Electronic component and method for producing the electronic component

Patent metadata

Field	Value
Publication number	US-9807917-B2
Application number	US-201113977000-A
Country	US
Kind code	B2
Filing date	Dec 5, 2011
Priority date	Dec 30, 2010
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

The invention specifies an electronic component which has a first electrode ( 10 ), a second electrode ( 20 ), an active region ( 30 ), which is electrically coupled to the first electrode ( 10 ) and to the second electrode ( 20 ), and a housing ( 100 ), wherein the housing ( 100 ) contains carbon layers which are monoatomic at least in subregions.

First claim

The invention claimed is:

1. An electroacoustic component comprising:
a first electrode;
a second electrode;
an active region comprising a piezoelectric layer, which is electrically coupled to the first electrode and the second electrode; and
a housing disposed above the active region, wherein the housing is a thin film package comprising a stabilizing layer with a plurality of openings therein and a layer sequence which comprises a plurality of layers arranged one above another and which comprises graphene at least in partial regions, the layer sequence being disposed above the stabilizing layer.

2. The electroacoustic component according to claim 1 , wherein the first and second electrodes are arranged on one side of the piezoelectric layer.

3. The electroacoustic component according to claim 1 , further comprising a cavity arranged between the housing and the active region.

4. The electroacoustic component according to claim 3 , wherein the layer sequence spans the cavity above the active region.

5. The electroacoustic component according to claim 4 , wherein the layer sequence has at least one additional stabilizing layer comprising graphene layers.

6. The electroacoustic component according to claim 1 , wherein the stabilizing layer comprises graphene layers.

7. The electroacoustic component according to claim 5 , wherein the at least one additional stabilizing layer is arranged within the layer sequence as a layer completely enclosing the cavity, or as a layer terminating the layer sequence toward the outside.

8. The electroacoustic component according to claim 5 , wherein the at least one additional stabilizing layer is additionally RF-shielding or heat-dissipating.

9. The electroacoustic component according to claim 1 , which is embodied as a surface-acoustic-wave-based component, as a bulk-acoustic-wave-based component or as a microelectromechanical component.

10. A method for producing an electroacoustic component according to claim 1 , comprising:
A) applying a temporary layer on an arrangement comprising the first electrode, the second electrode, and the active region;
B) arranging the stabilizing layer, which has the plurality of openings, on the temporary layer;
C) removing the temporary layer through the openings; and
D) applying the layer sequence on the stabilizing layer, wherein a graphene-containing layer is applied directly on a cavity of the housing, in the layer sequence, or as a layer terminating the layer sequence.

11. The method according to claim 10 , wherein at least one of the arranging or the applying the layer sequence is carried out by a method selected from the group consisting of chemical vapor deposition, physical vapor deposition, application in solution, and chemical surface reactions.

12. The electroacoustic component according to claim 1 , wherein the first and second electrodes are arranged on mutually opposite sides of the piezoelectric layer.

13. The electroacoustic component according to claim 1 , wherein the openings in the stabilizing layer are arranged in a pattern.

14. The electroacoustic component according to claim 1 , wherein at least one of the stabilizing layer or a layer in the layer sequence is electrically and thermally conductive.

15. The electroacoustic component according to claim 1 , wherein at least one of the plurality of layers comprises epoxy.

16. The electroacoustic component according to claim 1 , wherein the layer sequence is disposed directly above the stabilizing layer such that a bottommost layer of the layer sequence closes the openings in the stabilizing layer.

17. The electroacoustic component according to claim 1 , wherein the graphene in the layer sequence is arranged as monolayers.

Assignees

• Henn Gudrun
• Qualcomm Inc

Inventors

• Henn Gudrun

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/40

  characterised by their materials · CPC title

• B81B7/0077

  Other packages not provided for in groups B81B7/0035 - B81B7/0074 · CPC title

• Y10T156/11

  Methods of delaminating, per se; i.e. , separating at bonding face · CPC title