Organic light-emitting diode and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9806282-B2
Application number	US-201414787687-A
Country	US
Kind code	B2
Filing date	May 30, 2014
Priority date	May 31, 2013
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

Provided are an organic light emitting diode and a method for preparing the same.

First claim

The invention claimed is:

1. An organic light emitting device, comprising:
a substrate;
an organic light emitting part in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and
a sealing part covering an outside of the organic light emitting part of the substrate,
wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base, and a sealing layer filling a space between the printed circuit board and the outside of the organic emitting part,
wherein the base is formed directly on the sealing layer.

2. The organic light emitting device of claim 1 , wherein the printed circuit board includes one or more metal patterns.

3. The organic light emitting device of claim 2 , wherein the printed circuit board includes an insulating layer provided on at least one among a location between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.

4. The organic light emitting device of claim 1 , wherein the printed circuit board is a flexible printed circuit board.

5. The organic light emitting device of claim 1 , wherein the first electrode or the second electrode is electrically connected with an external power source through the metal pattern.

6. The organic light emitting device of claim 5 , wherein the metal pattern includes a first metal pattern electrically connecting the first electrode and the external power source.

7. The organic light emitting device of claim 6 , wherein the metal pattern includes a second metal pattern electrically connecting the second electrode and the external power source.

8. The organic light emitting device of claim 1 , wherein a metal plate which is not connected with the metal pattern is included on one side of the base, and the metal plate is provided on a light emitting area of the organic light emitting part.

9. The organic light emitting device of claim 8 , wherein the metal plate is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.

10. The organic light emitting device of claim 8 , wherein the size of the metal plate corresponds to the size of the organic light emitting part, or is larger than the size of the organic light emitting part.

11. The organic light emitting device of claim 1 , wherein the metal pattern provided at the edge of one side of the base includes a first metal pattern and a second metal pattern, the first metal pattern electrically connects the first electrode and an external power source, the second metal pattern electrically connects the second electrode and the external power source, and the first metal pattern and the second metal pattern are spaced apart from each other to be electrically short-circuited.

12. The organic light emitting device of claim 1 , wherein the sealing part further includes an anisotropic conductive film which bonds the printed circuit board and the substrate to each other.

13. The organic light emitting device of claim 1 , wherein the organic light emitting device further includes an anisotropic conductive film provided at the edge of the one side of the base, and the sealing layer is provided in an area without the anisotropic conductive film on the one side of the base.

14. The organic light emitting device of claim 3 , wherein a material of the insulating layer is a polyimide-based resin.

15. The organic light emitting device of claim 1 , wherein the metal pattern is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.

16. The organic light emitting device of claim 1 , wherein the substrate is a glass substrate or a plastic substrate.

17. The organic light emitting device of claim 1 , wherein the thickness of the printed circuit board is 20 μm to 200 μm.

18. The organic light emitting device of claim 1 , wherein the thickness of the sealing layer is 10 μm to 50 μm.

19. The organic light emitting device of claim 1 , wherein the sealing layer is an adhesive including a getter.

20. The organic light emitting device of claim 1 , wherein the organic light emitting device is a flexible organic light emitting device.

21. The organic light emitting device of claim 1 , wherein one or more light-scattering layers are further included in at least one of between the substrate and the first electrode and a surface facing a surface where the first electrode is provided.

22. A display device including the organic light emitting device according to claim 1 .

23. An illumination device including the organic light emitting device according to claim 1 .

24. A method for preparing an organic light emitting device, comprising:
forming an organic emitting part by sequentially laminating a first electrode, an organic material layer, and a second electrode on a substrate; and
installing a sealing part covering an outside of the organic emitting part of the substrate,
wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base, and a sealing layer filling a space between the printed circuit board and the outside of the organic emitting part,
wherein the base is formed directly on the sealing layer.

25. The method of claim 24 , wherein the printed circuit board includes one or more metal patterns.

26. The method of claim 24 , wherein the printed circuit board includes an insulating layer provided on at least one of between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.

27. The method of claim 24 , wherein the printed circuit board is a flexible printed circuit board.

28. The method of claim 24 , wherein in the installing of the sealing part, the printed circuit board and the substrate are bonded to each other by an anisotropic conductive film.

29. The method of claim 24 , wherein the sealing part further includes a metal plate which is positioned at the center of one side of the base and is not connected with the metal pattern.

30. The method of claim 29 , wherein the metal plate is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.

31. A structure of a printed circuit board, comprising:
a base;
a metal pattern provided at an edge of one side of the base,
a sealing layer provided directly on the base; and
an anisotropic conductive film provided at an edge of the other side of the base,
wherein the sealing layer is provided in an area without the anisotropic conductive film on the other side of the base.

32. The structure of claim 31 , wherein the metal pattern includes one or more metal patterns.

33. The structure of claim 32 , wherein the printed circuit board includes an insulating layer provided on at least one of between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.

34. The structure of claim 31 , wherein the structure of the printed circuit board is a structure of a flexible printed circuit

Assignees

• Lg Display Co Ltd

Inventors

• Choi Junrye
• Lee Jung Hyoung
• Kim Jihee

Classifications

• H10K2102/311

  Flexible OLED · CPC title

• F21Y2115/15

  Organic light-emitting diodes [OLED] · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/10

  OLED displays · CPC title