Raised fluid pass-through structure in print heads

Patent metadata

Field	Value
Publication number	US-9802408-B2
Application number	US-201514629877-A
Country	US
Kind code	B2
Filing date	Feb 24, 2015
Priority date	Feb 24, 2015
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

First claim

What is claimed is:

1. A print head, comprising:
a circuit substrate having a hole, the circuit substrate having a raised structure formed from the circuit substrate such that the raised structure surrounds the hole, the raised structure and the hole forming a portion of a fluid path, the raised structure having only one interface requiring a seal against fluid leakage; and
a circuit on the circuit substrate, the circuit having traces and a hole corresponding to the hole in the circuit substrate;
wherein, the raised structure is positioned to separate the circuit from the fluid path.

2. The print head of claim 1 further comprising a transducer layer attached to the circuit.

3. The print head of claim 1 further comprising a jet stack attached to the transducer layer.

4. The print head of claim 1 , wherein the raised structure is positioned to join with an intermediate layer of a jet stack.

5. The print head of claim 1 , wherein the circuit comprises a flex circuit attached to the circuit substrate.

6. The print head of claim 5 , further comprising adhesive attaching the flex circuit to the circuit substrate.

7. A multi-layer structure having a fluid channel, comprising:
a circuit substrate having a hole, the circuit substrate having a raised structure formed from the circuit substrate such that the raised structure surroundsing the hole, the raised structure and the hole forming a portion of a fluid path, the raised structure having only one interface requiring a seal against fluid leakage; and
at least two layers on the circuit substrate having a hole corresponding to the hole in the circuit substrate such that the layers are sealed off from any fluid in the fluid path, wherein one of the layers is a circuit having electrically conductive traces.

8. The multi-layer structure of claim 7 , wherein the raised structure is positioned to to join with an intermediate layer of a jet stack.

Assignees

• Xerox Corp

Inventors

• Brick Jonathan R
• Freitag Chad D
• Jones Garry A
• Judge Jon G
• Koehler David R
• Slenes Chad J
• Nystrom Peter J
• Redding Gary D
• Cellura Mark A

Classifications

• B41J2002/14475

  characterised by nozzle shapes or number of orifices per chamber · CPC title

• B41J2/1632

  machining · CPC title

• B41J2/1433 Primary

  Structure of nozzle plates · CPC title

• B41J2/1626

  etching · CPC title

• B41J2/14072

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title