Ink jet print head

Patent metadata

Field	Value
Publication number	US-9802410-B2
Application number	US-201213556389-A
Country	US
Kind code	B2
Filing date	Jul 24, 2012
Priority date	Jun 6, 2008
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.

First claim

What is claimed is:

1. An ink jet print head comprising:
a printing element substrate which has printing elements producing energy for ink ejection, the printing elements being arrayed in a longitudinal direction, the printing element substrate having two main surfaces, with a bonding plane disposed on one main surface and the printing elements being disposed on the other, opposite main surface;
a supporting member having a support surface thereof on which to support said printing element substrate, a supply path for supplying ink to said printing element substrate, and raised portions having flat top surfaces being provided on a part of the support surface, the supply path having two longitudinal sides extending parallel to the longitudinal direction and two end sides extending in a short-side direction orthogonal to the longitudinal direction and connecting the two longitudinal sides, the raised portions being provided along a portion of, but not along the entirety of, at least one of the two longitudinal sides of the supply path and being not provided along either of the two end sides of the supply path; and
an adhesive to bond said printing element substrate and said supporting member by being present between 1) the bonding plane of said printing element substrate and 2) the support surface,
wherein a thickness of said adhesive between the flat top surfaces of the raised portions and the bonding plane of said printing element substrate is less than a thickness of said adhesive between the support surface, other than at the parts of the support surface on which the raised portions are provided, and the bonding plane of said printing element substrate.

2. The ink jet print head according to claim 1 , wherein said adhesive comprises a thermosetting adhesive.

3. An ink jet print head comprising:
a printing element substrate which has printing elements producing energy for ink ejection, the printing elements being arrayed in a longitudinal direction, the printing element substrate having two main surfaces, with a bonding plane disposed on one main surface and the printing elements being disposed on the other, opposite main surface;
a supporting member having a support surface thereof on which to support said printing element substrate, a supply path for supplying ink to said printing element substrate, and raised portions having flat top surfaces being provided on a part of the support surface, the supply path having two longitudinal sides extending parallel to the longitudinal direction and two end sides extending in a short-side direction orthogonal to the longitudinal direction and connecting the two longitudinal sides, the raised portions being not provided along either of the two longitudinal sides of the supply path and being provided along the entirety of both end sides of the supply path; and
an adhesive to bond said printing element substrate and said supporting member by being present between 1) the bonding plane of said printing element substrate and 2) the support surface,
wherein a thickness of said adhesive between the flat top surfaces of the raised portions and the bonding plane of said printing element substrate is less than a thickness of said adhesive between the support surface, other than at the parts of the support surface on which the raised portions are provided, and the bonding plane of said printing element substrate.

Assignees

• Miyazaki Hirotaka
• Canon Kk

Inventors

• Miyazaki Hirotaka

Classifications

• B29K2083/00

  Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material · CPC title

• B29C66/9672

  involving special data inputs, e.g. involving barcodes, RFID tags · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• Y10T29/49133

  with component orienting · CPC title

• Y10T29/49401

  Fluid pattern dispersing device making, e.g., ink jet · CPC title