Thermal management device with textured surface for extended cooling limit

Patent metadata

Field	Value
Publication number	US-9812374-B1
Application number	US-201715466495-A
Country	US
Kind code	B1
Filing date	Mar 22, 2017
Priority date	Mar 22, 2017
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

Methods and apparatus are described for heat management in an integrated circuit (IC) package using a device with a textured surface having multiple grooves in an otherwise relatively flat surface. The textured surface of the heat management device is designed, in conjunction with a thermal interface material (TIM), to push gas bubbles out of the flat areas such that the gas bubbles are trapped in the grooves or driven out of the interface between the device and the TIM altogether. The area of the grooves is small relative to the ungrooved areas (i.e., the flat areas), such that when the gas bubbles are trapped in the grooved areas, the ungrooved areas work even better for heat transfer. With the area of the regions for the flat portions being substantially greater than the area of the regions for the grooves, the textured heat management device is designed to lower thermal resistance, increase thermal conductivity, and increase heat transfer from one or more IC dies to a heat sink assembly in an IC package.

First claim

What is claimed is:

1. A heat management device comprising a textured surface having a plurality of grooves disposed in an otherwise flat surface, a combined area of regions with the grooves in the textured surface being significantly smaller than a combined area of regions with the flat surface, and a plurality of small elongated structures extending from the textured surface into the plurality of grooves.

2. The heat management device of claim 1 , wherein the plurality of grooves is etched in the otherwise flat surface to form the textured surface.

3. The heat management device of claim 1 , wherein the plurality of grooves follows a pattern.

4. The heat management device of claim 3 , wherein the pattern comprises a first set of the grooves arranged in rows and a second set of the grooves arranged in columns perpendicular to and intersecting the rows at intersections.

5. The heat management device of claim 4 , wherein the pattern further comprises a third set of the grooves arranged in positive-sloping diagonals intersecting the intersections between the rows and the columns and a fourth set of the grooves arranged in negative-sloping diagonals intersecting the same intersections.

6. The heat management device of claim 4 , wherein the intersections have a greater depth than a depth of the plurality of grooves.

7. The heat management device of claim 1 , wherein the small elongated structures further comprise a plurality of nanotubes arranged in the plurality of grooves.

8. The heat management device of claim 7 , wherein a height of the nanotubes is less than 95% of a depth of the plurality of grooves.

9. An integrated circuit (IC) package comprising:
a package substrate;
one or more IC dies disposed above the package substrate;
a thermal interface material (TIM) disposed above the IC dies; and
a heat management device disposed above the TIM and comprising a textured surface having a plurality of grooves disposed in an otherwise flat surface, a combined area of regions with the grooves in the textured surface being significantly smaller than a combined area of regions with the flat surface, and a plurality of small elongated structures extending from the textured surface into the plurality of grooves.

10. The IC package of claim 9 , further comprising a heat sink assembly disposed above the heat management device.

11. The IC package of claim 10 , wherein the heat sink assembly comprises a vapor chamber or a heat pipe.

12. The IC package of claim 9 , wherein the TIM in conjunction with the textured surface of the heat management device are configured to drive trapped gas out of the regions with the flat surface and into the plurality of grooves.

13. The IC package of claim 12 , wherein the heat management device further comprises a plurality of nanotubes arranged in the plurality of grooves, the plurality of nanotubes being configured to divide bubbles of gas trapped between the TIM and the heat management device into smaller bubbles.

14. The IC package of claim 9 , wherein:
the TIM comprises one or more polymers and metal particles;
the metal particles have a maximum particle size of 25 μm; and
the TIM is configured to act as a Newtonian fluid when a surface of the one or more IC dies reaches at least 40° C.

15. The IC package of claim 9 , further comprising a heat sink assembly disposed above the TIM, wherein the heat sink assembly comprises the heat management device.

16. The IC package of claim 9 , wherein the plurality of grooves follows a pattern comprising:
a first set of the grooves arranged in rows;
a second set of the grooves arranged in columns perpendicular to and intersecting the rows at intersections;
a third set of the grooves arranged in positive-sloping diagonals intersecting the intersections between the rows and the columns; and
a fourth set of the grooves arranged in negative-sloping diagonals intersecting the same intersections.

17. A method of fabricating an integrated circuit (IC) package, comprising:
forming a plurality of grooves in an otherwise flat surface of a metal plate to form a heat management device having a textured surface;
disposing a thermal interface material (TIM) above one or more IC dies disposed above a package substrate; and
disposing the heat management device above the TIM, wherein a combined area of regions with the grooves in the textured surface is significantly smaller than a combined area of regions with the flat surface; and forming a plurality of small elongated structures extending from the textured surface into the plurality of grooves.

18. The method of claim 17 , further comprising attaching the heat management device to a metal mass to form a heat sink assembly, wherein:
disposing the heat management device above the TIM comprises disposing the heat sink assembly above the TIM; and
the metal mass comprises at least one of a vapor chamber, one or more heat pipes embedded in a base plate, or heat sink fins coupled to the base plate.

19. The method of claim 18 , wherein the attaching comprises soldering the heat management device to the metal mass.

20. The method of claim 17 , wherein forming the plurality of grooves comprises etching the plurality of grooves in the otherwise flat surface of the metal plate.

Assignees

• Xilinx Inc
• Xilinix Inc

Inventors

• Refai-Ahmed Gamal
• Ramalingam Suresh
• Philofsky Brian D

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title