Circuit materials and articles formed therefrom

Patent metadata

Field	Value
Publication number	US-9809690-B2
Application number	US-201615177882-A
Country	US
Kind code	B2
Filing date	Jun 9, 2016
Priority date	Jun 9, 2015
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a D f of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.

First claim

What is claimed is:

1. A circuit material, comprising a dielectric layer comprising a polymer component, wherein the polymer component comprises:
a continuous polymeric matrix; and
particles comprising a poly(triallyl isocyanurate), a poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, wherein the particles are dispersed in the continuous polymeric matrix; and
wherein the circuit material has
a dissipation factor (D f ) of less than 0.0060 at 10 GHz, and
a dielectric constant (D k ) of less than 3.8 at 10 GHz.

2. The circuit material of claim 1 , wherein the polymer component comprises 10 to 90 weight percent of the continuous polymeric matrix, based on a total weight of the polymer component, and the polymer matrix has a T g greater than 170° C. and a temperature of decomposition (T d ) greater than 350° C.

3. The circuit material of claim 1 , wherein the continuous polymeric matrix is formed from a thermosetting resin comprising at least two free-radically reactive functional groups, and that has an LOI of less than 20.

4. The circuit material of claim 1 , wherein the polymer component comprises
1 to 50 weight percent of the polymer particles and
1 to 50 weight percent of monomeric triallyl isocyanurate, monomeric triallyl cyanurate, or a combination comprising at least one of the foregoing, each based on the total weight of the polymer component.

5. The circuit material of claim 1 , wherein the total unit isocyanurate or cyanurate content of the polymer component is at least 12 weight percent, based on the total weight of the thermosetting composition; and wherein the circuit material has a dissipation factor (D f ) less than 0.0040 at 10 GHz.

6. The circuit material of claim 1 , wherein the particles are emulsion polymerized particles wherein the particles have one or both of a decomposition temperature of greater than 400° C. or a mean particle size of 0.1 to 10 micrometers, determined using dynamic light scattering.

7. The circuit material of claim 1 , wherein the continuous polymeric matrix comprises the reaction product of a composition comprising a thermoplastic polymer, a thermosetting resin, or a combination comprising at least one of the foregoing, and monomeric triallyl isocyanurate, monomeric triallyl cyanurate, or a combination comprising at least one of the foregoing.

8. The circuit material of claim 1 , wherein the continuous polymeric matrix is a reaction product of a thermosetting resin composition, wherein the circuit material has a dissipation factor (D f ) of less than 0.0050 at 10 GHz, and wherein the thermosetting resin composition comprises a vinyl-functional poly(arylene ether), butadiene, isoprene, or a combination comprising at least one of the foregoing, and optionally a crosslinking agent.

9. The circuit material of claim 7 , wherein the thermosetting resin composition comprises, based on total weight of the thermosetting composition
10 to 40 weight percent of poly(arylene ether);
5 to 40 weight percent of the monomeric triallyl isocyanurate, monomeric triallyl cyanurate, or a combination comprising at least one of the foregoing; and
1 to 30 weight percent of the polymeric particles of poly(triallyl isocyanurate), poly(triallyl cyanurate), copolymers comprising at least one of the foregoing, or a combination comprising at least one of the foregoing;
wherein the circuit material has a dissipation factor (D f ) of less than 0.0050 at 10 GHz.

10. The circuit material of any of claim 7 , wherein the continuous polymer matrix comprises a thermoplastic cyclic olefin copolymer, a polytetrafluoroethylene, or a polyethylene.

11. The circuit material of claim 1 , wherein the dielectric layer further comprises an inorganic filler.

12. The circuit material of claim 1 , wherein the dielectric layer has a thickness of 1 to 1000 micrometers.

13. The circuit material claim 1 , wherein the dielectric layer is a prepreg comprising a woven or non-woven, organic or inorganic, fabric reinforcement in an amount of 5 to 40 volume percent, based on the total volume of the dielectric layer.

14. The circuit material of claim 1 , further comprising a conductive metal layer disposed on the dielectric layer.

15. The circuit material of claim 14 , wherein the conductive metal layer is patterned to form a circuit.

16. A circuit subassembly, comprising
a conductive metal layer; and
a circuit material comprising a dielectric layer comprising a polymer component, wherein the polymer component comprises:

a continuous polymeric matrix; and
particles comprising a poly(triallyl isocyanurate), a poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, wherein the particles are dispersed in the continuous polymeric matrix; and
wherein the circuit material has
a dissipation factor (D f ) of less than 0.0060 at 10 GHz, and
a dielectric constant (D k ) of less than 3.8 at 10 GHz;
wherein a peel strength between the conductive metal layer and the dielectric layer is greater than 4.0 pounds per inch.

17. A method of making a dielectric layer comprising a polymer component for a circuit material, the method comprising
combining a thermoplastic polymer, a thermosetting resin, or a combination comprising at least one of the foregoing with a plurality of polymer particles comprising poly(triallyl isocyanurate), poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, and having decomposition temperature greater than 400° C., to provide a precursor composition; and
forming the precursor composition into a dielectric layer, wherein the thermoplastic polymer, thermosetting resin or a combination comprising at least one of the foregoing is a continuous polymeric matrix, and wherein the polymer particles are dispersed in the continuous polymeric matrix.

18. The method of claim 17 , wherein the precursor composition further comprises a monomeric triallyl isocyanurate, monomeric triallyl cyanurate, or a combination comprising at least one of the foregoing.

19. The method of claim 17 , further comprising
emulsion polymerizing poly(triallyl isocyanurate), poly(triallyl cyanurate), or a combination comprising at least one of the foregoing to form polymer particles; and
filtering and drying the polymer particles to form a powder.

20. The method of claim 19 , further comprising washing the polymer particles with an aqueous base.

21. The method of claim 20 , wherein the precursor composition is a thermosetting composition and, after forming the precursor composition into a dielectric layer, at least partially curing the thermosetting composition to provide a prepreg.

22. The circuit material of claim 1 , wherein the circuit material has a dissipation factor (D f ) of less than 0.0040 at 10 GHz.

23. The circuit material of claim 1 , wherein the circuit material has a dissipation factor (D f ) of less than 0.0030 at 10 GHz.

24. The circuit material of claim 1 , wherein the dielectric layer further comprises 10 to 70 weight percent of inorganic filler based on the total weight of the dielectric layer.

25. The circuit material of claim 1 , wherein the dielectric layer further comprises 15 to 60 weight percent of fused silica filler based on the total weight of the dielectric lay

Assignees

• Rogers Corp

Inventors

• Koes Thomas A

Classifications

• C08J5/24 Primary

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• H05K1/0373 Primary

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• B32B2255/06

  on metal layer · CPC title

• B32B2260/02

  Composition of the impregnated, bonded or embedded layer · CPC title

• B32B2371/00

  Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone · CPC title