Ceramic electronic component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9805865-B2
Application number	US-201113287227-A
Country	US
Kind code	B2
Filing date	Nov 2, 2011
Priority date	Jun 2, 2008
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

First claim

What is claimed is:

1. A ceramic electronic component comprising:
a ceramic element assembly including a first end surface and a second end surface that are mutually opposite to one another;
an external electrode arranged on a surface of the ceramic element assembly and including a sintered metal, the external electrode including a first external electrode that covers the first end surface and a second external electrode that covers the second end surface; and
a metal terminal electrically connected to the external electrode and including a plurality of filament-shaped terminal portions disposed substantially in parallel to each other; wherein
the external electrode and the metal terminal are directly diffusion-bonded to one another at a plurality of locations by diffusion of metal in the metal terminal into the external electrode; and
when viewed in a direction perpendicular to at least one of the first and second end surfaces, an overlapping area where the at least one of the first and second end surfaces and the metal terminal overlap each other covers a majority of the at least one of the first and second end surfaces.

2. The ceramic electronic component according to claim 1 , wherein
the metal terminal includes a terminal body, a lower plating film disposed on the terminal body, and an upper plating film disposed on the lower plating film;
each of the terminal body and the lower plating film includes at least one of Ni, Fe, Cu, Ag, Cr, or an alloy containing at least one of Ni, Fe, Cu, Ag, and Cr as a main component; and
the upper plating film includes at least one of Sn, Ag, Au, or an alloy containing at least one of Sn, Ag, and Au as a main component.

3. The ceramic electronic component according to claim 1 , wherein
the metal terminal includes a terminal body and a plating film disposed on the terminal body; and
the external electrode includes at least one of Cu, Ni, Ag, Pd, or an alloy containing at least one of Cu, Ni, Ag, and Pd as a main component.

4. The ceramic electronic component according to claim 2 , wherein
a thickness of the terminal body is about 0.1 mm to about 0.5 mm;
a thickness of the lower plating film is about 1.0 μm to about 5.0 μm; and
a thickness of the upper plating film is about 1.0 μm to about 5.0 μm.

5. The ceramic electronic component according to claim 1 , further comprising an anti-corrosion film arranged to cover an exposed portion of an outer surface of the external electrode.

6. The ceramic electronic component according to claim 1 , wherein the metal terminal includes a first metal terminal electrically connected to the first external electrode and a second metal terminal electrically connected to the second external electrode.

7. The ceramic electronic component according to claim 1 , wherein a surface of the external electrode is not covered with a plating film.

8. A ceramic electronic component; comprising:
a ceramic element assembly including a first end surface and a second end surface that are mutually opposite to one another;
an external electrode arranged on a surface of the ceramic element assembly and including a sintered metal, the external electrode including a first external electrode that covers the first end surface and a second external electrode that covers the second end surface; and
a metal terminal electrically connected to the external electrode and including a plurality of filament-shaped terminal portions disposed substantially in parallel to each other; wherein
the sintered metal is exposed at a surface of the external electrode;
the external electrode and the metal terminal are directly diffusion-bonded to one another at a plurality of locations by diffusion of metal in the metal terminal into the external electrode; and
when viewed in a direction perpendicular to at least one of the first and second end surfaces, an overlapping area where the at least one of the first and second end surfaces and the metal terminal overlap each other covers a majority of the at least one of the first and second end surfaces.

9. The ceramic electronic component according to claim 8 , wherein
the metal terminal includes a terminal body, a lower plating film disposed on the terminal body, and an upper plating film disposed on the lower plating film;
each of the terminal body and the lower plating film includes at least one of Ni, Fe, Cu, Ag, Cr, or an alloy containing at least one of Ni, Fe, Cu, Ag, and Cr as a main component; and
the upper plating film includes at least one of Sn, Ag, Au, or an alloy containing at least one of Sn, Ag, and Au as a main component.

10. The ceramic electronic component according to claim 8 , wherein
the metal terminal includes a terminal body and a plating film disposed on the terminal body; and
the external electrode includes at least one of Cu, Ni, Ag, Pd, or an alloy containing at least one of the metals as a main component.

11. The ceramic electronic component according to claim 9 , wherein
the terminal body includes an Fe-42Ni alloy or an Fe-18Cr alloy;
the lower plating film includes Ni; and
the upper plating film includes Sn.

12. The ceramic electronic component according to claim 10 , wherein the external electrode includes Cu.

13. The ceramic electronic component according to claim 9 , wherein
a thickness of the terminal body is about 0.1 mm to about 0.5 mm;
a thickness of the lower plating film is about 1.0 μm to about 5.0 μm; and
a thickness of the upper plating film is about 1.0 μm to about 5.0 μm.

14. The ceramic electronic component according to claim 8 , further comprising an anti-corrosion film arranged to cover an exposed portion of an outer surface of the external electrode.

15. The ceramic electronic component according to claim 8 , wherein the metal terminal includes a first metal terminal electrically connected to the first external electrode and a second metal terminal electrically connected to the second external electrode.

16. The ceramic electronic component according to claim 8 , wherein a surface of the external electrode is not covered with a plating film.

Assignees

• Otsuka Hideki
• Yoshida Kazuhiro
• Sonoyama Jun
• Itagaki Yoji
• Nakata Akihiko
• Murata Manufacturing Co

Inventors

• Otsuka Hideki
• Yoshida Kazuhiro
• Sonoyama Jun
• Itagaki Yoji
• Nakata Akihiko

Classifications

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• Y10T29/43

  Electric condenser making · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H05K3/3426

  characterised by the leads · CPC title