Aqueous primer composition for enhanced film formation and method of using the same

US9803089B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9803089-B2
Application numberUS-201615340475-A
CountryUS
Kind codeB2
Filing dateNov 1, 2016
Priority dateOct 4, 2013
Publication dateOct 31, 2017
Grant dateOct 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.

First claim

Opening claim text (preview).

What is claimed is: 1. A water-based primer composition that has a pH within the range of 6-8 and can be sprayed, the primer composition comprising: (i) 20-60 wt. % one or more epoxy resins; (ii) 2-30 parts curing agent, solely or in combination with one or more catalysts, per 100 parts of epoxy resin(s) in total; (iii) organosilane in an amount of 0.1 to 10 parts per 100 parts of water; (iv) 1-10 wt. % propylene carbonate; (v) 1-7 wt. % at least one chromate or non-chromate corrosion inhibitor; and (vi) water to provide 10%-25% solids. 2. The water-based primer composition of claim 1 further comprising 0.1-2 wt. % of an additive selected from: inorganic fillers in particulate form, pigments, dyes, and combinations thereof. 3. The water-based primer composition of claim 1 , wherein the organosilane has following general formula: wherein n is greater than or equal to 0; wherein X is selected from OH, OCH 3 , and OCH 2 H 5 ; wherein R 1 is CH═CH 2 , or or CH 2 —CH 2 —CH 2 —Y, wherein Y is selected from NH 2 , SH, OH, NCO, NH—CO—NH 2 , NH—(CH 2 ) 3 NH 2 , NH-Aryl, and wherein each R 2 is selected from alkyl, alkoxy, aryl, substituted aryl, and R 1 . 4. The water-based primer composition of claim 1 , wherein the curing agent is water-soluble, and without propylene carbonate, the pH of the primer composition would be higher. 5. The water-based primer composition of claim 1 , wherein the curing agent is selected from: amino triazine; polyamine; and dicyandiamide (DICY).

Assignees

Inventors

Classifications

  • performed by spraying · CPC title

  • Application of adhesive · CPC title

  • C09J5/02Primary

    involving pretreatment of the surfaces to be joined · CPC title

  • characterised by using adhesives · CPC title

  • Aluminium · CPC title

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What does patent US9803089B2 cover?
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially sm…
Who is the assignee on this patent?
Cytec Ind Inc
What technology area does this patent fall under?
Primary CPC classification C09J5/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).