Method of mounting electronic component to circuit board

Patent metadata

Field	Value
Publication number	US-9807889-B2
Application number	US-201313953682-A
Country	US
Kind code	B2
Filing date	Jul 29, 2013
Priority date	Jul 30, 2012
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

First claim

What is claimed is:

1. A method of mounting electronic component, the method comprising the steps of:
providing a conductive layer on at least one wiring disposed on a surface of a printed wiring board, the conductive layer being formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent;
providing a thermoplastic resin layer, which is formed of thermoplastic resin, on the conductive layer such that the thermoplastic resin layer covers the conductive layer, and directly on a portion of the surface of the printed wiring board positioned next to the wiring in a direction parallel with the surface of the printed wiring board;
disposing an electronic component on the conductive layer such that the thermoplastic resin layer is positioned between the conductive layer and the electronic component; and
electrically connecting the electronic component to the wiring through the conductive layer by heating the conductive layer and the thermoplastic resin layer to a melting point or higher of the solder powder.

2. The method of mounting electronic component according to claim 1 ,
wherein a thermosetting resin having a viscosity, at which the solder powder flows within the conductive layer at a temperature at which the solder powder melts, is used as the thermosetting resin.

Assignees

• Univ Osaka
• Senju Metal Industry Co

Inventors

• Fujimoto Kozo
• Fukumoto Shinji
• Matsushima Michiya
• Watanabe Satoshi
• Kan Takeshi
• Ueshima Minoru
• Sakamoto Takeshi
• Inoue Shu

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• Y10T29/49144

  by metal fusion · CPC title

• Y02P70/613

  Cross-Sectional Technologies · mapped topic

• H05K3/3478

  Application of solder preforms; Transferring prefabricated solder patterns · CPC title

• H05K2203/0405

  Solder foil, tape or wire · CPC title