Method for producing a fiber having a pattern on a surface thereof

US9810986B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9810986-B2
Application numberUS-201615170027-A
CountryUS
Kind codeB2
Filing dateJun 1, 2016
Priority dateJun 4, 2015
Publication dateNov 7, 2017
Grant dateNov 7, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A method for producing a fiber having a pattern on a surface thereof, the method including forming a resin composition layer having a linear first pattern using a resin composition; and forming a second pattern on the resin composition layer. The second pattern may be formed by forming a thin film of a block copolymer comprising at least two block chains different from each other in surface free energy on the resin composition layer and subjecting the block copolymer to microphase separation. Alternatively, the second pattern is formed by adhering particles onto the resin composition layer.

First claim

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What is claimed is: 1. A method for producing a fiber having a pattern on a surface thereof, the method comprising: forming a first linearly patterned resin composition layer on a substrate using a resin composition; forming a second patterned layer on the resin composition layer; and separating from the substrate a fiber which includes a linear resin composition in the resin composition layer, and the second patterned layer. 2. The method according to claim 1 , wherein the resin composition is a photosensitive composition. 3. The method according to claim 2 , wherein the photosensitive composition is a negative-type photosensitive composition. 4. The method according to claim 1 , wherein the second patterned layer is formed by forming a thin film formed of a block copolymer comprising at least two block chains different from each other in surface free energy on the resin composition layer, and subjecting the block copolymer to microphase separation. 5. The method according to claim 1 , wherein the second patterned layer is formed by adhering particles onto the resin composition layer. 6. A fiber having a pattern on a surface thereof, wherein the fiber consists essentially of a linear resin composition, and a patterned layer on the linear resin composition, and the patterned layer is a microphase separation layer formed from a block copolymer comprising at least two block chains different from each other in surface free energy, or particles. 7. A method for producing a fiber having a pattern on a surface thereof, the method comprising: forming a first linearly patterned resin composition layer using a resin composition; and forming a second patterned layer on the first linearly patterned resin composition layer by laminating a film having particles onto the resin composition layer, and transferring and adhering the particles from the film onto a surface of the resin composition layer. 8. A method for producing a fiber having a pattern on a surface thereof, the method comprising: forming a first linearly patterned resin composition layer using a resin composition; and forming a second patterned layer on the first linearly patterned resin composition layer by adhering silica particles onto the resin composition layer. 9. The method according to claim 5 , wherein the second patterned layer is formed by laminating a film having particles onto the resin composition layer, and transferring and adhering the particles from the film onto a surface of the resin composition layer. 10. The method according to claim 8 , wherein the second patterned layer is formed by laminating a film having particles onto the resin composition layer, and transferring and adhering the particles from the film onto a surface of the resin composition layer. 11. The method according to claim 7 , wherein the first linearly patterned resin composition layer is formed on a substrate, and the method further comprises separating from the substrate a fiber which includes a linear resin composition in the resin composition layer, and the second patterned layer. 12. The method according to claim 8 , wherein the first linearly patterned resin composition layer is formed on a substrate, and the method further comprises separating from the substrate a fiber which includes a linear resin composition in the resin composition layer, and the second patterned layer. 13. The method according to claim 1 , wherein a thickness of the resin composition layer is 1 μm to 1000 μm. 14. The method according to claim 7 , wherein a thickness of the resin composition layer is 1 μm to 1000 μm. 15. The method according to claim 8 , wherein a thickness of the resin composition layer is 1 μm to 1000 μm. 16. A method according to claim 1 , wherein a line width of a linear pattern of the resin composition layer is 1 μm to 1000 μm. 17. The method according to claim 7 , wherein a line width of a linear pattern of the resin composition layer is 1 μm to 1000 μm. 18. The method according to claim 8 , wherein a line width of a linear pattern of the resin composition layer is 1 μm to 1000 μm. 19. The fiber according to claim 6 , wherein a line width of the linear resin composition is 1 μm to 1000 μm, and a thickness of the linear resin composition is 1 μm to 1000 μm. 20. The method according to claim 1 , wherein the first linearly patterned resin composition layer is formed a method selected from the group consisting of methods (1) to (4) below: (1) applying a photosensitive composition onto the substrate to form a coating film and processing the formed coating film by photolithography to obtain a linearly patterned first layer; (2) applying a photosensitive composition onto a substrate to form a coating film, pressing a pressing mold having a shape corresponding to a pattern shape of the resin composition layer against the coating film, followed by exposing the coating film pressed by the pressing mold to light to cure the coating film and thus to obtain the resin composition layer; (3) forming a thin film of a material having a glass transition temperature on the substrate, pressing a pressing mold having a shape corresponding to a pattern shape of the resin composition layer against the thin film in such a state that the formed thin film has been heated at or above the glass transition temperature, thereby deforming the thin film, followed by cooling the deformed thin film to obtain the resin composition layer; and (4) forming a thin film of an etchable resin on the substrate, followed by etching the thin film for linear pattern formation.

Assignees

Inventors

Classifications

  • Photolithographic processes · CPC title

  • with a non-circular cross section; Spinnerette packs therefor (D01D5/38 takes precedence) · CPC title

  • Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

  • G03F7/038Primary

    Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

  • G03F7/165Primary

    Monolayers, e.g. Langmuir-Blodgett · CPC title

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What does patent US9810986B2 cover?
A method for producing a fiber having a pattern on a surface thereof, the method including forming a resin composition layer having a linear first pattern using a resin composition; and forming a second pattern on the resin composition layer. The second pattern may be formed by forming a thin film of a block copolymer comprising at least two block chains different from each other in surface fre…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/038. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).