Halogen-free crosslinked resin composition and insulated wire and cable using the same

US9805840B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9805840-B2
Application numberUS-201314084364-A
CountryUS
Kind codeB2
Filing dateNov 19, 2013
Priority dateNov 20, 2012
Publication dateOct 31, 2017
Grant dateOct 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A halogen-free crosslinked resin composition includes a base polymer including as a main component (a) an ethylene vinyl acetate copolymer and (b) an acid modified polyolefin resin having a differential scanning calorimetry glass transition temperature Tg of not higher than −55 degrees Celsius in a mass ratio (a):(b) of 70:30 to 100:0, the base polymer including 50 to 70% by mass of vinyl acetate, 0.5 to 10 parts by mass of a silicone rubber with respect to 100 parts by mass of the base polymer, and 100 to 250 parts by mass of a metal hydroxide with respect to 100 parts by mass of the base polymer.

First claim

Opening claim text (preview).

What is claimed is: 1. A halogen-free crosslinked resin composition, consisting of: a base polymer including as a main component (a) an ethylene vinyl acetate copolymer and (b) an acid modified polyolefin resin having a differential scanning calorimetry glass transition temperature Tg of not higher than −55 degrees Celsius in a mass ratio (a):(b) of 70:30 to 90:10, the base polymer including 50 to 70% by mass of vinyl acetate; 0.5 to 10 parts by mass of a silicone rubber with respect to 100 parts by mass of the base polymer; and 100 to 250 parts by mass of a metal hydroxide with respect to 100 parts by mass of the base polymer, wherein the acid modified polyolefin resin has a melting point of not more than 90 degrees Celsius. 2. The halogen-free crosslinked resin composition, according to claim 1 , wherein the ethylene vinyl acetate copolymer comprises two or more kinds of ethylene vinyl acetate copolymers which are different in melt mass flow rate, and wherein 5% to 20% by mass of the ethylene vinyl acetate copolymer has a melt mass flow rate of not less than 15 g/10 min. 3. The halogen-free crosslinked resin composition, according to claim 1 , wherein 5% to 20% by mass of the ethylene vinyl acetate copolymer has a melt mass flow rate of not less than 15 g/10 min. 4. The halogen-free crosslinked resin composition, according to claim 1 , wherein the ethylene vinyl acetate copolymer comprises two or more kinds of ethylene vinyl acetate copolymers which are different in melt mass flow rate, and wherein 5% to 15% by mass of the ethylene vinyl acetate copolymer has a melt mass flow rate of not less than 15 g/10 min. 5. The halogen-free crosslinked resin composition, according to claim 1 , wherein the ethylene vinyl acetate copolymer comprises two or more kinds of ethylene vinyl acetate copolymers which are different in melt mass flow rate, and wherein 5% to 10% by mass of the ethylene vinyl acetate copolymer has a melt mass flow rate of not less than 15 g/10 min. 6. The halogen-free crosslinked resin composition, according to claim 1 , wherein the acid modified polyolefin resin comprises an acid modified compound of at least one of ultra-low density polyethylene, ethylene methyl acrylate copolymer, ethylene ethyl acrylate copolymer, ethylene-butene-1 copolymer, ethylene-hexene-1 copolymer, and ethylene-octene-1 copolymer. 7. The halogen-free crosslinked resin composition, according to claim 6 , wherein an acid that is used in the acid modified polyolefin resin comprises one of maleic acid, maleic anhydride, and fumaric acid. 8. The halogen-free crosslinked resin composition, according to claim 1 , wherein an acid that is used in the acid modified polyolefin resin comprises one of maleic acid, maleic anhydride, and fumaric acid. 9. The halogen-free crosslinked resin composition, according to claim 1 , wherein the silicone rubber is in a range from 0.5 to 7.5 parts by mass with respect to 100 parts by mass of the base polymer. 10. The halogen-free crosslinked resin composition, according to claim 1 , wherein the silicone rubber is in a range from 0.5 to 5 parts by mass with respect to 100 parts by mass of the base polymer. 11. The halogen-free crosslinked resin composition, according to claim 10 , wherein the mass ratio (a):(b) is in a range from 80:20 to 90:10. 12. The halogen-free crosslinked resin composition, according to claim 1 , wherein the silicone rubber comprises one of dimethyl polysiloxane, methyl vinyl polysiloxane, and methyl phenyl polysiloxane. 13. The halogen-free crosslinked resin composition, according to claim 1 , wherein the metal hydroxide is in a range from 100 to 150 parts by mass of with respect to 100 parts by mass of the base polymer. 14. The halogen-free crosslinked resin composition, according to claim 1 , wherein the mass ratio (a):(b) is in a range from 80:20 to 90:10. 15. An insulated wire covered with an insulating layer comprising the halogen-free crosslinked resin composition according to claim 1 . 16. An insulated wire covered with an insulating layer comprising the halogen-free crosslinked resin composition according to claim 2 . 17. A cable comprising the insulated wire according to claim 15 . 18. A cable comprising the insulated wire according to claim 16 . 19. A cable covered with a sheath comprising the halogen-free crosslinked resin composition according to claim 1 . 20. A cable covered with a sheath comprising the halogen-free crosslinked resin composition according to claim 2 .

Assignees

Inventors

Classifications

  • Ethylene vinyl acetate copolymers · CPC title

  • Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00 · CPC title

  • silicones · CPC title

  • H01B3/446Primary

    from vinylacetals · CPC title

  • from other vinyl compounds · CPC title

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What does patent US9805840B2 cover?
A halogen-free crosslinked resin composition includes a base polymer including as a main component (a) an ethylene vinyl acetate copolymer and (b) an acid modified polyolefin resin having a differential scanning calorimetry glass transition temperature Tg of not higher than −55 degrees Celsius in a mass ratio (a):(b) of 70:30 to 100:0, the base polymer including 50 to 70% by mass of vinyl aceta…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01B3/446. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).