Magnetic field sensor integrated circuit with integral ferromagnetic material

Patent metadata

Field	Value
Publication number	US-9812588-B2
Application number	US-201313748999-A
Country	US
Kind code	B2
Filing date	Jan 24, 2013
Priority date	Mar 20, 2012
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.

First claim

What is claimed is:

1. A magnetic field sensor comprising:
a lead frame having a first surface and a second opposing surface;
a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame;
a non-conductive mold material enclosing the die and at least a portion of the lead frame; and
a ferromagnetic mold material secured to a portion of the non-conductive mold material, wherein the ferromagnetic mold material comprises a central aperture having a surface extending from the non-conductive mold material to an outer peripheral surface of the ferromagnetic mold material, wherein the surface of the central aperture comprises a bend at an intermediate location such that the surface of the central aperture has a first slope from the non-conductive mold material to the bend and a second slope different than the first slope from the bend to the outer peripheral surface of the ferromagnetic mold material.

2. The magnetic field sensor of claim 1 wherein the ferromagnetic mold material is further secured to and in direct contact with a second portion of the lead frame that extends beyond the non-conductive mold material and terminates in the ferromagnetic mold material.

3. The magnetic field sensor of claim 1 wherein the ferromagnetic mold material is a hard ferromagnetic material.

4. The magnetic field sensor of claim 3 wherein the hard ferromagnetic material is selected from the group consisting of a ferrite, a SmCo alloy, a NdFeB alloy, a thermoplastic polymer with hard magnetic particles, and a thermoset polymer with hard magnetic particles.

5. The magnetic field sensor of claim 1 wherein the lead frame comprises at least one slot.

6. The magnetic field sensor of claim 1 wherein the non-conductive mold material consists of a thermoset or thermoplastic mold compound.

7. The magnetic field sensor of claim 1 further comprising a non-conductive adhesive coupled between the first surface of the lead frame and the second surface of the semiconductor die.

8. The magnetic field sensor of claim 7 wherein the non-conductive adhesive consists of a non-conductive epoxy or a die attach tape.

9. A magnetic field sensor comprising:
a lead frame having a first surface, a second opposing surface, and having at least one slot;
a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame;
a non-conductive mold material enclosing the die and at least a portion of the lead frame; and
a ferromagnetic mold material secured to a portion of the non-conductive mold material, wherein the ferromagnetic mold material comprises an aperture having a surface extending from the non-conductive mold material to an outer peripheral surface of the ferromagnetic mold material, wherein the surface of the aperture comprises a bend such that the surface of the aperture has a first slope from the non-conductive mold material to the bend and a second slope different than the first slope from the bend to the outer peripheral surface of the ferromagnetic mold material.

10. The magnetic field sensor of claim 9 wherein the ferromagnetic mold material is further secured to and in direct contact with a second portion of the lead frame that extends beyond the non-conductive mold material and terminates in the ferromagnetic mold material.

11. The magnetic field sensor of claim 9 wherein the non-conductive mold material consists of a thermoset or thermoplastic mold compound.

12. The magnetic field sensor of claim 9 further comprising a non-conductive adhesive coupled between the first surface of the lead frame and the second surface of the semiconductor die.

13. The magnetic field sensor of claim 12 wherein the non-conductive adhesive consists of a non-conductive epoxy or a die attach tape.

14. The magnetic field sensor of claim 9 wherein the ferromagnetic mold material comprises a hard ferromagnetic material to form a bias magnet.

15. The magnetic field sensor of claim 14 wherein the hard ferromagnetic material is selected from the group consisting of a ferrite, a SmCo alloy, a NdFeB alloy, a thermoplastic polymer with hard magnetic particles, and a thermoset polymer with hard magnetic particles.

Assignees

• Allegro Microsystems Llc

Inventors

• Vig Ravi
• Taylor William P
• David Paul
• Scheller P Karl
• Friedrich Andreas P

Classifications

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• G01R33/0047 Primary

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• G01R33/0011

  comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor · CPC title

• G01R15/207

  Constructional details independent of the type of device used · CPC title

• G01D5/147

  influenced by the movement of a third element, the position of Hall device and the source of magnetic field being fixed in respect to each other · CPC title