Module for a tire pressure monitoring system

Patent metadata

Field	Value
Publication number	US-9801289-B2
Application number	US-201514672362-A
Country	US
Kind code	B2
Filing date	Mar 30, 2015
Priority date	Mar 31, 2014
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A module includes a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess, a circuit board disposed in the recess; and an encapsulation mass, which closes the recess. A material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients, the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure, and at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure.

First claim

The invention claimed is:

1. A module comprising:
a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess;
a circuit board disposed in the recess; and
an encapsulation mass, which closes the recess,
wherein a material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients:
wherein the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure: and
wherein at least one of the sealing structure or the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure,
wherein the first partial housing and the second partial housing each include a cable feeding section, which the cable feeding sections are configured to introduce a flexible cable at least to the recess, and wherein the sealing structure and the counter-sealing structure are disposed on the cable feeding sections of the first partial housing and of the second partial housing respectively,
further comprising at least one partial cable provided for guiding a signal, the partial cable being indirectly or directly electrically connected to a contact terminal of the circuit board, the contact terminal being disposed on the circuit board, wherein in an area of the contact terminal on the surface of the circuit board, the circuit board includes no electrically conductive structures that are not directly electrically connected to the contact terminal.

2. The module according to claim 1 , wherein the sealing structure includes at least one elevation, or least one depression, or at least one elevation and at least one depression.

3. The module according to claim 2 , wherein the at least one elevation is asymmetric or the at least one depression is asymmetric or the at least one elevation and the at least one depression are asymmetric.

4. The module according to claim 1 , wherein the sealing structure includes a plurality of elevations disposed one-behind-the-other or a plurality of depressions disposed one-behind-the-other or a plurality of elevations and a plurality of depressions disposed one-behind-the-other.

5. The module according to claim 1 , wherein the area around the contact terminal extends on a main surface of the circuit board at least 3 mm in all directions beyond the contact terminal.

6. The module according to claim 1 , wherein the at least one partial cable has a curved section between a first reference point and a second reference point, wherein the first and the second reference points lie in a volume that is defined by the first housing part, the second housing part, and the encapsulation mass.

7. A tire pressure monitoring system including the module of claim 1 .

8. A module comprising:
a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess;
a circuit board disposed in the recess; and
an encapsulation mass, which closes the recess,
wherein a material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients:
wherein the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure: and
wherein at least one of the sealing structure or the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure, and
wherein the first partial housing and the second partial housing each include a cable feeding section, which the cable feeding sections are configured to introduce a flexible cable at least to the recess, and wherein the sealing structure and the counter-sealing structure are disposed on the cable feeding sections of the first partial housing and of the second partial housing respectively,
and further comprising at least one partial cable provided for guiding a signal, the partial cable being indirectly or directly electrically connected to a contact terminal of the circuit board,
wherein the at least one partial cable comprises a sheath materially-bonded with at least one of the first partial housing, the second partial housing, and the encapsulation mass.

9. The module according to claim 8 , wherein the sealing structure includes at least one elevation, or least one depression, or at least one elevation and at least one depression.

10. The module according to claim 9 , wherein the at least one elevation is asymmetric or the at least one depression is asymmetric or the at least one elevation and the at least one depression are asymmetric.

11. The module according to claim 8 , wherein the sealing structure includes a plurality of elevations disposed one-behind-the-other or a plurality of depressions disposed one-behind-the-other or a plurality of elevations and a plurality of depressions disposed one-behind-the-other.

12. The module according to claim 8 , wherein the area around the contact terminal extends on a main surface of the circuit board at least 3 mm in all directions beyond the contact terminal.

13. The module according to claim 8 , wherein the at least one partial cable has a curved section between a first reference point and a second reference point, wherein the first and the second reference points lie in a volume that is defined by the first housing part, the second housing part, and the encapsulation mass.

14. A tire pressure monitoring system including the module of claim 8 .

15. A module comprising:
a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess;
a circuit board disposed in the recess; and
an encapsulation mass, which closes the recess,
wherein a material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients:
wherein the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure: and
wherein at least one of the sealing structure or the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure, and
wherein the first partial housing and the second partial housing each include a cable feeding section, which the cable feeding sections are configured to introduce a flexible cable at least to the recess, and wherein the sealing structure and the counter-sealing structure are disposed on the cable feeding sections of the first partial housing and of the second partial housing respectively,
and further comprising at least one partial cable provided for guiding a signal, the partial cable being indirectly or directly electrically connected to a contact terminal of the circuit board,
wherein the at least one partial cable comprises a sheath melted onto at least one of the first partial housing, the second partial housing, and the encapsulation mass.

16. The module according to claim 15 , wherein the sealing structure includes at least one elevation, or least one depression, or at least

Assignees

• Biegner Johannes
• Graf Jens
• Verhulst Laurens
• Skf Ab

Inventors

• Biegner Johannes
• Graf Jens
• Verhulst Laurens

Classifications

• B60C23/0496

  Valve stem attachments positioned outside of the tyre chamber · CPC title

• H05K5/065

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title

• B60C23/0486

  comprising additional sensors in the wheel or tyre mounted monitoring device, e.g. movement sensors, microphones or earth magnetic field sensors · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• B60C23/0498 Primary

  for rim attachments (B60C23/0494, B60C23/0496 take precedence) · CPC title