Method of forming a hermetically sealed fiber to chip connections

Patent metadata

Field	Value
Publication number	US-9804350-B2
Application number	US-201615091439-A
Country	US
Kind code	B2
Filing date	Apr 5, 2016
Priority date	Jul 6, 2012
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.

First claim

We claim:

1. An optical device, comprising:
a photonic-integrated chip on which an optical waveguide is formed, the photonic-integrated chip having a surface with a flat base surface and a chamfered surface adjacent to the base surface; and
an optical fiber assembly comprising an optical fiber having a flat terminating end surface and an adjacent chamfered surface, wherein the terminating end surface and the chamfered surface of the optical fiber are pre-activated in a plasma to create dangling bonds on the terminating end surface and the chamfered surface of the optical fiber which facilitate coupling with the optical waveguide,
wherein the terminating end surface of the optical fiber directly contacts the base surface of the photonic-integrated chip and the chamfered surface of the optical fiber matches and aligns with the chamfered surface of the photonic-integrated chip, thereby providing a hermetically sealed optical connection between the optical fiber and the optical waveguide formed in the photonic-integrated chip.

2. The optical device of claim 1 , wherein the optical fiber is connected to the optical waveguide using an inverted taper.

3. The optical device of claim 1 , wherein the chamfered surface of the photonic-integrated chip is pre-activated in the plasma.

4. The optical device of claim 1 , wherein the terminating end surface of the optical fiber is coupled to the base surface of the chip such that there are no gaps between the optical fiber and the chip.

5. The optical device of claim 1 , wherein the plasma is generated from a gas species containing at least one of: oxygen, hydrogen, nitrogen, ammonia, and argon.

6. The optical device of claim 1 , wherein the optical chip comprises an optical waveguide, and wherein the optical chip is coupled to the optical fiber such that the optical fiber forms at least one covalent bond directly with the optical waveguide.

7. The optical device of claim 6 , wherein the at least one covalent bond is a silicon-to-silicon covalent bond.

8. An optical device, comprising:
an optical fiber having a flat terminating end surface and an adjacent chamfered surface;
an optical chip having a surface with a flat base surface and a chamfered surface adjacent to the base surface,
wherein the optical fiber is coupled to the optical chip such that the terminating end surface of the optical fiber is connected to the base surface of the chip and the chamfered surface of the optical fiber matches and aligns with the chamfered surface of the optical chip,
wherein the optical fiber is pre-activated in a plasma to create dangling bonds on the terminating end surface and the chamfered surface of the optical fiber, and wherein the optical fiber forms at least one covalent bond directly with the optical chip.

9. The optical device of claim 8 , wherein the terminating end surface of the optical fiber and the adjacent chamfered surface include dangling bonds on the terminating end surface.

10. The optical device of claim 8 , wherein there are no gaps between the optical fiber and the chip surface.

11. The optical device of claim 8 , wherein the optical fiber and the chip surface form a hermetic seal.

12. The optical device of claim 8 , wherein the optical chip comprises an optical waveguide, and wherein the optical fiber forms at least one covalent bond directly with the optical waveguide.

13. The optical device of claim 12 , wherein the optical chip is coupled to the optical fiber such that the optical fiber forms a hermetic seal with the optical waveguide.

14. The optical device of claim 12 , wherein the at least one covalent bond is a silicon-to-silicon covalent bond.

Assignees

• Micron Technology Inc

Inventors

• Meade Roy
• Sandhu Gurtej

Classifications

• G02B6/12 Primary

  of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) · CPC title

• G02B6/262

  Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements · CPC title

• G02B6/305 Primary

  and having an integrated mode-size expanding section, e.g. tapered waveguide · CPC title

• G02B6/255

  Splicing of light guides, e.g. by fusion or bonding · CPC title

• G02B6/25 Primary

  Preparing the ends of light guides for coupling, e.g. cutting · CPC title