Semiconductor package with top side cooling heat sink thermal pathway

Patent metadata

Field	Value
Publication number	US-9812373-B2
Application number	US-201514960804-A
Country	US
Kind code	B2
Filing date	Dec 7, 2015
Priority date	Dec 8, 2014
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the first main face is exposed from the encapsulation body, a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip, and an electrically insulating layer disposed on the heat spreader remote from the semiconductor package. The electrically insulating layer is completely separated from the semiconductor chip.

First claim

What is claimed is:

1. An electronic module, comprising:
a semiconductor package comprising a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the second main face is exposed from the encapsulation body;
a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip; and
an electrically insulating layer disposed on the heat spreader remote from the semiconductor package, wherein the electrically insulating layer is completely separated from the semiconductor chip.

2. The electronic module of claim 1 , wherein the electronic module is a Surface Mounted Device (SMD).

3. The electronic module of claim 1 , wherein a second main face of the semiconductor package comprises electrical contact elements for electrically contacting a semiconductor chip of the semiconductor package from outside of the semiconductor package, and wherein the heat spreader is arranged on a first main face of the semiconductor package, the first main face being opposite the second main face.

4. The electronic module of claim 1 , wherein the heat spreader is electrically coupled to the semiconductor chip of the semiconductor package.

5. The electronic module of claim 1 , wherein the semiconductor chip is a semiconductor power chip.

6. The electronic module of claim 1 , wherein a thermal interface material is arranged between the semiconductor chip of the semiconductor package and the heat spreader, and wherein the thermal interface material comprises one or more of a solder, a thermal grease, a silver paste and a conductive adhesive.

7. The electronic module of claim 1 , wherein the electrically insulating layer electrically insulates the heat spreader against the outside world.

8. The electronic module of claim 1 , wherein the heat spreader laterally projects beyond a footprint of the semiconductor package.

9. The electronic module of claim 1 , further comprising a heat sink arranged on a first main surface of the heat spreader and electrically insulated from the heat spreader by the electrically insulating layer.

10. The electronic module of claim 1 , wherein the heat spreader comprises one or more of copper and aluminum.

11. The electronic module of claim 5 , wherein a drain contact or a collector contact of the semiconductor power chip faces the heat spreader.

12. The electronic module of claim 5 , wherein a source contact or an emitter contact of the semiconductor power chip faces the heat spreader.

13. The electronic module of claim 6 , wherein a chip carrier or a contact clip is arranged between the semiconductor chip and the thermal interface material.

14. A heat spreader, comprising:
a metal sheet or metal plate,
an electrically insulating layer arranged over the metal sheet or metal plate,
wherein the metal sheet or metal plate has a thickness in the range of 0.1 mm-1 mm, and
wherein the electrically insulating layer completely covers a first main face and each side face of the metal plate, and
wherein the electrically insulating layer partially covers and partially exposes a second main face of the metal plate, the second main face being opposite from the first main face.

15. The heat spreader of claim 14 , wherein the electrically insulating layer comprises one or more of an imide, a mold material, and a laminate.

Assignees

• Infineon Technologies Ag

Inventors

• Fachmann Christian
• Otremba Ralf
• Schiess Klaus
• Stueckler Franz

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title