Heat spreaders with integrated preforms

Patent metadata

Field	Value
Publication number	US-9799584-B2
Application number	US-201514942281-A
Country	US
Kind code	B2
Filing date	Nov 16, 2015
Priority date	Nov 16, 2015
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

First claim

What is claimed is:

1. A heat spreader, comprising:
a frame formed of a metal material, wherein the metal material includes a zinc alloy or an aluminum alloy;
a solid preform secured in the frame, wherein the solid preform has a thermal conductivity higher than a thermal conductivity of the metal material; and
a recess having at least one sidewall formed by the frame;
wherein the metal material has an equiaxed grain structure.

2. The heat spreader of claim 1 , wherein the solid preform includes boron nitride.

3. The heat spreader of claim 2 , wherein the solid preform includes pre-sintered cubic boron nitride.

4. The heat spreader of claim 2 , wherein the solid preform includes pre-sintered hexagonal boron nitride and has a face that is parallel to a majority orientation of basal planes of the pre-sintered hexagonal boron nitride.

5. The heat spreader of claim 1 , wherein the solid preform includes a material having an anisotropic thermal conductivity, the material has a highest thermal conductivity in a direction, and a face of the solid preform is parallel to the direction.

6. The heat spreader of claim 1 , wherein the solid preform includes synthetic diamond.

7. The heat spreader of claim 1 , further comprising:
a side pocket formed in the frame.

8. The heat spreader of claim 7 , wherein a sidewall and the side pocket are disposed on opposite faces of a projection of the frame.

9. The heat spreader of claim 1 , wherein the solid preform is enclosed within the frame.

10. The heat spreader of claim 1 , wherein the solid preform is a first solid preform and the heat spreader further comprises:
a second solid preform secured in the frame.

11. The heat spreader of claim 1 , wherein the recess is a first recess, and the heat spreader further comprises:
a second recess having at least one sidewall formed by the frame, wherein the second recess is adjacent to the first recess.

12. The heat spreader of claim 11 , wherein a depth of the first recess is different from a depth of the second recess.

13. A computing device, comprising:
a heat spreader, including:
a frame formed of a metal material, wherein the metal material includes a zinc alloy or an aluminum alloy,
a solid preform secured in the frame, wherein the solid preform has a thermal conductivity higher than a thermal conductivity of the metal material, and
a recess having at least one sidewall formed by the frame,
wherein the metal material has an equiaxed grain structure; and

an integrated circuit (IC) package disposed in the recess.

14. The computing device of claim 13 , further comprising an epoxy disposed between a surface of the IC package and a surface of the heat spreader.

15. The computing device of claim 13 , wherein:
the recess is a first recess;
the heat spreader further comprises a second recess having at least one sidewall formed by the frame, wherein the second recess is adjacent to the first recess;
the IC package is a first IC package; and
the computing device further comprises a second IC package disposed in the second recess.

16. The computing device of claim 13 , wherein the IC package includes a server processor.

Assignees

• Intel Corp

Inventors

• Antoniswamy Aravindha R
• Fitzgerald Thomas J

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W40/254

  Diamond · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title