Probe card for probing integrated circuits
US-9207259-B2 · Dec 8, 2015 · US
US9804195B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9804195-B2 |
| Application number | US-201515126897-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 13, 2015 |
| Priority date | Apr 1, 2014 |
| Publication date | Oct 31, 2017 |
| Grant date | Oct 31, 2017 |
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A contacting assembly, in particular an HF measuring tip, having a carrier, on which a conductor structure is arranged, wherein the conductor structure has, at a contact end, at least one contact element protruding from the carrier for electrically contacting at least one contact point of a test specimen, and wherein the conductor structure has at least one impedance converter, wherein the impedance converter has a conductor segment having a gradually tapered or expanding cross-section.
Opening claim text (preview).
Thus, having described the invention, what is claimed is: 1. A contacting assembly forming an HF measuring tip, comprising: a carrier on which a conductor structure is arranged; said conductor structure including, at a contact end, at least five contact elements projecting from the carrier for making electrical contact with at least one contact point of a device under test, and wherein the conductor structure has an impedance converter, wherein the impedance converter has a conductor segment with gradually narrowing or widening cross section, wherein, of the projecting contact elements, two of said at least five contact elements in the form of ground contact elements are connected with a ground conductor arranged on the carrier and three remaining contact elements are connected with the conductor segment, wherein the ground conductor runs, starting out from the contact end, to a connection end, and wherein the contact elements projecting from the carrier are alternatingly connected, electrically, with the ground conductor and with the conductor segment. 2. The contacting assembly of claim 1 , wherein the conductor segment is a conductor trace with gradually reducing or increasing width applied to a dielectric. 3. The contacting assembly of claim 2 wherein said dielectric includes a circuit board. 4. The contacting assembly of claim 2 , wherein the impedance converter comprises a Klopfenstein structure. 5. The contacting assembly of claim 4 , wherein at least in sections, the conductor segment runs in curves in the form of a meander or in a serpentine path. 6. The contacting assembly of claim 2 , wherein the conductor segment runs in a substantially linear path and preferably extends over more than 50%, or over 80% or more of the dimension of the carrier. 7. The contacting assembly of claim 2 , wherein the impedance converter is configured for impedance transformation over a frequency band from about 700 MHz to about 2.7 GHz, or from about 500 MHz to about 3 GHz, or from about 400 MHz to about 10 GHz, or from about 300 MHz to about 20 GHz. 8. The contacting assembly of claim 7 , wherein a ratio between the input impedance and the output impedance of the impedance converter, or a ratio between the input impedance and the output impedance of the conductor structure, or both, is of the relation 5:1, 1:5, 4:1, 1:4, 2:1 or 1:2. 9. The contacting assembly of claim 2 , wherein at least one contact element of said at least five contact elements is a spring-biased contact finger. 10. The contacting assembly of claim 2 , wherein the at least one ground conductor is formed on a surface of the carrier opposite to the conductor segment. 11. The contacting assembly of claim 1 , wherein the impedance converter comprises a Klopfenstein structure. 12. The contacting assembly of claim 1 , wherein at least in sections, the conductor segment runs in curves in the form of a meander or in a serpentine path. 13. The contacting assembly of claim 1 , wherein the conductor segment runs in a substantially linear path and preferably extends over more than 50%, or over 80% or more of the dimension of the carrier. 14. The contacting assembly of claim 1 , wherein the impedance converter is configured for impedance transformation over a frequency band from about 700 MHz to about 2.7 GHz, or from about 500 MHz to about 3 GHz, or from about 400 MHz to about 10 GHz, or from about 300 MHz to about 20 GHz. 15. The contacting assembly of claim 14 , wherein at least one of the input impedance at the contact end of the conductor structure is about 10Ω or about 12.5Ω, and the output impedance of the conductor structure at a connection end opposite the contact end is about 50Ω, or at least one of the input impedance at the contact end of the conductor structure is about 50Ω, and the output impedance of the conductor structure at a connection end opposite the contact end is about 10Ω or about 12.5 Ω. 16. The contacting assembly of claim 1 , wherein a ratio between the input impedance and the output impedance of the impedance converter, or a ratio between the input impedance and the output impedance of the conductor structure, or both, is of the relation 5:1, 1:5, 4:1, 1:4, 2:1 or 1:2. 17. The contacting assembly of claim 1 , wherein at least one contact element of said at least five contact elements is a spring-biased contact finger. 18. The contacting assembly of claim 1 , wherein the at least one ground conductor is formed on a surface of the carrier opposite to the conductor segment. 19. The contacting assembly of claim 1 , wherein the conductor structure includes a connecting element such as a coaxial plug connector, on a connection end opposite the contact end, wherein preferably a ground conductor of the contact structure is connected with an outer conductor of the plug conductor and the conductor segment of the contact structure is connected electrically with an inner conductor of the plug conductor.
High frequency probes · CPC title
Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits G01R31/002;} testing for short-circuits, discontinuities, leakage or incorrect line connection G01R31/50; checking computers {or computer components} G06F11/00; checking static stores for correct operation G11C29/00 {; testing receivers or transmitters of transmission systems H04B17/00}) · CPC title
Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks · CPC title
Input circuits therefor · CPC title
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