Plasmonic filter

US9810823B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9810823-B2
Application numberUS-201615357871-A
CountryUS
Kind codeB2
Filing dateNov 21, 2016
Priority dateNov 27, 2015
Publication dateNov 7, 2017
Grant dateNov 7, 2017

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Abstract

Official abstract text for this publication.

An infrared high-pass plasmonic filter includes a copper layer interposed between two layers of a dielectric material. An array of patterned openings extend through the copper layer and are filled with the dielectric material. Each patterned opening is in the shape of a greek cross, with the arms of adjacent patterns being collinear. A ratio of the width to the length of each arm is in the range from 0.3 to 0.6, and the distance separating the opposite ends of arms of adjacent patterns is shorter than 10 nm.

First claim

Opening claim text (preview).

The invention claimed is: 1. An infrared high-pass plasmonic filter, comprising: a copper layer interposed between two layers of a dielectric material; an array of patterns made of the dielectric material, each pattern being in the shape of a greek cross, with arms of adjacent patterns being collinear; wherein a ratio (B/A) of a width (B) to a length (A) of each arm is in a range from 0.3 to 0.6, and wherein a distance (D) separating opposite ends of arms of adjacent patterns being shorter than 10 nm. 2. The plasmonic filter of claim 1 , wherein a thickness of the copper layer is in a range from 50 to 500 nm. 3. The plasmonic filter of claim 1 , wherein an optical index of said dielectric material is in a range from 1.3 to 2.3. 4. The plasmonic filter of claim 1 , wherein the dielectric material is silicon nitride. 5. The plasmonic filter of claim 1 , wherein the length (A) of the arms is in a range from 70 to 195 nm. 6. The plasmonic filter of claim 1 , wherein said distance (D) is in a range from 3 to 7 nm. 7. The plasmonic filter of claim 1 , wherein said ratio (B/A) is in a range from 0.35 to 0.55. 8. An image sensor, comprising: a semiconductor layer portion including, inside and on top of said semiconductor layer portion, at least one first pixel configured to receive visible light and at least one second pixel configured to receive infrared light; wherein each first pixel includes a visible light bandpass plasmonic filter; and wherein each second pixel includes an infrared high-pass filter, said infrared high-pass filter comprising: a copper layer interposed between two layers of a dielectric material; an array of patterns made of the dielectric material, each pattern being in the shape of a greek cross, with arms of adjacent patterns being collinear; wherein a ratio (B/A) of a width (B) to a length (A) of each arm is in a range from 0.3 to 0.6, and wherein a distance (D) separating opposite ends of arms of adjacent patterns being shorter than 10 nm. 9. The image sensor of claim 8 , wherein a thickness of the copper layer is in a range from 50 to 500 nm. 10. The image sensor of claim 8 , wherein an optical index of said dielectric material is in a range from 1.3 to 2.3. 11. The image sensor of claim 8 , wherein the dielectric material is silicon nitride. 12. The image sensor of claim 8 , wherein the length (A) of the arms is in a range from 70 to 195 nm. 13. The image sensor of claim 8 , wherein said distance (D) is in a range from 3 to 7 nm. 14. The image sensor of claim 8 , wherein said ratio (B/A) is in a range from 0.35 to 0.55. 15. An infrared high-pass plasmonic filter, comprising: a copper layer interposed between two layers of a dielectric material, said copper layer including an array of openings extending through the copper layer and filled with said dielectric material; wherein said openings are in a cross shape formed by two arms having a same length (A) and a same width (B); wherein the two arms perpendicularly intersect each other; wherein the arms of adjacent openings in the array are collinear but separated by a distance (D) less than 10 nm; and wherein a ratio (B/A) of the width (B) to the length (A) of each arm is in a range from 0.3 to 0.6. 16. The plasmonic filter of claim 15 , wherein a thickness of the copper layer is in a range from 50 to 500 nm. 17. The plasmonic filter of claim 15 , wherein an optical index of said dielectric material is in a range from 1.3 to 2.3. 18. The plasmonic filter of claim 15 , wherein the length (A) of the arms is in a range from 70 to 195 nm. 19. The plasmonic filter of claim 15 , wherein said distance (D) is in a range from 3 to 7 nm. 20. The plasmonic filter of claim 15 , wherein said ratio (B/A) is in a range from 0.35 to 0.55.

Assignees

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Classifications

  • Electricity · mapped topic

  • Electricity · mapped topic

  • Electricity · mapped topic

  • in which spectral selection is performed by means of a conductive grid or array, e.g. frequency selective surfaces (for use with wavelengths longer than the infrared light H01Q15/0006) · CPC title

  • Electricity · mapped topic

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What does patent US9810823B2 cover?
An infrared high-pass plasmonic filter includes a copper layer interposed between two layers of a dielectric material. An array of patterned openings extend through the copper layer and are filled with the dielectric material. Each patterned opening is in the shape of a greek cross, with the arms of adjacent patterns being collinear. A ratio of the width to the length of each arm is in the rang…
Who is the assignee on this patent?
St Microelectronics Sa, St Microelectronics Crolles 2 Sas, Commissariat Energie Atomique
What technology area does this patent fall under?
Primary CPC classification G02B5/208. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).