Alloy material, contact probe, and connection terminal

US9804198B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9804198-B2
Application numberUS-201314418964-A
CountryUS
Kind codeB2
Filing dateAug 2, 2013
Priority dateAug 3, 2012
Publication dateOct 31, 2017
Grant dateOct 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition.

First claim

Opening claim text (preview).

The invention claimed is: 1. An alloy material, consisting of: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, wherein the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition, and one of iridium (Ir), ruthenium (Ru) and a combination of Ir and Ru is further added in an amount of 0.01 at % to 0.05 at %. 2. The alloy material according to claim 1 , wherein Vickers hardness is HV 480 to 560 after heating at 300° C. to 450° C. and aging. 3. A conductive contact probe contacting with each of contact targets at both ends in a longitudinal direction, at least part of which is formed using an alloy material, consisting of: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, wherein the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition, and one of iridium (Ir), ruthenium (Ru) and a combination of Ir and Ru is further added in an amount of 0.01 at % to 0.05 at %. 4. The conductive contact probe according to claim 3 , consisting of: a first conductive plunger contacting with one of contact targets at one end; a second conductive plunger contacting with other one of the contact targets at the other end; and a coil spring arranged between the first plunger and the second plunger so as to elastically connect the first and the second plungers with each other, wherein at least one of the first plunger, the second plunger, and the coil spring consists of the alloy material. 5. The conductive contact probe according to claim 4 , wherein Vickers hardness is HV 480 to 560 after heating at 300° C. to 450° C. and aging. 6. The conductive contact probe according to claim 3 , wherein Vickers hardness is HV 480 to 560 after heating at 300° C. to 450° C. and aging. 7. A conductive connection terminal contacting with each of contact targets at both ends in a longitudinal direction, at least part of which is formed using an alloy material, consisting of: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, wherein the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition, and one of iridium (Ir), ruthenium (Ru) and a combination of Ir and Ru is further added in an amount of 0.01 at % to 0.05 at %. 8. The conductive connection terminal according to claim 7 , wherein Vickers hardness is HV 480 to 560 after heating at 300° C. to 450° C. and aging. 9. A conductive contact probe contacting with each of contact targets at both ends in a longitudinal direction, at least part of which is formed using an alloy material, comprising: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, wherein the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition, and one of iridium (Ir), ruthenium (Ru) and a combination of Ir and Ru is further added in an amount of 0.01 at % to 0.05 at %, and the conductive contact probe, comprising: a first conductive plunger contacting with one of contact targets at one end; a second conductive plunger contacting with other one of the contact targets at the other end; and a coil spring arranged between the first plunger and the second plunger so as to elastically connect the first and the second plungers with each other, wherein at least one of the first plunger, the second plunger, and the coil spring consists of the alloy material. 10. The conductive contact probe according to claim 9 , wherein Vickers hardness is HV 480 to 560 after heating at 300° C. to 450° C. and aging.

Assignees

Inventors

Classifications

  • containing copper · CPC title

  • Measuring or testing processes involving enzymes, nucleic acids or microorganisms (measuring or testing apparatus with condition measuring or sensing means, e.g. colony counters, C12M1/34); Compositions therefor; Processes of preparing such compositions · CPC title

  • Processes or devices for granulating materials {, e.g. fertilisers} in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic · CPC title

  • Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

  • Spring-loaded · CPC title

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What does patent US9804198B2 cover?
An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the…
Who is the assignee on this patent?
Yamamoto Precious Metal Co Ltd, Shinko Metal Prod, Nhk Spring Co Ltd
What technology area does this patent fall under?
Primary CPC classification C22C5/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).