Adhesive tape
US-2016319163-A1 · Nov 3, 2016 · US
US9809728B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9809728-B2 |
| Application number | US-201314648579-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2013 |
| Priority date | Nov 30, 2012 |
| Publication date | Nov 7, 2017 |
| Grant date | Nov 7, 2017 |
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The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m 2 /day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.
Opening claim text (preview).
The invention claimed is: 1. An adhesive composition for sealing an electronic device, the adhesive composition consisting of an isobutylene-isoprene copolymer, a tackifier, and a solvent, wherein the isobutylene-isoprene copolymer has a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units, wherein the content of the tackifier is 5 to 100 parts by mass based on 100 parts by mass of the isobutylene-isoprene copolymer, and wherein the solvent is at least one of benzene, toluene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, n-pentane, n-hexane, n-heptane, cyclopentane or cyclohexane.
by a substrate and the encapsulations · CPC title
using moulds · CPC title
Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title
Electricity · mapped topic
Electricity · mapped topic
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