Bellows interconnect

Patent metadata

Field	Value
Publication number	US-9801277-B1
Application number	US-201414455772-A
Country	US
Kind code	B1
Filing date	Aug 8, 2014
Priority date	Aug 27, 2013
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

First claim

What is claimed is:

1. An interconnect comprising a stress relieving member configured to interface between an electronic component hosting substrate and a PCB board, wherein the stress relieving member includes a bellows structure and a layer of metal on the bellows structure.

2. The interconnect of claim 1 , wherein the stress relieving member comprises a substantially cylindrical structure.

3. The interconnect of claim 1 , wherein the stress relieving member comprises a cylindrical bellows structure.

4. The interconnect of claim 1 , wherein the stress relieving member is configured to reduce a stress.

5. The interconnect of claim 4 , wherein the stress comprises a CTE (coefficient of thermal expansion) mismatch between the substrate and the PCB board.

6. The interconnect of claim 4 , wherein the stress comprises a strain that is caused by a physical movement.

7. The interconnect of claim 6 , wherein the physical movement comprises shocking, vibration, translational movement, or a combination thereof.

8. A method of forming an interconnect comprising placing a stress relieving member between an electronic component hosting substrate and a PCB board, wherein the stress relieving member includes a bellows structure and a layer of metal on the bellows structure.

9. The method of claim 8 , wherein the bellows structure comprises a cylindrical structure.

10. The method of claim 8 , further comprising forming the bellows structure on a cylindrical object.

11. The method of claim 10 , wherein the cylindrical object comprises a water soluble polymer.

12. The method of claim 10 , wherein the cylindrical object comprises a metal.

13. The method of claim 12 , wherein the metal comprises aluminum, nickel, or a combination thereof.

14. The method of claim 10 , further comprising dissolving the cylindrical object.

15. The method of claim 8 , further comprising soldering the stress relieving member to the substrate.

16. The method of claim 8 , further comprising compressing the interconnect by a clamping force.

17. A method of forming an interconnect for electronic components comprising:
a. forming a mandrel with a cylindrical bellows structure using a cylindrical object;
b. electroplating a layer of metal on the mandrel;
c. dissolving the mandrel, such that a connecting member with a cylindrical bellows structure is formed; and
d. soldering the connecting member to substrate of the electronic components.

18. The method of claim 17 , wherein the cylindrical object comprises a water soluble polymer.

19. The method of claim 17 , wherein the cylindrical object comprises a metal.

20. The method of claim 17 , wherein the metal comprises aluminum, nickel, or a combination thereof.

Assignees

• Flextronics Ap Llc

Inventors

• Liu Weifeng
• Feng Zhen
• Mohammed Anwar
• Geiger David
• Kurwa Murad

Classifications

• Y10T29/49169

  Assembling electrical component directly to terminal or elongated conductor · CPC title

• H05K3/3426 Primary

  characterised by the leads · CPC title

• H05K3/34

  by soldering · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K1/038

  Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title