Interposer with beyond reticle field conductor pads

Patent metadata

Field	Value
Publication number	US-9806014-B2
Application number	US-201615007791-A
Country	US
Kind code	B2
Filing date	Jan 27, 2016
Priority date	Jan 27, 2016
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.

First claim

What is claimed is:

1. An apparatus, comprising:
an interposer having a first side and a second side opposite the first side, the first side having a first reticle field and a second reticle field larger than the first reticle field;
plural conductor pads on the first side in the first reticle field; and
plural dummy conductor pads on the first side in the second reticle field and outside the first reticle field.

2. The apparatus of claim 1 , comprising a passivation structure on the first side, the dummy conductor pads being positioned on the passivation structure.

3. The apparatus of claim 2 , wherein the plural conductor pads project through the passivation structure.

4. The apparatus of claim 1 , comprising a first semiconductor chip positioned on the first side and connected to at least one of the dummy conductor pads.

5. The apparatus of claim 4 , wherein the first semiconductor chip is connected to at least one of the plural conductor pads.

6. The apparatus of claim 1 , wherein the second side includes the second reticle field and plural conductor pads positioned in the second reticle field outside the first reticle field.

7. The apparatus of claim 6 , wherein the second side includes at least one metal trace having at least a portion positioned in the second reticle field and outside the first reticle field.

8. The apparatus of claim 1 , comprising an electronic device, the interposer being mounted in the electronic device.

9. A semiconductor wafer, comprising:
plural interposers; and
each of the interposers having a first side and a second side opposite the first side, the first side having a first reticle field and a second reticle field larger than the first reticle field, plural conductor pads on the first side in the first reticle field and plural dummy conductor pads on the first side in the second reticle field and outside the first reticle field.

10. The semiconductor wafer of claim 9 , wherein each first side includes a passivation structure, the dummy conductor pads being positioned on the passivation structure.

11. The semiconductor wafer of claim 10 , wherein the plural conductor pads project through the passivation structure.

12. The semiconductor wafer of claim 9 , comprising a first semiconductor chip positioned on each of the first sides and connected to at least one of the dummy conductor pads.

13. The semiconductor wafer of claim 12 , wherein each of the first semiconductor chips is connected to at least one of the plural conductor pads.

14. The semiconductor wafer of claim 9 , wherein each of the second sides includes the second reticle field and plural conductor pads positioned in the second reticle field outside the first reticle field.

15. The semiconductor wafer of claim 14 , wherein each of the second side includes at least one metal trace having at least a portion positioned in the second reticle field and outside the first reticle field.

Assignees

• Alfano Michael S
• Black Bryan
• Su Michael Z
• Siegel Joseph R
• Din Julius E
• Kashem Anwar
• Advanced Micro Devices Inc

Inventors

• Alfano Michael S
• Black Bryan
• Su Michael Z
• Siegel Joseph R
• Din Julius E
• Kashem Anwar

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/698

  Semiconductor materials that are electrically insulating, e.g. undoped silicon · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/635

  Through-vias · CPC title