Method for coating a substrate

Patent metadata

Field	Value
Publication number	US-9799554-B2
Application number	US-201615093834-A
Country	US
Kind code	B2
Filing date	Apr 8, 2016
Priority date	Apr 8, 2015
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A method for coating substrates provided with vias uses a first step in which the substrate is conditioned and a second step in which the substrate is coated with an electrically insulating material such that the vias are filled up completely.

First claim

The invention claimed is:

1. A method for coating a substrate provided with vias, wherein the following steps are carried out:
the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias;
the substrate is coated with the electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface, wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate.

2. The method of claim 1 wherein said conditioning step takes place at atmospheric pressure.

3. The method of claim 1 wherein said substrate is plasma-treated to condition it.

4. The method of claim 1 wherein said substrate is oxidised to condition it.

5. The method of claim 1 wherein a solvent is applied to the substrate to condition it.

6. The method of claim 5 wherein said substrate is subjected to a combination of a plasma-treatment and an application of a solvent.

7. The method of claim 5 wherein said substrate is subjected to a combination of an oxidation-treatment and an application of a solvent.

8. The method of claim 5 wherein said solvent is applied by spin-coating.

9. The method of claim 5 wherein said substrate provided with said solvent is introduced into a vacuum chamber, a pressure in said vacuum chamber being reduced, and said vacuum chamber being ventilated again after a holding time.

10. The method of claim 9 wherein said pressure in the vacuum chamber is reduced by 0.1 to 0.9 bar from an atmospheric pressure.

11. The method of claim 9 wherein said holding time is approximately 10 s to 60 s.

12. The method of claim 9 wherein said substrate is heated in said vacuum chamber.

13. The method of claim 12 wherein said substrate is heated to a temperature of >30° C.

14. The method of claim 5 wherein after said solvent has been applied, said substrate is transported into a different chamber, said substrate being coated within said different chamber with said electrically insulating material.

15. The method of claim 1 wherein said electrically insulating material is applied by spin-coating.

16. The method of claim 1 wherein said electrically insulating material is at least one of a dielectric, a resist and an epoxy resin.

17. The method of claim 1 wherein said electrically insulating material is cured after being applied.

18. A method for coating a substrate provided with vias, wherein the following steps are carried out:
the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias by applying a solvent to the substrate;
the substrate is coated with an electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface, wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate.

19. A method for coating a substrate provided with vias, wherein the following steps are carried out:
the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias by applying a solvent to the substrate;
the substrate is coated with an electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface,
wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate, and
wherein said substrate provided with said solvent is introduced into a vacuum chamber, a pressure in said vacuum chamber being reduced, and said vacuum chamber being ventilated again after a holding time.

Assignees

• Suss Microtec Lithography Gmbh

Inventors

• Fischer Katrin
• Palitschka Florian
• Southworth Darren Robert
• Whitney William

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P14/6514

  by exposure to a plasma · CPC title

• H10P14/6508

  by exposure to a liquid · CPC title

• H10P14/6342 Primary

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title