Glass system for hermetically joining Cu components, and housing for electronic components

Patent metadata

Field	Value
Publication number	US-9807897-B2
Application number	US-201214004063-A
Country	US
Kind code	B2
Filing date	Mar 5, 2012
Priority date	Mar 7, 2011
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

First claim

The invention claimed is:

1. A housing for accommodating an electronic functional element, comprising:
a base body comprising an upper surface, a lower surface, and a lateral surface, the body having a boundary surface, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element;
a connecting body made of metal;
a glass layer that connects the base body to the connecting body so that the connecting body is electrically insulated from the base body,
wherein the at least one glass layer is formed by an alkali titanium silicate glass having a composition in weight percent of TiO 2 greater than 25%.

2. The housing as claimed in claim 1 , wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of:

SiO 2
20-50,

TiO 2
>25-35, 

R 2 O
10-40,

Al 2 O 3
0-5,

CaO + SrO
0-5,

P 2 O 5
0-5,

V 2 O 5
0-5,

B 2 O 3
0-5,

Sb 2 O 3
0-1,

SnO 2
0-5,

Fe 2 O 3
<1,

CoO
<1,

NiO
<1,

ZnO
0-4,

ZrO 2
0-4,

F
0-2,

MoO 3
0-1,

N 2 O 5
0-6,

SO 3
   0-1, and

wherein R 2 O comprises a sum of all alkali metal oxides.

3. The housing as claimed in claim 1 , wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of:

SiO 2
36-40,

TiO 2
>25-28, 

Na 2 O
15-19,

K 2 O
10-14,

Li 2 O
>0-3, 

Al 2 O 3
1-6,

CaO
>0-1, 

SrO
<1,

P 2 O 5
>0-4, 

B 2 O 3
>0-2, 

Fe 2 O 3
0-2,

CoO
<1,

NiO
<1,

ZnO
<1, and

ZrO 2
<1.

4. The housing as claimed in claim 3 , wherein the composition in weight percent is:

SiO 2
38,

TiO 2
26,

Na 2 O
17,

K 2 O
11.6,

Li 2 O
 1.22,

Al 2 O 3
 3.7,

CaO
 0.3,

P 2 O 5
 1.6,

B 2 O 3
 0.29,

Fe 2 O 3
 0.08,

NiO
<0.02, and

ZrO 2
 0.1.

5. The housing as claimed in claim 1 , wherein the at least one glass layer has a thickness of more than 30 μm.

6. The housing as cla

Assignees

• Hettler Robert
• Rindt Matthias
• Schott Ag

Inventors

• Hettler Robert
• Rindt Matthias

Classifications

• C03C8/08

  containing phosphorus · CPC title

• C03C3/066

  containing zinc · CPC title

• C03C8/24

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

• C03C29/00

  Joining metals with the aid of glass · CPC title

• C03C3/064 Primary

  containing boron · CPC title