Storage device

Patent metadata

Field	Value
Publication number	US-9807899-B2
Application number	US-201615049232-A
Country	US
Kind code	B2
Filing date	Feb 22, 2016
Priority date	Dec 28, 2015
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.

First claim

What is claimed is:

1. A storage device comprising:
an enclosure; and
a circuit board assembly accommodated in the enclosure,
the circuit board assembly comprising:
a first circuit board on which a memory device and a heat-producing component are mounted;
a second circuit board opposed to the first circuit board, on which a memory device is mounted;
a first connector provided between the first circuit board and the second circuit board and connecting the first circuit board to the second circuit board; and
a frame-shaped first spacer sandwiched between the first circuit board and the second circuit board;
wherein
the first spacer comprises:
a spacer frame;
a partition member extending from the spacer frame and opposed to the heat-producing component with a gap between;
a thermal transfer member attached to the partition member and in contact with the first circuit board;
a support beam coupled to the spacer frame; and
a support body provided in the support beam, the partition member comprising a partition beam coupled to the spacer frame and the support beam.

2. The storage device of claim 1 , wherein
the first circuit board comprises a first principal surface opposed to an inner surface of the enclosure, and a second principal surface opposed to the second circuit board, the heat-producing component is mounted on the first principal surface, and the thermal transfer member of the first spacer is in contact with the second principal surface of the first circuit board in a position opposed to the heat-producing component.

3. The storage device of claim 1 , wherein
the first spacer comprises a first thermal transfer member attached to the partition beam and in contact with the first circuit board; and a second thermal transfer member attached to the partition beam and in contact with the second circuit board.

4. The storage device of claim 1 , wherein
the circuit board assembly is fixed to the enclosure by fixation screws penetrating the second circuit board, the first spacer and the first circuit board.

5. The storage device of claim 1 , further comprising a heat sink member provided on the enclosure and in contact with the heat-producing component.

6. The storage device of claim 1 , wherein
the enclosure comprises a first wall opposed to the first circuit board of the circuit board assembly, and
the first wall comprises a projection in contact with the first circuit board in a position opposed to the first connector of the circuit board assembly.

7. The storage device of claim 6 , wherein
the enclosure comprises a heat-sink sheet provided between the projection of the first wall and the first circuit board.

8. The storage device of claim 1 , wherein
the first spacer is formed of synthetic resin or metal.

9. The storage device of claim 1 , wherein
the circuit board assembly further includes:
a third circuit board opposed to the second circuit board, on which a memory device is mounted;
a second connector provided between the second circuit board and the third circuit board and connecting the second circuit board to the third circuit board; and
a frame-shaped second spacer sandwiched between the second circuit board and the third circuit board, wherein
the support body is provided at a position opposed to the second connector.

10. A storage device comprising:
an enclosure; and
a circuit board assembly accommodated in the enclosure,
the circuit board assembly comprising:
a first circuit board on which a memory device and a heat-producing component are mounted;
a second circuit board opposed to the first circuit board, on which a memory device is mounted;
a first connector provided between the first circuit board and the second circuit board and connecting the first circuit board to the second circuit board; and
a first spacer sandwiched between the first circuit board and the second circuit board; wherein
the first spacer comprises:
a spacer frame;
a partition plate coupled to the spacer frame, extending from the spacer frame, and opposed to the first circuit board and the heat-producing component with a gap between; and
a thermal transfer member attached to the partition plate and in contact with the first circuit board.

11. The storage device of claim 10 , wherein
the first circuit board comprises a first principal surface opposed to an inner surface of the enclosure, and a second principal surface opposed to the second circuit board, the heat-producing component is mounted on the first principal surface, and the thermal transfer member of the first spacer is in contact with the second principal surface of the first circuit board in a position opposed to the heat-producing component.

12. The storage device of claim 10 , wherein
the spacer frame comprises a pair of long-side portions opposed to each other; and
a pair of short-side portions opposed to each other, and the partition plate extends from one of the short-side portions toward an other of the short-side portions.

13. The storage device of claim 10 , wherein
the circuit board assembly is fixed to the enclosure by fixation screws penetrating the second circuit board, the first spacer and the first circuit board.

14. The storage device of claim 10 , further comprising a heat sink member provided on the enclosure and in contact with the heat-producing component.

15. The storage device of claim 10 , wherein
the enclosure comprises a first wall opposed to the first circuit board of the circuit board assembly, and
the first wall comprises a projection in contact with the first circuit board in a position opposed to the first connector of the circuit board assembly.

16. The storage device of claim 15 , wherein
the enclosure comprises a heat-sink sheet provided between the projection of the first wall and the first circuit board.

17. The storage device of claim 10 , wherein
the first spacer is formed of synthetic resin or metal.

Assignees

• Toshiba Memory Corp
• Toshiba Kk

Inventors

• Matsuda Yoshiharu
• Suzuki Akitoshi

Classifications

• H05K7/142 Primary

  Spacers not being card guides · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K7/205

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title

• H05K2201/2036

  Permanent spacer or stand-off in a printed circuit or printed circuit assembly · CPC title