Flux composition and techniques for use thereof

Patent metadata

Field	Value
Publication number	US-9808874-B2
Application number	US-201213613000-A
Country	US
Kind code	B2
Filing date	Sep 13, 2012
Priority date	Feb 25, 2011
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

First claim

What is claimed is:

1. A soldering method for joining objects, comprising the steps of:
generating a flux composition by:
combining, at approximately sixty degrees Celsius for at least approximately one hour, (i) about five percent by weight to about twenty percent by weight of an activator consisting of a mixture of 2-acetyloxybenzoic acid, acetyl butyric acid, levulinic acid, 2-acetylbenzoic acid, 2-ketobutyric acid, acetoxyacetic acid, and pyruvic acid, (ii) about fifteen percent by weight to about seventy-five percent by weight of a medium-viscosity solvent being a polymer in a liquid state, wherein the medium-viscosity solvent consists of a mixture of glycerol ethoxylate, glycerol propoxylate, and a glycerol ethoxylate-propoxylate copolymer, (iii) about twenty percent by weight to about eighty percent by weight of a high-viscosity solvent with hydroxyl end groups, wherein said high-viscosity solvent comprises a random copolymer containing a plurality of first monomers and a plurality of second monomers combined in a random sequence to form the random copolymer, and wherein said high-viscosity solvent is in a liquid state at room temperature, and (iv) about four percent by weight to about ten percent by weight of multi-amines, wherein the multi-amines comprises tetrakis(4-hydroxyethyl)ethylenediamine;

applying the flux composition to at least a portion of one or more of the objects; and
joining the objects.

2. The method of claim 1 , further comprising applying a solder compound with the flux composition to at least a portion of one or more of the objects.

3. The method of claim 1 , wherein joining the objects comprises introducing the objects to heat, wherein the heat comprises a range from about 220° C. to about 325° C.

4. The method of claim 1 , further comprising removing flux residue formed during joining, wherein removing flux residue formed during joining comprises using water to remove flux residue.

5. A soldering method for joining objects, comprising the steps of:
generating a flux composition by:
combining, at approximately sixty degrees Celsius for at least approximately one hour, (i) about six percent by weight to about twelve percent by weight of an activator in a liquid state at room temperature that is soluble in both the solvents and water, wherein the activator consists of a mixture of 2-acetyloxybenzoic acid, acetyl butyric acid, levulinic acid, 2-acetylbenzoic acid, 2-ketobutyric acid, acetoxyacetic acid, and pyruvic acid, (ii) about eighty-eight percent by weight to about ninety-four percent by weight of a medium-viscosity solvent, wherein the medium-viscosity solvent consists of a mixture of glycerol ethoxylate, glycerol propoxylate, and a glycerol ethoxylate-propoxylate copolymer, and (iii) about four percent by weight to about ten percent by weight of multi-amines, wherein the multi-amines comprises tetrakis(4-hydroxyethyl)ethylenediamine;

applying the flux composition to at least a portion of one or more of the objects; and
joining the objects.

6. The method of claim 5 , further comprising applying a solder compound with the flux composition to at least a portion of one or more of the objects.

7. The method of claim 5 , wherein joining the objects comprises introducing the objects to heat, wherein the heat comprises a range from about 220° C. to about 325° C.

8. The method of claim 5 , further comprising removing flux residue formed during joining, wherein removing flux residue formed during joining comprises using water to remove flux residue.

Assignees

• Lee Kang-Wook
• Nah Jae-Woong
• Normand Nathalie
• Oberson Valerie
• IBM

Inventors

• Lee Kang-Wook
• Nah Jae-Woong
• Normand Nathalie
• Oberson Valerie

Classifications

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K35/3601

  with inorganic compounds as principal constituents · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title