality of wires which is disposed of the second insulating film is arranged in a second direction that is different from the first direction.

8. The elastic flexible substrate according to claim 1 , wherein:
an electronic device is disposed on at least one of the plurality of wires; and
the electronic device is electrically connected to the at least one of the plurality of wires.

9. The elastic flexible substrate according to claim 1 , wherein the insulating base is transparent to visible light.

10. The elastic flexible substrate according to claim 5 , wherein the first insulating film is bent along a longitudinal direction of the first insulating film or a direction orthogonal to the longitudinal direction.

11. The elastic flexible substrate according to claim 8 , wherein the electronic device is at least one selected from the group consisting of a semiconductor device, a sensor element, and an actuator.

12. An elastic flexible substrate manufacturing method comprising:
(i) forming a base made of insulating material, the insulating base having a first insulating film and a second insulating film;
(ii) disposing a first wire on the first insulating film and disposing a second wire on the second insulating film; and
(iii) forming bonding portions where the first insulating film and the second insulating film are surface-bonded to one another,
wherein the first wire and the second wire are disposed in at least one of the plurality of bonding portions;
a plurality of openings are formed by the first insulating film, the second insulating film and the bonding portions, each of the plurality of openings being wholly enclosed by the first insulating film, the second insulating film and the bonding portions when viewed in plan, and
the first wire and the second wire are electrically connected in the bonding portions.

13. The elastic flexible substrate manufacturing method according to claim 12 , further comprising:
bending the first insulating film and the second insulating film between the steps of (ii) and (iii).

14. The elastic flexible substrate manufacturing method according to claim 12 , wherein the first wire disposed on the first insulating film and the second wire disposed on the second insulating film are brought into mutual contact and electrically connected in the bonding portions.

15. The elastic flexible substrate manufacturing method according to claim 12 , wherein the first insulation film has two principal surfaces, the first wire is disposed on one of the principal surfaces and another wire is disposed on the other principal surface, the first wire and the another wire are interconnected through a connection via provided in the first insulating film.

16. The elastic flexible substrate manufacturing method according to claim 12 , wherein the first wire is disposed on a first principal surface of the first insulating film, the first insulating film is bent with a second principal surface of the first insulating film facing inward, and then mutually opposed portions of the second principal surface of the first insulating film are bonded together using an adhesive.

17. The elastic flexible substrate manufacturing method according to claim 13 , wherein, at the step of (iii), mutually opposed portions of the bent first insulating film and the bent second insulating film are surface-bonded at intervals.

18. An elastic flexible substrate comprising:
a base made of insulating material, the insulating base having a first insulating film and a second insulating film, and
a plurality of wires, each of which is disposed on one of the first insulating film or the second insulating film,
wherein:
the first insulating film and the second insulating film have a plurality of bonding portions where the first insulating film and the second insulating film are surface-bonded to one another,
each of the plurality of wires being disposed in at least one of the plurality of bonding portions;
a plurality of openings are formed by the first insulating film, the second insulating film and the bonding portions, each of the plurality of openings being wholly enclosed by the first insulating film, the second insulating film and the bonding portions when viewed in plan, and
the bonding portions serve as partitions that divide the adjacent openings.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Wakuda Daisuke
• Ogura Tetsuyoshi
• Matsumoto Takashi

Classifications

• Y10T29/49162

  by using wire as conductive path · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/103

  by bonding or embedding conductive wires or strips · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title